Nihon Denji Sokki Co., Ltd. (NDK)’s Post

We see an opportunity for disruption in the magnet fabrication industry, as labor-intensive two-step die-pressing systems currently dominate the production of high-performance magnets. Our single-step reduced isostatic pressure molds have already made significant progress toward an Industry 4.0 technology.   #FourthIndustrialRevolution #4IR #Industry4.0  #electricvehiclesarethefuture #emobility #electricdrives #electricvehicle #permanentmagnet #researchanddevelopment #engineeringsolutions #japanbusiness

🟢 🟩 Dive into the world of test socket guide plates micromachining for semiconductors testing industry ⚡ In the high-speed world of semiconductors, precision is everything. Our test socket guide plates micromachining services deliver unmatched accuracy and adaptability. Using advanced drilling, milling, and cutting techniques, we master the intricate geometries of semiconductor designs with exceptional accuracy 🎯 📌 Why Micromachining matters: Precision: Round holes of Ø 300 μm with a 350 μm pitch in Torlon and Vespel materials Speed: Cycle times as fast as 0.6 seconds Versatility: From Ø 200 μm to Ø 3.0 mm in various configurations At Posalux, we understand the challenges you might face in the semicon industry. 🔍 Got a project? Let’s achieve it together! Our results speak volumes ✔️ Go have a look on what we are able to achieve for you 👉

PI Debuts Highly Dynamic 4DOF Piezo Wafer Stage: See PI at SEMICON West, Booth #332   AUBURN, MA — PI’s newest wafer inspection solution is based on a hybrid kinematics design, combining Piezo-Walk motors and piezo stacks to achieve both long travel and highly dynamic, ultra-precise motion. This integrated 4-DOF solution reduces equipment complexity, integration efforts, costs, and risks.   Piezo-Walk motors are self-locking at rest, adding no servo dither and heat, unlike other motion techniques. The high bandwidth of the short-travel piezo stack actuators allows for dynamic tracking and error compensation of external disturbances (e.g., from long travel XY wafer stages). The 4DOF module can also correct for rotational wafer misalignment and takes wafer thickness and machine static characteristics into account. The high-stiffness design of the Tip-Tilt drive module provides extremely fast step and settle (

People say perfection doesn't exist, but measuring in microns is as close to perfect as you can get. Why settle for less than perfect? Perfection Plus is not just a privilege for specific industries—it's a requirement. That's why we use micron precision, today's smallest cutting measurement. To put it clearly, a micron is a unit of length equal to one millionth of a meter or one-thousandth of a millimeter.

LCA318T / LCA328T series tilt angle is a small-volume MEMS uniaxial tilt sensor developed by RION. ▶ KEY FEATURES 1.Single and biaxial inclination measurement    2.Any range within 360 ° is optional 3.Accuracy: 0.1 °                           4.Wide voltage input: 9~36V  5.Output mode: 4~20mA                    6.Wide temperature operation: -40～+ 85 ℃ 7.IP67 protection level                     8.High anti-vibration performance> 3500g 9.Resolution 0.02 °                       20.Small size 55 × 37 × 24mm (customizable) ★More information: https://lnkd.in/gvE-s9PX

In this video, Stackpole Electronics talks about the HCS Series of High Current Metal Alloy Shunt Resistors.

Application example: Bosch Multipoint Connector Part I - Component stiffness It is often not possible to use more complex material models in the context of initial estimative FE analyses. This article shows in a structured way how reduction factors ..... The complete blog post: https://lnkd.in/eiXpYgfp #partengineering #partsoftware #simulation #plasticsengineering

Under the scheme, identified sub-assemblies include camera modules, display assemblies, mechanical parts, battery packs, battery chargers, and vibrators

As an important structural/functional integrated material, advanced ceramics have unique properties that are irreplaceable. They have great application prospects in emerging strategic industries such as new energy vehicles and semiconductors, and play an indispensable role. Silicon nitride ceramic substrates are mainly used in the power units, semiconductor devices and inverters of pure electric vehicles (EVs) and hybrid electric vehicles (HEVs), and have huge market potential and application prospects. At present, the high thermal conductivity silicon nitride ceramic substrate materials for commercial applications require thermal conductivity ≥85 W/(m·K), bending strength ≥650MPa, and fracture toughness 5~7MPa·m1/2

Optocoupler application, Opto coupler, fast optocoupler, linear optocoupler