Obducat Group’s Post

𝗞𝗲𝘆 𝗮𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀 𝗼𝗳 𝘁𝗵𝗶𝗻 𝗳𝗶𝗹𝗺 𝗰𝗼𝗮𝘁𝗶𝗻𝗴𝘀 𝗶𝗻 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗺𝗮𝗰𝗵𝗶𝗻𝗲𝗿𝘆 From wafer handling systems to vacuum chambers, Ionbond’s thin film and Tribobond™ coatings play a vital role in semiconductor manufacturing: ⚙️ Smooth, low-friction surfaces for robotic arms and sliders 🛡️ Corrosion-resistant coatings for vacuum chambers ⚙️ Specialized barriers to minimize contamination Each solution is designed to maintain the clean, precise environments critical for high-tech production. Discover our tailored coating solutions here ➡ https://lnkd.in/grcaVU-5 #Ionbond #Semiconductor #CoatingSolutions #Coatings

𝗗𝗶𝘃𝗲 𝗶𝗻𝘁𝗼 𝗼𝘂𝗿 𝘄𝗵𝗶𝘁𝗲𝗽𝗮𝗽𝗲𝗿𝘀 𝘁𝗵𝗮𝘁 𝗿𝗲𝗱𝗲𝗳𝗶𝗻𝗲 𝗽𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲 𝗳𝗼𝗿 𝘆𝗼𝘂𝗿 𝘂𝗻𝗶𝗾𝘂𝗲 𝗮𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻 At Ionbond, we understand the critical role coatings play in improving the performance and longevity of tools and components. Our latest white papers provide valuable insights into how our innovative PVD, PACVD and CVD coating technologies can significantly improve your applications across a range of industries. Whether it's protecting moulds in high-pressure die casting, improving the efficiency of automotive components such as hydrogen combustion engines, or ensuring long-lasting aesthetics in decorative applications, our coatings provide the reliability you need. Find the relevant whitepaper for your..: ..decorative applications: https://lnkd.in/ghD8_Kzy ..forming & molding tools: https://lnkd.in/gN_2n49b ..industrial components: https://lnkd.in/g268q75k ..automotive components: https://lnkd.in/g_fr5tbd #ionbond #coatingsolutions #coatingstechnology

#Ceramic #vacuum #chuck is a tool for clamping and carrying in #semiconductor #wafer production. It has the characteristics of high flatness and parallelism, dense and uniform structure, high strength, good air permeability, uniform adsorption force, and easy trimming. It is suitable for thinning, cutting, grinding, cleaning and processing processes in semiconductor wafer manufacturing. It effectively solves many problems such as wafer imprints, chip electrostatic breakdown, and particle pollution. In practical applications, it achieves extremely high processing quality of semiconductor wafers. It is widely used in the manufacturing of semiconductor wafers such as #silicon, #sapphire, and #gallium arsenide.

Die Bonder stands out in the semiconductor industry due to its versatility, precision, and flexibility. It accommodates a wide range of die sizes and materials, ensuring precise positioning with high throughput and reliability. Advanced features like automatic alignment and process monitoring enhance efficiency, while its user-friendly interface makes it easy to operate. #DieBonding # Epoxy Bonding # Eutectic Bonding # FlipChipBonding #PrecisionEngineering #SemiconductorTech #TechInnovation #Manufacturing #TechUpgrade #IndustryLeaders #ManufacturingSolutions #EngineeringExcellence #Innovation #SmartManufacturing #AdvancedManufacturing #TechEvolution #IndustryInsights””

I love this video— give it a watch to learn more about the LCM technology!

Our #CircUits project partner, MacDermid Alpha Electronics Solutions is a global leader in high-performance electronics materials for circuit board fabrication, assembly, and semiconductor assembly. Their innovative products include advanced sinter technologies, solder pastes, solder preforms, soldering alloys, liquid soldering fluxes, adhesives, underfills, edgebonds, encapsulants, cored solder wire, electronic cleaners, and stencils. These materials provide connection and interconnection to circuitry and semiconductor components, as well as protection, reinforcement, and heat dissipation. Why they participate in CIRC-UITS? "The constant drive towards more sustainable electronics production and the recycling of used electronics has led to the development of new products leveraging our core competencies. Through the CIRC-UITS project, we contribute knowledge and expertise to help these materials reduce the manufacturing carbon footprint and enhance the recyclability of components." #Circuitsproject #HorizonEU #Sustainability #CircularEconomy

Discover the 𝗧-𝗦𝗠𝗜𝗟𝗦® 𝗟𝗮𝘀𝗲𝗿 𝗛𝗲𝗮𝘁𝗶𝗻𝗴 𝘀𝘆𝘀𝘁𝗲𝗺, featuring real-time temperature monitoring for precision! Based on semiconductor laser tech, it enhances 𝗰𝗼𝗻𝘁𝗿𝗼𝗹 and 𝗲𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝗰𝘆 in applications like 𝗽𝗹𝗮𝘀𝘁𝗶𝗰 𝘄𝗲𝗹𝗱𝗶𝗻𝗴. Dive into the article to explore its key features and impact on laser processing. 👉 Read more: https://lnkd.in/ePdJSGnJ #lasertechnology #TSMILS #RealTimeTemperatureControl

Blade dicing, a direct contact technique commonly used in semiconductor manufacturing, involves abrasive blades that can chip and damage brittle wafers, reducing yield. Our ZWLCT technology addresses this problem by eliminating the risk of product damage during dicing, ultimately enhancing your company's ROI. #Fonon #ZWLCT #bladedicing #semiconductor #wafer

Die Bonder stands out in the semiconductor industry due to its versatility, precision, and flexibility. It accommodates a wide range of die sizes and materials, ensuring precise positioning with high throughput and reliability. Advanced features like automatic alignment and process monitoring enhance efficiency, while its user-friendly interface makes it easy to operate. #DieBonding # Epoxy Bonding # Eutectic Bonding # FlipChipBonding #PrecisionEngineering #SemiconductorTech #TechInnovation #Manufacturing #TechUpgrade #IndustryLeaders #ManufacturingSolutions #EngineeringExcellence #Innovation #SmartManufacturing #AdvancedManufacturing #TechEvolution #IndustryInsights””

The constant drive for improvements in performance, reliability, and efficiency for electric vehicles (EVs) is fueled by swift progress in automotive technology. MacDermid Alpha Electronics Solutions brings innovative technology to the table, boosting #EV performance while also fostering the development of greener and more sustainable #automotive systems. “Due to the SiC module’s high-power density and higher operation temperature, package materials need many changes. For example, the substrates we normally use were from aluminum oxide and we have seen over the past few years a very big increase in the use of silicon nitride or aluminum nitride active metal brazes substrates. Wire bonding is also another possible evolution, with the replacement of aluminum wire to copper wire or using a clip to connect to the die top. Sealing materials change from silicone gel to epoxy molding (EMC). #Dieattach and package attach is already changing from #solder to #sinter joining. Still, the SiC dies adoption will enable a revolution for power module packages and EV inverters. This is why MacDermid Alpha has been putting together a full line of products for power electronics, from inverter metallization, passing through conformal coatings, thermal interface materials and a very complete panel of joints technologies like high reliability solder and sinter materials.” - Clark Dai, EV technology market manager Discover what else Clark has to say about how MacDermid Alpha is redefining the possibilities for OEMs in this interview article here: https://lnkd.in/eGzTWGG8