Whether the subject is hybrid bonding or 3D stacking and micro bumps, advanced packaging is a hot topic in today’s semiconductor industry. In a new podcast from 3D InCites, Françoise von Trapp interviews Onto Innovation’s Monita Pau and Jiangtao Hu about the arrival of front-end metrology challenges in the back-end of the process and how to address those challenges head on. To listen to this podcast, please visit: https://lnkd.in/gxZ7AHR6.
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The demand for innovative #advancedpackaging solutions is higher than ever as we see artificial intelligence pushing the boundaries of high-performance computing and chiplets further and further. Enter #glass substrates – a game-changer for the #semiconductor industry. In the latest 3D InCites podcast episode, Françoise von Trapp and Richard Noack discuss the future of glass in HPC and chiplet packaging. They share insights from our recent webinar, "Evolving HPC and Chiplet Packaging with Glass," diving deep into the motivation and trends driving this shift. Key topics include: - The need for collaboration across the glass ecosystem - Developing metrology solutions for transparent materials - Challenges like reliability data, aspect ratio issues, and standardization - The adaptability and flexibility of LPKF Laser & Electronics SE LIDE technology for glass microstructuring. Join us at ECTC 2024 to learn more about the maturity of LPKF LIDE technology, the solutions for glass based advanced packaging. Don’t miss this opportunity to meet Dr. Roman Ostholt and Richard Noack at Booth # 431 and catch the replay of the webinar — find the link in the comments... #LPKF #ECTC2024 #HPC #Chiplets #GlassSubstrates #Semiconductors #Innovation #TechConference #Webinar #AdvancedPackaging Stay tuned for more updates and see you in Denver!
🎤 NEW PODCAST EPISODE!🎤 It's been a while, but we're back with all new episodes! We've been talking a lot about #glasssubstrates with our community member, LPKF Laser & Electronics SE. You may have caught our recent webinar on the topic featuring E. Jan Vardaman, of; Venky Sundaram of 3D System Scaling, and Nils Anspach of LPKF. If you missed it, you'll want to listen to this recap discussion with Richard Noack. You'll learn about the remaining challenges of bringing glass to high-volume manufacturing and hear a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials. Listen here or wherever you get your podcasts: https://lnkd.in/gBTPiSc2
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#Embedded #MilAero What do wafer-thin nano membranes made from synthetic diamonds and open standards for next generation electronic systems have in common? Yep, you guessed it! This here podcast! This week David Jedynak (Curtiss-Wright) and I chat all about the past, present, and future of VITA standards. We also explore how VITA standards could be expanded into … Read More → "New Avenues for Open Standards: Expanding VITA into Broader Markets" https://lnkd.in/gQjVSuhv
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In the latest PCIM Podcast episode, Dominik Koch from the Universität Stuttgart discusses the challenges and future opportunities of GaN Semiconductor Modules. It is about the crucial role of packaging technology and the latest GaN transistor technologies. Sounds exciting to you? Then listen to the PCIM Podcast now: https://lnkd.in/eJZXQNuP 💡 You’d love to listen to a specific topic or speaker? Let us know: https://lnkd.in/egceFe6e #pcim #pcimpodcast #unistuttgart
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In today’s rapidly evolving industry, how does electronics manufacturing become adaptive AND sustainable? 💚🌱 The truth is in the details. In Post 3 of our Blog Series, “Sustainability in Electronics. Every Detail Matters” Alan Porter, Siemens Global VP, Electronics Industry, shows the way toward a people-centric and adaptive production ecosystem. And he offers you an invitation to a very special podcast - https://sie.ag/3prqVn #SustainableElectronics #SiemensBlogSeries #Siemens
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🚨 🎤 Check out the latest episode of the PCIM podcast, where our colleague Dominik Koch had the honor of discussing the challenges and future opportunities of GaN semiconductor technologies for power electronics! Universität Stuttgart #ILH #GaN #podcast #discussion #powerelectronics
In the latest PCIM Podcast episode, Dominik Koch from the Universität Stuttgart discusses the challenges and future opportunities of GaN Semiconductor Modules. It is about the crucial role of packaging technology and the latest GaN transistor technologies. Sounds exciting to you? Then listen to the PCIM Podcast now: https://lnkd.in/eJZXQNuP 💡 You’d love to listen to a specific topic or speaker? Let us know: https://lnkd.in/egceFe6e #pcim #pcimpodcast #unistuttgart
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Listen now: Our latest podcast episode about GaN Semiconductor Modules with the University of Stuttgart 🎧
In the latest PCIM Podcast episode, Dominik Koch from the Universität Stuttgart discusses the challenges and future opportunities of GaN Semiconductor Modules. It is about the crucial role of packaging technology and the latest GaN transistor technologies. Sounds exciting to you? Then listen to the PCIM Podcast now: https://lnkd.in/eJZXQNuP 💡 You’d love to listen to a specific topic or speaker? Let us know: https://lnkd.in/egceFe6e #pcim #pcimpodcast #unistuttgart
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In this episode of Circuit Break: A MacroFab Podcast, we dive deep into this often-overlooked corner of the electronics industry. We'll explore real-world examples of HMLV in action, from companies that order thousands of boards for prototyping to those in specialized industries like aerospace, where even a few units can be considered high-volume. We'll discuss the unique challenges of HMLV, such as managing a diverse range of components, navigating supply chain complexities, and balancing flexibility with efficiency. Check out the full article/podcast by MacroFab here: https://lnkd.in/ea7W96DV
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In today’s rapidly evolving industry, how does electronics manufacturing become adaptive AND sustainable? The truth is in the details. In Post 3 of our Blog Series, “Sustainability in Electronics. Every Detail Matters” Alan Porter, Siemens Global VP, Electronics Industry, shows the way toward a people-centric and adaptive production ecosystem. And he offers you an invitation to a very special podcast - https://sie.ag/3prqVn #SustainableElectronics #SiemensBlogSeries
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In today’s rapidly evolving industry, how does electronics manufacturing become adaptive AND sustainable? The truth is in the details. In Post 3 of our Blog Series, “Sustainability in Electronics. Every Detail Matters” Alan Porter, Siemens Global VP, Electronics Industry, shows the way toward a people-centric and adaptive production ecosystem. And he offers you an invitation to a very special podcast - https://sie.ag/3prqVn #SustainableElectronics #SiemensBlogSeries
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In today’s rapidly evolving industry, how does electronics manufacturing become adaptive AND sustainable? The truth is in the details. In Post 3 of our Blog Series, “Sustainability in Electronics. Every Detail Matters” Alan Porter, Siemens Global VP, Electronics Industry, shows the way toward a people-centric and adaptive production ecosystem. And he offers you an invitation to a very special podcast - https://sie.ag/3prqVn #SustainableElectronics #SiemensBlogSeries
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2moWhat a great conversation! I learned so much interviewing these two industry experts!