Onto Innovation’s Post

Whether the subject is hybrid bonding or 3D stacking and micro bumps, advanced packaging is a hot topic in today’s semiconductor industry. In a new podcast from 3D InCites, Françoise von Trapp interviews Onto Innovation’s Monita Pau and Jiangtao Hu about the arrival of front-end metrology challenges in the back-end of the process and how to address those challenges head on. To listen to this podcast, please visit: https://lnkd.in/gxZ7AHR6.

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Françoise von Trapp

Queen of 3D, 3D InCites; Community builder, blogger, podcaster, influencer

2mo

What a great conversation! I learned so much interviewing these two industry experts!

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