RAM Innovations’ Post

『CEP-M1000 モジュール分光感度測定装置』 波長依存性のない定エネルギー、定フォトンの単色光を太陽電池に照射し、各種太陽電池の分光感度特性、量子効率を測定する装置です。 CEP-M1000は、太陽電池モジュールの分光感度特性の評価を目的として産業技術総合研究所殿の技術指導により開発致しました。結晶系及び薄膜系単接合型太陽電池、多接合太陽電池などを対象としています。 https://lnkd.in/gKVKTjAS CEP-M1000 Module Spectral Response Measurement System This is a device to measure spectral response characteristics and quantum efficiency of various solar cells by irradiating monochromatic light of constant energy and constant photon, which is independent of wavelength, to solar cells. CEP-M1000 was developed under the technical guidance of the National Institute of Advanced Industrial Science and Technology (AIST) for the purpose of evaluating spectral response characteristics of solar cell modules. It is applicable to crystalline and thin-film single-junction solar cells and multi-junction solar cells.

🔋 #Lowpower mindset in action 🎬 Alan Tejeda Ramirez, Murata’s Field Application Engineer, shares how he helps customers evaluate different #cellular use cases to ensure proper battery consumption of devices using #Otii tools. Utilizing AT commands through Otii to see how modem is behaving is allowing customers to make informed decisions on how to optimize the energy efficiency of their end products. 🔋🫱🏼🫲🏽 How are you using #Otii to drive optimized and energy-efficient hardware technology? #LowPowerMindset

Check out this addition to our growing list of Success Cases and learn how VIVOTEK can help enhance efficiency, productivity, and security! #VivotekMoreThanJustGR8Cameras

The global RF Blocking Filters for Semiconductor Equipment market was valued at US$ 160 million in 2023 and is anticipated to reach US$ 295 million by 2030 witnessing a CAGR of 8.2% during the forecast period 20242030. #Semiconductor #RFBlockingFilters #SemiconductorEquipment #DCFilter #ACFilter #SemiconductorManufacturing #SemiconductorTesting #MarketGrowth #HighPerformance #TechnologicalAdvancements

Ti Pioneers New Magnetic Packaging Technology for Power Modules, Cutting Power Solution Size in Half. Texas Instruments today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. In fact, three of the six new devices, the TPSM82866A, TPSM82866C and TPSM82816, are the industry’s smallest 6A power modules, supplying an industry-leading power density of nearly 1A per 1mm2 of area. https://lnkd.in/gyYUtRUF Texas Instruments #TexasInstruments #MagPack #PowerModules #PowerDensity #ElectromagneticInterference #EfficientPower #PowerConversion #Semiconductors #EmbeddedSystems #HighPerformancePower #IndustrialElectronics #DataCenters #Miniaturization #PowerEfficiency #TechInnovation

Advanced Packaging Technology: The Race for Fan-Out Panel-Level Packaging Key Points: 1.Fan-out panel-level packaging (FOPLP) is an advanced packaging technology that redistributes semiconductor chips onto a large panel instead of using individual packages. 2.FOPLP offers greater flexibility, scalability, and cost-effectiveness compared to traditional packaging methods. 3.FOPLP is well-suited for emerging applications in power semiconductors, sensors, communications, and automotive electronics due to its high throughput and cost advantages. 4.The demand for automotive-grade chips is increasing due to the rise of electric vehicles, which will further drive the development of panel-level packaging technologies. 5.The growing demand for AIoT, 5G/6G, and intelligent driving ICs is driving the development of advanced packaging technologies, including FOPLP. Summary: Fan-out panel-level packaging (FOPLP) is an emerging packaging technology that is well-suited for a wide range of applications, including power semiconductors, sensors, communications, and automotive electronics. FOPLP offers several advantages over traditional packaging methods, including greater flexibility, scalability, and cost-effectiveness. As the demand for these applications continues to grow, FOPLP is expected to play an increasingly important role in the semiconductor industry. #FOPLP #advanced packaging #panel-level packaging #power #semiconductor #sensors #communications #automotive electronics #AIoT #5G #intelligent driving https://lnkd.in/gq-V3Zau

BPE-25 Constant-energy, constant-photon irradiation device The BPE-25 is a monochromatic light source that can irradiate monochromatic light of constant energy and constant photon energy with no wavelength dependence. It is ideal as an excitation light source for monochromatic light I-V measurement and fluorescence measurement of various samples for evaluation of solar cells and optical sensors. Irradiation wavelength (nm), irradiation energy (W/cm2), and number of irradiated photons (photon/cm2/s) can be set by software. https://lnkd.in/gSpuA2Xq

The High Tg (240℃) EMC for next generation SiC Power Modules is released. https://lnkd.in/gih4SGKh Please be informed that : [High Tg EMC for next-generation SiC power modules] The Tg (glass transition temperature) of epoxy resins varies depending on the type of resin, and although the Tg can be increased by improving the cross-link density of the resin, it is generally around 100°C to 200°C. The high Tg EMC for next-generation SiC power modules developed this time achieves a glass transition temperature of 240°C by rigidifying the main chain backbone of the resin in addition to the usual cross-link density improvement to raise the Tg of the epoxy resin, and furthermore by combining our unique resin formulation and filler The combination of our unique resin formulation and filler approach has enabled us to successfully develop new EMC. In addition, there is a general concern that a high Tg of epoxy resin may lead to a trade-off between hardness and brittleness of the resin, but this product, by optimising the type of curing agent that reacts with the epoxy resin, avoids hardness and brittleness as physical properties after curing, and has a stress relaxation performance that prevents defects during the assembly process of power modules. It has been confirmed that the product has stress-relaxation performance that does not cause defects during the power module assembly process. This article is generated by Machine Translation. #Tg240℃ #HighTg #PowerModule #SiC #EV #Inveter

SGA-25　サブギャップ光吸収スペクトル測定システム 一般的な透過分光測定では検出が出来ない微弱な半導体薄膜の欠陥光吸収を一定光電流法（CPM法）を用いて測定する装置です。 照射光量値より吸収係数を演算で求めます。 半導体薄膜や各種光伝導材料のバンドギャップ構造を解析できます。 吸収係数測定範囲は６桁とダイナミックレンジが広いです。  リアルタイムで光量を制御していますので、測定再現性に優れています。  In-Ga-Zn-O (IGZO）などの酸化物半導体の欠陥準位評価に最適です。   波長範囲は500～2100nm（0.59～2.48eV）と300～1200nm（1.03～4.13eV）の2種類から選択できます。 SGA-25 Subgap Optical Absorption Spectrum Measurement System The SGA-25 measures the optical absorption of defects in semiconductor thin films, which cannot be detected by general transmission spectroscopy, using the constant photocurrent method (CPM method). The absorption coefficient is calculated from the irradiated light intensity value. The band gap structure of semiconductor thin films and various photoconductive materials can be analyzed. The absorption coefficient measurement range is 6 digits and has a wide dynamic range. Excellent measurement reproducibility due to real-time control of light intensity. Ideal for evaluation of defect levels in oxide semiconductors such as In-Ga-Zn-O (IGZO).

JEDEC recently announced JEP198: Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices. This reflects the industry’s collective effort to ensure the consistent performance of GaN-based devices. PI celebrates this milestone while we remain steadfast in our mission to lead the way in defining reliability for this exciting new technology. Learn more here: https://okt.to/7ePAz4