SMACD’s Post

I’m thrilled to share that I have recently completed the “Winter Training: FinFET Physics and Modeling for Circuits Simulation” course offered by Siemens EDA (Siemens Digital Industries Software). The key topics are:  1- Technical review of MOSFET fabrication and design processes.  2- Exploring short-channel effects. 3- Mastery of different compact modeling techniques. 4- In-depth analysis of FinFET device physics and modeling.  5- Understanding FinFET parasitics. Special thanks to Dr. Amr Bayoumi, Eng. Abdallah Mohamed and Eng. Yasmen for supporting us throughout the course. This training experience has greatly contributed to my knowledge and skills in the area of semiconductor devices and CAD tools. #semicoductors #devices #modeling #Verilog #MOSFET #FinFET #CAD

These LGA (Land Grid Array) packages are produced using 3D-CSP (Chip Scale Packaging), relocating chip contacts beneath the chip to free up the surface for photonics or fluidic interfaces. In contrast to conventional packaging methods, 3D-CSP can replace bond wires on the top side of the chips, allowing for unrestricted access. #3Dprinting #LGA #3D-CSP info@microtec-d.com

In this comprehensive video series, we delve into the intricate details of Electromigration Analysis, a critical aspect of modern Analog and Digital VLSI designs. Electromigration, a phenomenon rooted in the physics of material transport, involves the gradual movement of ions within a conductor due to momentum transfer between conducting electrons and diffusing metal atoms. This analysis is typically conducted once the layout (GDSII) of a design is generated, allowing for the prediction and correction of potential circuit longevity issues. If left undetected, Electromigration can lead to performance degradation and eventual chip failure over time. Throughout the series, we focus on various factors influencing Electromigration, such as temperature, voltage, and frequency, exploring their effects on the phenomenon in detail. Topics covered include the basics of Electromigration, the physics behind it, failure prediction methodologies, detection techniques, and mitigation methods. Additionally, we delve into related concepts like IR-Drop and Ground Bounce, discussing their significance, analysis techniques, and mitigation strategies within the context of VLSI design. Through a structured approach and insightful discussions, this series equips viewers with a thorough understanding of these critical aspects, empowering them to address potential challenges effectively in their VLSI designs. URL : https://lnkd.in/dMVxeBtx #vlsi #physicaldesign #physicalverification #emir #electromigration #irdrop #groundbounce #vlsitutorial #techsimplifiedtv

🌟 Excited to share my progress on the 100 Days Amplifier Design challenge! Today, let's dive into the fascinating world of Integrated Circuit (IC) fabrication. Understanding how chips are made is essential for every circuit designer. Here's a distilled guide to the key steps in IC fabrication: 1. Semiconductor Physics: Delve into concepts like resistivity and band gaps, crucial for understanding silicon's behavior. 2. Doping: Learn how doping modifies silicon's electrical properties, enabling precise control of current flow. 3. PN Junctions: Explore the creation of PN junctions, fundamental for directing current within circuits. 4. Diode Fabrication: Discover how diodes are made through PN junction formation on silicon wafers. 5. Solar Cell and LED Fabrication: See how IC fabrication extends to solar cells and LEDs, showcasing practical applications. 6. Historical Context: Trace the evolution of ICs from germanium transistors to silicon integration. 7. Maskless Photolithography: Explore advancements like maskless photolithography, streamlining pattern projection onto wafers. 8. Wafer Preparation: Learn about the meticulous preparation of silicon wafers, crucial for subsequent processing. 9. Microscope Alignment: Understand the importance of precise alignment during fabrication for quality assurance. By grasping these concepts, circuit designers can enhance their skills and drive innovation in microelectronics. Let's embark on this journey together! #ICFabrication #CircuitDesign #100daysamplifierdesign Pipeloluwa Olayiwola

Leveling up VLSI one workshop at a time!🤖 Our VLSI Workshop: Design to Simulation, conducted by IETE-ISF CBIT, provided participants with valuable insights into the latest design and simulation techniques. From digital to analog and mixed-signal design, attendees gained hands-on experience and expanded their knowledge. #VLSI #Workshop #Design #Simulation #Tech #Education #IETEISFCBIT"

🚀 Excited to Share My Latest Project! 🚀 I've recently completed the simulation of a 6-Transistor (6T) SRAM cell using 90nm technology ✨✨                                                             📍 This SRAM cell is essential for high-speed, low-power memory storage, widely used in caches and registers.         📍 The cell features two cross-coupled inverters for data storage and two NMOS access transistors for efficient read/write operations.                                                                                                📍 With Cadence tools, I designed and simulated this cell, ensuring optimal performance and reliability.                          📍This project showcases the benefits of 90nm technology, including increased density and faster switching speeds. 🌟              📍Key Features:       Components: Two inverters (Q and Q̅) and two access transistors.       Operations: Efficient write/read via bit lines (BIT and BIT̅) and word line (WRITE).       Technology: Enhanced performance with 90nm scaling. Grateful for the opportunity to apply cutting-edge tools in digital design!                                                                                                      #VLSI                                                                                                     #SRAM                                                                                              #ChipDesign                                                                                            #Cadence                                                                                                       #90nmTechnology                                                                                         #DigitalDesign

Experience a trip into the world of semiconductor innovation by reading our most recent article, which reveals the finer points of differential amplifiers made with Cadence 90nm technology. 🍂 🍂 🍁 This investigation explores the core of contemporary circuit design and demonstrates the interaction of advanced production methods with precise engineering. 🍁 Learn about every aspect of differential amplifiers and how important they are for signal processing, amplification, and other applications. 🍁 The work provides a thorough understanding of the revolutionary potential of Cadence 90nm technology in influencing the development of electronic systems, from design considerations to performance optimization. Come along with me as we explore the cutting edge of semiconductor engineering, where each circuit signifies a new height in technical capability. 🙇♀️ 🙋♀️ #Cadence #vlsi #Differentialamp

I'm thrilled to share my project: 🚀"Characteristics of MOS Devices Utilizing SKY130 Process Design Kit with Xschem and Ngspice"🚀 🔍 Project Overview: In this project, I explored the fundamental characteristics of MOSFETs, specifically PMOS and NMOS transistors, using the SkyWater 130nm Process Design Kit (PDK). By designing circuits in Xschem and running detailed simulations with Ngspice, I gained valuable insights into the behavior of these transistors through their drain and transfer characteristics. Key Highlights: ⏩ Objective: To experimentally determine and analyze the drain and transfer characteristics of PMOS and NMOS transistors, and enhance understanding of CMOS circuits for advanced VLSI projects. Tools Used: ◻ SKY130PDK: Open-source 130nm Process Design Kit (PDK) for designing and simulating integrated circuits. ◻Xschem: Schematic capture tool for designing and analyzing circuits. ◻Ngspice: Simulation tool for validating circuit designs. Detailed Analysis: PMOS Circuit Analysis: ✔ Designed PMOS circuits in Xschem and simulated them with Ngspice to study transfer and drain characteristics. ✔Calculated key parameters like transconductance (gm) and output resistance (ro). NMOS Circuit Analysis: ✔Similar approach as PMOS, focusing on NMOS transistor characteristics. ✔Detailed examination of transfer and drain characteristics, with precise calculations of gm and ro. These analyses provide critical insights into the behavior and performance of MOSFETs, which are essential for designing more complex CMOS circuits in future projects. 📈 Future Directions: This foundational study is crucial for advancing my understanding of CMOS circuit design, paving the way for more sophisticated VLSI projects. For a detailed breakdown of each step and to view the simulation files, check out my GitHub repository. Feel free to connect with me to discuss more about this project or any exciting opportunities in the field of VLSI design! 🔗 GitHub Repository: https://lnkd.in/gAzTU_Fd #VLSI #CMOS #MOSFET #SkyWater130nm #Xschem #Ngspice #CircuitDesign #Semiconductor #Engineering #Electronics #Simulation #PDK

Check out our latest case study featuring a Multiphysics simulation-correlation exercise we worked on. The results were impressive and we were able to build a complete Multiphysics model involving circuit, EM and Thermal modelling to accurately predict temperatures at 200 seconds on an open loop test. View the page here: https://lnkd.in/en3wXsKe Download the PDF here: https://lnkd.in/eknUjHpb #simulation #EMsimulation #electromagnetics #electronics #multiphysics #COMSOL