SPINTEC’s Post

imec's BEOL metal interconnect roadmap with semi-damascene approach and air gaps down to A3 node: Imec proposes to gradually introduce subsequent generations of semi-damascene. Insertion of the first generation is envisioned for the imec A10 or A7 logic technology node, where the metal pitch of the most critical interconnects becomes as tight as 18nm. At that point in time, GAA nanosheet integration is expected to be mainstream and CFETs will not yet be in place. Introducing semi-damascene will therefore be the only major change that chip makers will have to cope with. Source: https://lnkd.in/dzNE_9_A #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf

Introducing 2D-material Based Devices in the Logic Scaling Roadmap: A new article in the latest issue of Semiconductor Digest describes imec's vision of a path from planar 2D-FETs to high-performance 2D-CFETs. New info from IEDM is included. https://lnkd.in/emGjcwgj #SemiDig #imec #semiconductors

imec qualifies Lam Research's dry resist (based on precursor from Entegris) for EUV direct-print 28nm pitch BEOL logic at 2nm and below More details at: https://lnkd.in/g77YmJjx If you would like to know more about Lam's dry resist technology, how it helps overcome LRS tradeoff in patterning, and how is it much better for the environment than the CAR Photoresist, here are some nice articles to go through: https://lnkd.in/gUJUyzZd https://lnkd.in/grKxSPph #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf #rapidus #esmc #ksmc #Korea #Japan #europe #Photoresist

3 new 200mm and 15 new 300mm fabs to be constructed in 2025, according to SEMI's latest quarterly World Fab Forecast report Link: https://lnkd.in/d467AhZv The majority of these fabs are expected to begin operations from 2026 to 2027. In 2025, the Americas and Japan are the leading regions with four projects each. The China and Europe & Middle East regions are each tied for third place with three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025. #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf #rapidus #esmc #ksmc #Korea #Japan #europe

New Report What can policymakers interested in protecting and promoting the next generation of emerging tech learn from the semiconductor industry? CSET report by John VerWey of Pacific Northwest National Laboratory takes a look at EUV lithography’s 30-year path to emergence: Extreme ultraviolet (EUV) lithography is the most important technology to have emerged out of the semiconductor industry in recent years. This report presents a case study of its development from the 1980s to the present. Using bibliometric data, this report details the evolution of the research community responsible for its development and the many scientific breakthroughs made on EUVs over a decades-long path to commercialization. The paper concludes with lessons learned for policymakers interested in protecting and promoting the next generation of emerging technologies. Download Full Report here: https://lnkd.in/dYxJKasQ

Beautiful TEM of a monolayer-MoS2 nanosheet FET with high-k and gate metal fully wrapped around the channel as presented at 2024 IEDM by imec Link: https://lnkd.in/dgVVwJ3d At 2024 IEDM, imec for the first time reported functional stacked nanosheet FETs with monolayer MoS2 channels deposited via layer transfer on 300mm target wafers. The device shows comparable Ion (~451 µA/µm) and record on-off ratio (>10^9) compared to state of the art. Learnings based on planar devices were used for critical module development, including the gate module. #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf #rapidus #esmc #ksmc #Korea #Japan #europe

New technical papers recently added to Semiconductor Engineering’s library https://lnkd.in/gdS-Rukr #semiconductor #EDA #FPGA #CIM #hardwaresecurity #ferroelectrics Rice University Berkeley Lab Massachusetts Institute of Technology Shengxi Huang Shelly Kelly #tellurene NVIDIA Chenhui Deng Yunsheng Bai Mark H. R. UCLA Georgia Institute of Technology Faaiq Waqar TSMC National Tsing Hua University Ashwin Lele Bo Zhang Jianming Tong Tianhao Huang Anirudh Itagi Cornell University Delft University of Technology Reinout Ubbink Yan B. Vogel Maarten Stam University of Cambridge Argonne National Laboratory ivar martin

imec's monolithic CFETs with 18nm gate length, 60nm gate pitch and 50nm vertical separation between n and p-FET, for A7 technology node Imec’s logic technology roadmap envisions the introduction of CFETs in A7 node device architectures. When complemented with advanced routing techniques, CFETs promise to reduce standard cell track heights from 5T to 4T and even below, without performance degradation. imec's proposed process flow includes two key CFET-specific modules: 1. middle-dielectric isolation (MDI) 2. stacked bottom and top contacts It is feasible to move the bottom contact formation to the wafer backside, despite additional process steps linked to wafer bonding and thinning. The top device survival rate increased from 11% to 79%, making backside bottom contact formation an attractive option for industry. Source: https://lnkd.in/dVY6aMXn #semiconductor #semiconductorindustry #tsmc #intel #samsung #imec #globalfoundries #smic #umc #innovation #ai #computerchips #machinelearning #broadcomm #transistor #cowos #skhynix #microntechnology #kioxia #nanya #toshiba #ymtc #yangtze #scaling #moore #manufacturing #production #fabrication #apple #nvidia #arm #amd #qualcomm #ibm #huawei #chip #chipdesign #chipmaker #memory #logic #cpu #processor #FEOL #BEOL #interconnects #dram #nand #3Dnand #nandflash #storage #asml #euv #lithography #zeiss #optics #reticle #photomask #anamorphic #metalorganic #photoresist #laser #trumpf #cfet #nanosheet #roadmap

The tiniest patterns on a microchip—smaller than a single nanometer—owe their existence to one groundbreaking company. Christopher Gannatti explains how ASML’s mastery of photolithography, particularly its groundbreaking EUV technology, has made it the linchpin of the global semiconductor industry: https://bit.ly/4gZas6c #ArtificialIntelligence #ASML

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