Workshop of Photonics | WOP’s Post

One of the most common inquiries we receive at #WOP is asking for #holes in #glass #wafers. The requirements for the shape, size, number of holes, glass type, wafer size, and thickness are of such great variety that every case is unique. Thankfully, we have a great video explaining all our capabilities once you need holes in glass. Here is a summary of the main specs: 💎 Variety of glasses – Corning, Schott, Hoya, AGC 💎 Wafer size – up to 200 mm x 200 mm (8”) 💎 Wafer thickness – from 30 μm to 10 mm 💎 Round, square, and other shapes through holes 💎 Straight hole cross-section | no taper 💎 ≤10 μm chipping > typ. none 💎 Smooth sidewalls, Ra<1 μm 💎 Typical min. hole size 20 μm (round) 💎 ±3 µm positional accuracy 💎 No debris on the back and front surface 💎 No sagging around the holes 💎 Aspect ratio up to 1:100 💎 High throughput and yield 💎 Ability to work with metalized glasses (e.g., Au, Pt, Ni, Cr, Mo) 💎 Minimal or no post-processing is needed However, if you need holes in the glass, just let us know 😎 #femtosecond #laserdrilling #glassdrilling #micromachining #holesinglass

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