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yieldWerx Semiconductor

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🔬 Root Cause Isolation: A Key to Targeted Defect Management 🔍 Root cause isolation focuses on pinpointing defect sources, enabling process engineers to address issues precisely. This process has two phases: (1) prioritizing defect types using consistent detection and classification, often visualized through defect paretos. (2) isolating the defect source by analyzing data from equipment monitoring, sensor feedback, and historical defect records. Techniques like laser-based localization, time-domain reflectometry (TDR), and optical emission microscopy (OEM) aid in identifying exact fault locations within chips. Isolation often requires examining wafers across multiple steps to track defect emergence. This phase is time-intensive due to the need for systematic "forensic" analysis. Once the root cause is isolated, solutions such as design tweaks, component replacements, or process adjustments can be implemented quickly, with final checks ensuring reduced defect levels and enhanced performance. #yieldmanagement #semiconductors #faultdetection #PAT #chips Picture Source: Nano Science Instruments

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