6-Layer Rigid-Flex Circuits 1.0mm Thick PCB
6-Layer Rigid-Flex Circuits 1.0mm Thick Multilayer S1000-2M-R-F777 Polyimide PCB
Introduction:
Rigid-flex circuits have revolutionized the world of electronic manufacturing, offering a unique combination of rigidity and flexibility. Our 6-layer rigid-flex circuits with a thickness of 1.0mm are designed to meet the demanding requirements of modern electronic devices. This comprehensive product description will delve deep into the features, construction details, and applications of our advanced PCB.
Rigid-Flex Circuits:
Rigid-flex circuits are a fusion of rigid boards and flexible PCBs, combining the advantages of both. The rigid sections provide structural integrity and house electronic components, while the flexible circuits enable bending, folding, and intricate designs. The manufacturing process involves creating the flexible circuit and rigid boards separately, which are then bonded together to form a cohesive unit.
Features of S1000-2M (FR-4):
Our 6-layer rigid-flex circuits employ lead-free compatible FR-4.0 laminate material known as S1000-2M. It offers exceptional features such as high heat resistance, excellent mechanical processability, and lower Z-axis Coefficient of Thermal Expansion (CTE). With a Tg (glass transition temperature) of 180℃, it ensures reliable performance even under demanding conditions. Additionally, it exhibits excellent through-hole reliability and anti-Conductive Anodic Filament (CAF) properties, making it ideal for various applications.
Features of R-F777 (Polyimide):
The flexible sections of our rigid-flex circuits utilize R-F777, a high-quality Polyimide (PI) material. It comes in thickness options of 25um, 50um, and 75um, providing flexibility while maintaining durability. The copper layers are available in ED copper and RA copper with thicknesses of 12um, 18um, and 35um. R-F777 has a high Tg value of 350℃, ensuring remarkable soldering resistance and flammability rating of UL 94V-0.
PCB Stackup:
Our 6-layer rigid-flex PCB follows a carefully designed stackup configuration to optimize performance. The stackup consists of four flexible layers with an air gap and two rigid layers.
PCB Construction Details:
PCB Statistics:
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Artwork and Standard:
We accept Gerber RS-274-X artwork, the industry-standard format, for seamless production. Our PCBs adhere to the widely accepted IPC-Class-2 standard, ensuring compliance with quality and performance guidelines.
Worldwide Availability:
Our 6-layer rigid-flex circuits are available for customers worldwide. We strive to meet the global demand for high-quality PCBs and offer reliable shipping options to ensure timely delivery.
Typical Applications:
The versatility of our 6-layer rigid-flex PCB makes it suitable for a wide range of applications. It finds applications in:
2.Communication devices
3.Automotive electronics
And other industries where compact and reliable circuitry is required. Its ability to withstand bending and folding makes it particularly useful in wearable technology and portable devices.
Conclusion:
In conclusion, our 6-layer rigid-flex circuits with a thickness of 1.0mm offer a robust and flexible solution for modern electronic designs. With features such as high heat resistance, excellent mechanical processability, and reliable through-hole connectivity, these PCBs are engineered to meet the demands of the ever-evolving electronics industry. Whether you require compact circuitry for advanced computing systems or rugged flexibility for portable devices, our 6-layer rigid-flex circuits are built to deliver exceptional performance and reliability. Experience the power of innovation with our state-of-the-art PCBs, available worldwide.