AFM + SEM + EDS for Quality Control & Failure Analysis in One Compact Instrument — FusionScope®

AFM + SEM + EDS for Quality Control & Failure Analysis in One Compact Instrument — FusionScope®

In today’s fast-paced industrial landscape, the demand for accurate and efficient quality control and failure analysis has never been greater. As manufacturers push the boundaries of innovation, ensuring that products meet rigorous standards while minimizing downtime is crucial. Enter FusionScope, a groundbreaking instrument that seamlessly integrates Atomic Force Microscopy (AFM), Scanning Electron Microscopy (SEM), and Energy Dispersive Spectroscopy (EDS) into a single, compact platform. This instrument stands at the forefront of analytical technology, offering a versatile solution that addresses the growing need for precise sample analysis in one streamlined process.

In this article, we’ll explore applications in which FusionScope revolutionizes quality control and failure analysis, delivering a new standard of excellence in a compact, all-in-one instrument.

Analyze a Complex Circuit Failure in Interlayer Circuit Structures using AFM and Energy Dispersive Spectroscopy (EDS)

Modes: SEM, AFM Topography, EDS 
Sample: Interlayer VIA Circuit

(Figure 1) Top-down and cross-section views of the VIA circuit.

Failure analysis and quality control procedures are very important for determining errors in the manufacturing process and increasing yields of manufactured devices. This can be especially challenging in interlayer circuits, such as a VIA (Vertical Interconnect Access) circuit (Figure 1). In these cases, a three-part analysis using the correlated capabilities of SEM, AFM and EDS in the FusionScope can greatly increase knowledge about samples and help in their improved manufacturing.

(Figure 2) SEM (a), EDS X-ray (b), and AFM-Topography (c) images of a failure spot. EDS analysis was able to distinguish the Al line and the Si substrate as well as the position of the Al VIA – the dense, purple-colored region at the upper section of the oval feature (b). Additionally, there are slightly brighter yellow regions (equal to higher concentration) around the VIA, indicating a greater Si concentration. This is expected since the Al line is thinner over the VIA (see AFM image). Consistently, a lesser amount of Si signal is detected from the VIA since the top material is Al in this region (b).

First, the SEM is used to map the large area and identify potential spots of failure by providing detailed imaging of the overlay error that occurs when layers of material are misaligned, decreasing the contact area and potentially lowering the device performance or in some cases leading to failure. The SEM image also provides high-resolution lateral information on the X and Y axes, facilitating the precise measurement of overlay accuracy (Figure 2a).

FusionScope's unified coordinate system, along with the coordinates provided by the SEM, allow AFM measurements to be easily gained by executing an automated scan command. The complementary vertical surface information provided by the AFM data reveals the topographic details of the surface along the Z axis, which are not clear in the SEM image. In this example, the AFM reveals that the circuit line is thinned over the VIA, potentially contributing to an impaired electrical connection (Figure 2c).

(Figure 3) Correlation of 3D topography view with EDS X-ray data. The colors represent the material concentration instead of the height. On the left-hand side (a), only the Si channel is superimposed onto the 3D image; in the middle (b), only the Al channel is superimposed; and on the right-hand side (c), both Si and Al channels are superimposed onto a 3D representation of the AFM topography image. In this way it becomes clear that the Al portion of the VIA is located in a thinned area which most likely leads to poor or faulty performance

The SEM (Figure 2a) and AFM (Figure 2c) images show an oval region in the center of the line, which might lead to the conclusion that the VIA covers this entire area, ensuring a proper electrical connection. However, the elemental information acquired by the EDS image (Figure 2b) reveals a higher concentration of aluminum (Al) at the upper central part of the oval feature, surrounded by silicon (Si). This indicates that the VIA is not centered and is smaller than the oval feature observed in the SEM and AFM images. By combining this with the topographic information from AFM (Figure 3) we can determine that the VIA only contacts the top Al line, where the line is thinned, indicating an even weaker electronic connection.

3D rendering depicting the interior of the FusionScope chamber. (a) E-T detector, (b) EDS, (c) SEM Column, (d) AFM, (e) Trunnion tilt stage.

It would not be possible to fully understand the details of this failure without the correlated information from SEM, AFM, and EDS. This correlative approach allows for more precise identification and characterization of defects, improving diagnostic accuracy. This way, the weaknesses in the design and production process can be better identified. The ability to analyze failures rapidly and accurately can reduce downtime and costs associated with troubleshooting and repairs, ultimately enhancing the reliability and performance of electronic devices.

Navigating Complex Regions using Advanced AFM

Modes:  SEM, AFM Topography and Phase
Sample: Machined Gear & Micromotor Elements
(Figure 1) AFM approach, analysis and characterization of intact machined gears. FusionScope’s advanced SEM navigation ensures precise placement of the AFM tip on specific locations, enabling detailed investigation of surface characteristics such as roughness, pores, and cracks. The left-hand path demonstrates the AFM approach and analysis of a gear flank, while the right-hand path demonstrates the same for a top land.

Material processing is key to achieving desired properties across a diverse range of applications. Surface properties, in particular, play a crucial role, and Atomic Force Microscopy (AFM) is the tool of choice for this task due to its capability for 3D metrology with nanometer spatial resolution. Moreover, AFM offers advanced modes that provide access to electric, magnetic, mechanical, optical, and thermal properties. Here, we highlight two examples that demonstrate the advantage of using FusionScope for easy and fast analysis.

First, consider machined gears produced through techniques such as casting, sintering, or direct CNC preparation. These gears often undergo stress tests to evaluate performance under different operating conditions, making it essential to characterize them before, during, and after these tests. Traditional AFMs struggle with this task due to difficulties in positioning the tip at areas of interest. FusionScope, however, excels by enabling SEM identification of these areas followed by precise tip approach made possible by the platform’s superb resolution and its 0-to-80-degree tilt angle of the sample and AFM scan head (Figure 1). These capabilities aid initial material processing, enable fast examination of surface properties, and help track wear effects.

(Figure 2) AFM approach, analysis and characterization of micromotor brushes, made possible by the unique tilting and imaging capabilities of FusionScope. The left-hand path demonstrates an approach and analysis using a top-down perspective, while the right-hand path demonstrates an approach and analysis of another sample area in Profile View.

The second example involves a micromotor with rotors that are electrically conducted by brushes. Motor performance heavily depends on the interaction regions, making the characterization of both elements after stress tests crucial for identifying abrasive behavior and material cross-contamination. FusionScope’s combined SEM and AFM capabilities are ideal for positioning the cantilever on areas of interest, as seen in Figure 2. The morphological information gathered is essential for understanding wear and potential failure processes.

Analyze Materials with Difficult Geometries using AFM

Typically, in atomic force microscopy, measurements of very pointed sample geometries are difficult. This is due to the convolution of the geometry of the tip with the topography of the sample surface. Also a challenge is the correct and reliable positioning of the tip over the sample. Profile View is used here to position the sample in the best possible way and to monitor the AFM measurement in real time.

A commercially available razor blade was installed in the sample holder with the aim of imaging the surface of the blade with the AFM and, in particular, determining the radius of the blade edge. The measurement comprises several steps: the coarse positioning, the fine positioning, the approach of the tip, and finally the measurement of the topography. With the help of the fine positioning made possible by the SEM, different areas on the razor blade can be quickly selected and measured. Different material properties, such as coatings applied to the razor blade, also can be compared. An important parameter of blade quality is the radius of the razor blade, as well as the roughness of the surface

Analyze Electronic Components or Semiconductor Devices using AFM

Detailed location and analysis of nanometer-sized structures is a challenging and time-consuming task for all AFM operators. The size reduction in recent generations of transistors creates especially high demands on quality control and failure analysis. With FusionScope and Profile View you can easily navigate the cantilever tip to the region of interest and perform high resolution AFM analysis of your sample. Measure the 3D topography with sub-nanometer resolution or extract additional information using conductive AFM.

As we continue to advance in quality control & failure analysis technology ...

FusionScope stands as a vital tool for researchers, scientists, and engineers offering a fast and intuitive workflow to extract the data you are looking for. Learn how this innovative correlative microscopy platform can help you get your job done more efficiently by visiting fusionscope.com.

To view or add a comment, sign in

Insights from the community

Others also viewed

Explore topics