Common quality problems of SMT patches

1. Main factors leading to patch leakage

1.1. The feeder of components is not in place during SMT SMT patch.

1.2. In SMT SMT process, the air path of the component nozzle is blocked, the nozzle is damaged and the nozzle height is incorrect.

1.3 the true air path of the equipment fails and blocks up.

1.4. Circuit board purchase is poor and deformation occurs.

1.5. There is no solder paste or too little solder paste on the solder pad of the circuit board.

1.6 quality problems of components and components, the thickness of the same variety is not consistent.

1.7. There are errors and omissions in the call program of the SMT machine, or the selection of thickness parameters of components is wrong during programming.

1.8. Due to improper operation and other human factors, it is accidentally knocked off.

2. The main factors that lead to SMC resistor turning parts and side parts during SMT

2.1 abnormal feeding of components and components feeder.

2.2 the suction nozzle height of the mounting head is wrong.

2.3 the height of mounting head grab is wrong.

2.4 the charging hole size of component braid is too large, and the component is turned over due to vibration.

2.5 the direction of bulk materials put into the braided tape is wrong.

3. Main factors causing component SMT deviation

3.1 when programming the mounter, the x-y coordinate of components is not correct.

3.2 cause of SMT nozzle, making suction unstable.

4. Main factors causing damage of components during patch

4.1 the positioning thimble is too high, so that the position of the circuit board is too high, and the components are extruded during mounting.

4.2 when programming the mounter, the Z axis coordinate of components is not correct.

4.3 the suction nozzle spring with mounting head is stuck.