China Compact mixing and dosing machine
we offer automation solutions for the mixing and dosing of 2-component reactive materials – especially polyurethanes, silicones and epoxy systems.For this, the material components have to be prepared, i. e. stirred in the tank and loaded with air, and then conveyed to the mixing head. In the mixing head, the components are then mixed dynamically and the liquid sealant system is dosed in precise quantities.
Mixing and dosing system: 2-K-DOS touch
The 2-K-DOS Touch mixer and proportioner quickly and precisely mixes and dispenses 2-component casting compounds and adhesives on a basis of polyurethane, epoxy, and silicone. With its modular design and multiple interfaces, the instrument can be adapted to a wide range of applications. Operation is simple and menu-guided with a touch panel.
The Mixing machine Form 2K series is a affordable compact mixing and dosing machine for processing 2-component liquids such as silicone, polyurethane and epoxy materials and other resin systems. Specific materials from the RTV series, or cold / room temperature vulcanizing materials. The machines can be expanded to a 3k or 4k machine for processing multiple components such as a part C or color paste.
The basic version Form 2K already has the necessary level of automation, making it easy to program the right settings for the right materials. It is easy and quick to set up the reconfiguration when changing the different materials.
The Form 2K machines can be used for materials with mixing ratios from 100:10 to 100:100. The output is 5 to 1000 ml per minute. The machine can process thicker materials up to 30,000 mPa’s viscosity. The tank contents for the A and B component are possible from 0.5 – 10 liters and the machines come standard in 5 liters per component tank content.
This setup of the Form 2K mixing machines is equipped as standard with a mobile trolley base that makes it easy to move the machine. The mixing gun is stored by means of a support on the base when not in use. With the Desktop version, the support for the mixing gun is mounted on the machine.
The control panel is easy to operate and is used to set the technical specifications of the output material as well as the correct mixing ratio and viscosities. The cleaning process is also set up and operated here.
These machines are not suitable for processing spray systems and HTV materials. We have other machines in our range for this. If you are looking for a specific machine for your own material or application, please contact us.
These machines are built to customer specific wishes. Many options such as heating and mixers per component in the tank, additional components can be added, different cleaning programs possible.
Meter-Mix Applications A 2-component adhesive formulation may be chosen over a 1 part adhesive due to performance benefits such as short cure times, enhanced durability, or improved adhesion. One of the most widely used applications of meter mix equipment is in the potting process where an enclosure with a circuit board is filled to a certain level to protect the electronics from moisture, dust, foreign objects, etc… A potting process can be applied to protect small electronic sensors used in the medical or automotive industry, or used to fill larger devices such as motor controller housings, LED video board assemblies, or electric batteries. A potting process can be a simple benchtop configuration where an operator may position a housing underneath a nozzle then step on a foot pedal to initiate the dispense into a single location for given amount of time or preset volume. In this case the viscosity of the potting material is low enough to freely flow into all required areas.
More intricate 2-component dispensing applications may require a multi-axis robot to drive a nozzle along a preprogrammed path to apply very small beads or deposits of adhesive to bond a mobile electronics assembly, or apply varying amounts of thermal gap filler materials with high accuracy to an automotive engine control module. Other precision applications may include staking of components to a circuit board or dispensing an encapsulant over exposed wire bonds. In these applications, the automation must be taken into consideration in order to apply medium to high viscosity adhesives at the proper flow rate and pattern in order to implement a successful process in production.
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Please contact with me for more information by email: whatsapp+86 134 2516 4065