Detailed principle of wave soldering

Although there are many SMD components used in many circuit boards, there are still some plug-in components with pins that need to use wave soldering. The quality of wave soldering of plug-in components has a great relationship with the wave soldering process parameters. The main technical parameters of wave soldering equipment include PCB width, PCB transportation speed, tin capacity of tin furnace, length and quantity of temperature zone, maximum temperature, furnace temperature control accuracy, etc.

1. The width of PCB, generally the maximum is 350~450mm;

2. PCB transportation speed, generally 0~3m/min;

3. The inclination of the transport guide rail is generally 3° to 7°;

4. The length of the wave soldering preheating zone is generally 1800mm (2x900mm);

5. The number of wave soldering preheating zones is generally 2~4;

6. The temperature of wave soldering preheating zone, usually from room temperature to 250℃;

7. The tin capacity of the wave soldering furnace is usually 350~800kg;

8. The maximum temperature of the wave crest tin furnace is generally 350℃;

9. Wave soldering temperature control method and temperature control accuracy, general PID;

10. The temperature control accuracy of wave soldering furnace is ±2℃;

11. Flux flow rate for wave soldering, generally 10~100mL/min

12. Air-conditioning generation system, usually -10~-20℃.