Driving Innovation: Semiconductors in Electronics

In the world of modern technology, electronics reign supreme, powering everything from the devices we carry in our pockets to the complex systems that drive our cities. At the core of this electronic revolution lies a remarkable class of materials known as semiconductors. These materials have transformed the way we live, work, and communicate, playing a pivotal role in our daily lives.

This introduction will delve into the significance of semiconductors in electronics, exploring their fundamental properties, applications, and their transformative impact on the world of technology. From the tiny transistors in our smartphones to the solar panels harnessing energy from the sun, semiconductors are the unsung heroes that drive the devices and systems we rely on. Join us on a journey through the world of semiconductors and their pivotal role in shaping the electronics landscape.

Power semiconductors based on silicon carbide (SiC) offer several advantages, like high efficiency, power density, voltage resistance, and reliability. This creates opportunities for new applications and improved charging station technology innovations.

Infineon Technologies AG has announced a collaboration with Infypower, a Chinese market leader in new energy vehicle charging. Infineon will provide INFY with the industry-leading 1200 V CoolSiC™ MOSFET power semiconductor devices to improve the efficiency of electric vehicle charging stations.“The collaboration between Infineon and Infypower in the field of charging solutions for electric vehicles (EV) provides an excellent system-level technology solution for the local EV charging station industry,” said Dr. Peter Wawer, Division President of Infineon’s Green Industrial Power Division. “It will significantly improve charging efficiency, accelerate charging speed, and create a better user experience for owners of electric cars.”

“With Infineon’s more than 20 years of continuous advancement in SiC product offering and the strength of integrated technology, Infypower can consolidate and maintain its technological outstanding position in the industry by adopting state-of-the-art product processes and design solutions“, said Qiu Tianquan, President of Infypower China. “We can also set a new standard for charging efficiency of DC chargers for new energy vehicles. As a result, customers can enjoy more convenience and unique value, promoting the healthy development of the EV charging industry.”SiC’s high power density enables the development of high-performance, lightweight, and compact chargers, especially for supercharging stations and ultra-compact wall-mounted DC charging stations.

Compared to traditional silicon-based solutions, SiC technology in EV charging stations can increase efficiency by 1 percent, reducing energy losses and operating costs. In a 100 kW charging station, this translates to 1 kWh of electricity savings, saving 270 Euros annually and reducing carbon emissions by 3.5 tons. This drives the increasing adoption of SiC power devices in EV charging modules.

As one of the first SiC power semiconductor manufacturers to use trench gate technology for transistors, Infineon has introduced an advanced design that provides high reliability for chargers. The devices offer a high threshold voltage and simplified gate driving . The CoolSiC MOSFET technology has been subjected to marathon stress tests and gate voltage jump stress tests before commercial release and regularly afterwards in form of monitoring to ensure highest gate reliability.

By integrating Infineon’s 1200 V CoolSiC MOSFETs, Infypower’s 30 kW DC charging module offers a wide constant power range, high power density, minimal electromagnetic radiation and interference, high protection performance and high reliability. In this way, it is well suited for the fast charging demand of most EVs while possessing a higher efficiency of 1 percent compared with other solutions on the market. Consequently, significant energy savings and carbon dioxide emission reduction are achieved, which are leading at a global level.

FOCUS ON THE INDUSTRIAL EQUIPMENT MARKET: ROHM LAUNCHES ‘PRODUCT LONGEVITY PROGRAM’

ROHM Semiconductor Americas has recently launched a dedicated page for a new Product Longevity Program (PLP). It provides information on the estimated supply periods for products scheduled for long-term supply – suitable for industrial equipment and other applications with long life cycles.

In recent years, semiconductors and electronic components are being increasingly installed in long-life applications, such as industrial equipment and automotive systems – requiring the disclosure of applicable products and clarification of supply periods to facilitate product selection.Products formally placed under the program (selected after considering the production system, equipment, material procurement status, and other factors) are disclosed along with the estimated supply periods. The goal: improving searchability by increasing the efficiency of customer product selection.The PLP sets supply periods of 10 to 20 years for products (mainly power and analog) requiring long-term supply, with relevant information such as supply status posted on ROHM’s website. This information (target products, supply periods) will be updated once a year to ensure the continuity of customer operations.

As the role of semiconductors in the industrial equipment and automotive markets continues to grow, ROHM will strive to provide long-term supply that meets market needs and contributes to the creation of a sustainable society through an expanding lineup of superior products.‘Quality is our top priority at all times’ has always been ROHM’s goal. In line with a corporate objective of ‘contributing to the advancement and progress of culture through a consistent supply, under all circumstances, of high-quality products in large volumes to the global market,’ ROHM has been supplying products that meet customer demands to achieve a sustainable society.

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

On 7th August the companies have announced that INOVA Semiconductors GmbH intends to produce its ISELED smart LED controller products also at Samsung Foundry in Korea as multi source to their existing foundry. The start of long-term mass production is scheduled for the fourth quarter of 2024.Inova's ISELED technology – also called the “Digital LED” – is already being used on a large scale by numerous car manufacturers in Europe, but above all in Asia. Thanks to the simplicity of use – there is no need for binning or user-calibration – and the trend to central/domain-based architectures ISELED is penetrating the market very quickly. Fully supported by the ISELED Alliance, a consortium of more than 50 lighting companies from around the globe – major Tier 1s, equipment manufacturers, light designers a.o. – Inova assumes that the mark of one billion ISELED chips per year will already be reached in 2026.

Mr. Robert Kraus, CEO of Inova, stated, "With the high acceptance of ISELED especially in Asia and the enormous growth rates which far exceed even optimistic expectations we simply have to ensure that we can always reliably supply our global automotive customers. As more we are happy that we soon can strengthen our supply chain through Samsung Foundry as an additional source with CoAsia SEMI as DSP (Design Solution Partner) of Samsung Foundry supporting the effort”.Gibong Jeong, Executive Vice President and head of Foundry Business Development Team at Samsung Electronics commented, "Automotive semiconductors are a field that requires technological stability and reliability based on research and development experience. We hope that new automotive customers like Inova can lead the innovation and technological development of next-generation future cars based on Samsung Foundry's process technology leadership."Mr. Shin Dong-Soo, the President of CoAsia's Semiconductor Business Division, said, "Through this contract with Inova, we have established a closer relationship with the German automotive industry. We will actively respond to the increasing demand for various automotive semiconductor applications and continue to create sustainable future value through a win-win partnership with Samsung Foundry."

TOSHIBA EXPANDS LINE-UP OF THERMOFLAGGER

Toshiba electronics nic Devices & Storage Corporation has expanded its line-up of “TCTH0xxxE series” Thermoflagger™ over-temperature detection ICs.For electronic equipment to perform as specified, semiconductors and other electronic components must operate within design parameters. Internal temperature is a crucial parameter, especially if it becomes higher than that assumed during the design process; it can be a major safety and reliability problem, and an overheating monitoring solution is needed to detect any rise in temperature.Thermoflagger™ over-temperature detection ICs detect temperature rises when configured in a simple circuit with PTC thermistors, whose resistance value changes with the temperature. The ICs also detect changes in the resistance of PTC thermistors placed near heat sources, and output a FLAG signal in case of over-temperature. When a Thermoflagger™ detects abnormal heat generation and sends a FLAG to an MCU, for example, the MCU will shut down the equipment or change the operation of the equipment or semiconductor that is generating heat. Connecting PTC thermistors in series realizes over-temperature detection for multiple locations.

The six new products are TCTH011AE, TCTH012AE, TCTH021AE, TCTH022AE, TCTH011BE and TCTH012BE. These join the already released TCTH021BE and TCTH022BE and bring the TCTH0xxxE series line-up to eight products. The new products expand the range of PTC thermistors that can be selected by supporting two types of PTCO output current. Push-pull or open-drain FLAG signal output types can be selected, as can the use or non-use of a FLAG signal latch function. Extending the range of product selections enables flexible circuit designs with low current consumption.The new products are packaged in a small, industry-standard SOT-553 (Toshiba’s package name: ESV), ensuring that the TCTH0xxxE series supports easy configuration of over-temperature detection for complete sets of electronic equipment, and helps to reduce size and power consumption.

Toshiba will continue to expand its product line-up with various packages and improved device characteristics that contribute to design flexibility and carbon neutrality.

"YAMAHA'S MANUFACTURING JOURNEY: FROM HIGH MIX TO HIGH VOLUME AND ALL POINTS IN BETWEEN"

Among the most important markets for today’s electronics manufacturers, IoT (Internet of Things) applications and automotive electrification are characterised by increasing demand for large numbers of a wide range of electronic device types.According to ResearchGate , already more than 50 billion IoT devices such as smart home monitors, wearables, and industrial sensors are connected to the internet, with over 10 billion more added every year.

In automotive, the pace of electrification continues to accelerate, to improve economy, lower emissions, increase safety, and enhance driver and passenger experiences. Increasingly sophisticated infotainment and driver-monitoring systems, advanced driver-assistance systems (ADAS), electronically controlled lighting, and electric propulsion mean emerging new models contain literally hundreds of circuit boards populated with processors, communication ICs, power semiconductors, high-power LED arrays, and more.The number and diversity of these technologically advanced devices, embedded in our digital lifestyles, is disrupting the traditional division in electronic manufacturing between high-mix/low-volume and low-mix/high-volume. OEM and EMS businesses need to produce a high mix of different product types in high volumes, and must maintain high productivity at all times.

Dual-Lane SMT

Dual-lane surface-mount assembly equipment appears to offer a solution by allowing simultaneous assembly of PCBs in each lane. This helps manufacturers respond to fast-growing markets in several ways.Firstly, dual lane allows rapid scaling of production capacity and increased efficiency. Two lanes operating simultaneously can process more PCBs within the same timeframe, enabling higher volumes to be produced.Secondly, dual lane enables manufacturers to assemble a high mix of different product types efficiently. Each lane can be configured to handle a specific product or product variant, allowing them to produce different types simultaneously. This flexibility is crucial in markets where a wide range of product types with varying specifications and features are required.Thirdly, dual-lane assembly helps optimise floorspace utilisation by raising the production throughput without significantly increasing the equipment footprint.

As manufacturers need to produce a high mix of products, in considerable volumes, and ensure a competitive unit cost and timely delivery, dual-lane assembly offers a cost-effective and space-efficient solution to the challenge. With the evolutionary changes in the latest dual-lane equipment, it is ready to deliver the performance advantages it has always promised.

Throughput with Flexibility

With the arrival of the latest generation of equipment such as the Yamaha Motor Corporation, USA YR series advanced dual-lane machines, both lanes have equal priority by allowing an equal range of adjustment and supporting the same automated features.The YRP10DL dual-lane screen printer and YRM20DL dual-lane mounter allow maximum PCB size up to 330mm in dual-lane mode (figure 1) and so can be connected together directly. Historically, a dual-lane printer may have fed two separate mounters via a custom conveyor that adds complexity and cost. Alternatively, a single printer may have directed boards into a dual-lane mounter via a split conveyor.The maximum rail width of 330mm is greater than typical preceding equipment models and so allows larger panel sizes that contain extra PCBs (figure 2a). Similarly, portable carriers for flexible printed circuit (FPC) substrates can contain 50% more units (figure 2b) by taking advantage of the expanded rail width.

Mounting ModesThe YRM20DL mounter allows multiple placement operating modes to enhance productivity. These include parallel and alternate modes with two separate mounting stages and over-drive flexibility. These extend the head non-interference area to reduce waiting time for alternate mode assembly and thereby improve productivity. In parallel mode, the 4-split conveyor reduces transport distance. The parallel and alternate modes allow an extension conveyor option that increases the length up to 380mm.When setup in parallel mode, the two lanes can operate completely independently, each having its own setup. Non-stop changeover of feeder carts is possible. This allows manufacturers to assign a product to lane 1 with the flexibility to assign the same or a different product to lane 2, and changeover either lane independently. Parallel mode is most useful when producing PCBs with a small number of component types.

In alternate mode, either head can place components in either lane and feeders are shared between both lanes. Each lane can run the same product or different products. This approach can be used to populate boards that contain a large variety of component types, although the cycle time may be short. Parts sharing and productivity levelling are possible.

In addition, the YRM20DL can operate in hybrid mode to handle the case where each lane builds a different product and one of the two assemblies is more heavily populated than the other. In hybrid mode, the less busy head can place components in the other lane to help accelerate the cycle time. This allows extra flexibility when production capacity is a priority and the feeder set positions are not suitable for parallel mode. Parts sharing and productivity levelling are possible in hybrid mode.The production mode of each mounterwithin a line can be changed independently to maximise productivity and ensure efficient use of feeder slots. This allows mixed-mode production using, as shown in figure 3, parallel mode for chip mounting and alternate mode for mounting odd-shaped components that require many feeders. Figure 3 also shows alternate mode applied to one side only, for assembling odd-shaped components.

The YRM20DL also contains advanced features from the existing single-lane model, with enhanced PCB transfer capacity and stopper-less board positioning. The requirement for stopper-less positioning originated in the automotive industry, to preserve the integrity of assemblies. The mounter also links push-up pin activation and PCB clamping, tightly coordinating the two actions to minimise PCB transfer time. In addition, non-stop program change and non-stop carriage exchange enable fast changeovers between products.Non-stop program change maximises efficiency in either case where the PCB width and backup position are the same or different. When the incoming job width and backup-pin position are the same, the machine can simply finish the current PCB and change the program for the next job. On the other hand, when the width or back position are different, the machine allows the incoming PCB to wait before entering. The new width setting is applied after the last PCB of the current job leaves the machine.The non-stop carriage exchange feature provides safe removal and replacement of carriages without stopping the machine. One lane can continue production while automatic carriage setup runs on the other lane. This effectively allows the two lanes to run independently, with each building a different mix of products.

Seamless End-to-End Dual LaneThe YRP10 DL dual-lane printer, similarly, provides flexible rail-width settings and automated features active on each lane. When used together, these machines enable the entire surface-mount line to operate independent dual lanes from end to end for maximum flexibility and throughput, whether manufacturing a low or high mix of product types.The printer performs as two screen printers inline, each operating with full independence and both supporting full automated program changeover to minimise downtime and maximise productivity.The YRi-V DL inspection machine provides dual-lane capability with a newly developed conveyor that has movable lanes, which eases connection to other inline equipment either upstream or downstream. It can handle a large range of PCB sizes, up to 320mm x 2 in dual-lane mode. It can also handle custom PCB sizes up to 1200mm x 610mm. When both lanes are assigned to handle a small PCB, the rails can be placed close together to minimise the excursion time for the inspection head.The YRi-V also adds new algorithms that improve inspection of solder fillets in accordance with IPC standards. There are also updated camera settings to handle inspection challenges posed by the latest semiconductor package styles, such as wafer-level chip-scale package (WL-CSP). The package surface tends to produce reflections that challenge the capabilities of conventional inspection equipment (figure 4).

Further enhancements include an 8-angle 3D camera array that accelerates image capture and a 4-angle 20Mp camera to capture high-resolution images of features such as solder joints. These are known to be challenging for conventional machines to capture and assess accurately.When used together in the same line, the dual-lane printer, mounter, inspection means seamless end-to-end dual-lane manufacturing. In the past, to achieve this has required various combinations of single-lane machines connected with special conveyoring, resulting in a complex line layout that can be expensive and time consuming to design and install.

Conclusion:

Semiconductors have fundamentally altered the course of human progress in the realm of electronics. These unique materials, with their ability to control the flow of electrons, have ushered in an era of technological advancement that continues to shape our world. From the early days of transistors to the contemporary microprocessors and integrated circuits that power our most advanced devices, semiconductors have been the catalyst for innovation. As we look to the future, the influence of semiconductors in electronics shows no sign of diminishing. With each passing year, new breakthroughs and applications continue to emerge, promising even greater capabilities and efficiencies.

Semiconductors are the backbone of our digital age, driving the development of smarter, smaller, and more powerful electronic devices. They enable us to explore the cosmos, connect with people worldwide, and address some of the most pressing challenges facing our planet. In essence, semiconductors are the invisible enablers of the connected, electrified, and automated world we live in today.