Embedded Edge Devices are Getting Smarter, More Efficient
The Edge is nothing new. Edge networking, Edge processing, and most recently Edge intelligence have been where many companies have been innovating and expanding capabilities and product lines for years.
The reasons for this are many, and it’s not the exclusive home of innovation, but there’s a merging of historically disparate horizontal layers driving much of the innovation at the edge. These layers are IoT, Embedded, and AI, and they’re combining into one fused horizontal technical layer that will likely inform every deployment or upgrade at the Edge for the foreseeable future. This is simply because enterprises and end users want their applications to be unified and simple to operate and manage, but also powerful, functional, and capable. That means, they need the power of embedded processing and efficient energy management, Sensor Fusion for IoT connectivity and data collection, and command and control automation from AI and ML algorithms. All of these are being required by customers to flow through single UI and that’s driving this horizontal convergence. Article includes coverage from Ceva, Inc. , STMicroelectronics , and indie . Read full article.
ATTEND Launches its 123A Series M.2 NGFF Connectors
ATTEND Technology launched the 123A Series M.2 NGFF (Next Generation Form Factor) Connectors delivering high-speed data transmission proficiencies and compatibility with PCI Express 3.0, SATA 3.0, and USB 3.0, while being compliant with PCI-SIG PCIe M.2 specifications. Read more.
Vecow, with Kudan, Reveal the Vecow Turnkey SLAM Kit
Vecow Co., Ltd and Kudan revealed a the release of Vecow’s Turnkey SLAM Kit (VTK SLAM Kit). Integrating Vecow’s ultra-compact fanless system with added sensors and IMUs, along with Kudan’s SLAM technologies, this collaboration aims to cater to the rising demand for navigation and mapping solutions in unknown environments. Read more.
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