has been cited by the following article(s):
[1]
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Numerical study on the thermal fluid of multi-chip test chamber with guide vane
Case Studies in Thermal Engineering,
2024
DOI:10.1016/j.csite.2023.103851
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[2]
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Machine Learning for VLSI Chip Design
2023
DOI:10.1002/9781119910497.ch5
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[3]
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Design and Analysis of a Symmetrical Low-κ Source-Side Spacer Multi-gate Nanowire Device
Journal of Electronic Materials,
2023
DOI:10.1007/s11664-023-10217-z
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[4]
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Design and Analysis of a Symmetrical Low-κ Source-Side Spacer Multi-gate Nanowire Device
Journal of Electronic Materials,
2023
DOI:10.1007/s11664-023-10217-z
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[5]
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Structural Analysis of silica aerogels for the interlayer dielectric in semiconductor devices
Ceramics International,
2021
DOI:10.1016/j.ceramint.2021.07.144
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[6]
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Structural Analysis of silica aerogels for the interlayer dielectric in semiconductor devices
Ceramics International,
2021
DOI:10.1016/j.ceramint.2021.07.144
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[7]
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Structural Analysis of silica aerogels for the interlayer dielectric in semiconductor devices
Ceramics International,
2021
DOI:10.1016/j.ceramint.2021.07.144
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