Hsin Jen Pan, Chao Yang Lin, Jung Hua Chou, Udit Surya Mohanty, Yuan Gee Lee
DOI: 10.4236/msa.2011.29175   PDF    HTML     4,425 Downloads   7,884 Views   Citations

Abstract

The nanoparticles of tin-silver solder, Sn-3.5Ag, of necklace geometry were made in a swirl batch. It was found that the addition of the element, Ag, did not vary the microstructure of the solder matrix, but Ag simply diluted into the Sn matrix randomly. The swirl flow facilitated the formation of particles with different sizes. It was found that the size distribution of the nanoparticles was strongly related to the height in the swirl batch. In addition, the aggregation of the nanoparticles was explored and the dispersion of the nanoparticles was achieved by adjusting the pH value of the solution near the neutral value.

Keywords

Swirl Flow, Particle Size Distribution, Nanoparticle Aggregation

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Conflicts of Interest

The authors declare no conflicts of interest.

References

[1]	Y. Li and C. P. Wong, “Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications,” Materials Science and Engineering, R: Reports, Vol. 51, No. 1-3, 2006, pp. 1-35. doi:10.1016/j.mser.2006.01.001
[2]	M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics,” Material Science Engineering, R: Reports, Vol. 27, No. 5-6, 2000, pp. 95-141.
[3]	M. McCormack, S. Jin, G. W. Kammlott and H. S. Chen, “New Lead-Free, Sn-Ag-Zn-Cu Solder Alloy with Improved Mechanical Properties,” Applied Physics Letters, Vol. 63, No. 1, 1993, pp. 15-17.
[4]	I.E. Anderson, J. C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra and O. Unal, “Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability,” Journal of Electronic Materials, Vol. 30, No. 9, 2001, pp. 1050-1059. doi:10.1007/s11664-001-0129-5
[5]	P.T. Vianco and A.C. Claghorn, “Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis,” Soldering & Surface Mount Technology, Vol. 8, No. 3, 1996, pp. 12-18. doi:10.1108/09540919610777708
[6]	S. A. Maier, M. L. Brongersma, P. G. Kik, S. Meltzer, A. A. G. Requicha and H. A. Atwater, “Plasmonics a Route to Nanoscale Optical Devices,” Advanced Materials, Vol. 13, No. 19, 2001, pp. 1501-1505. doi:10.1002/1521-4095(200110)13:19<1501::AID-ADMA1501>3.0.CO;2-Z
[7]	Z. Zha, S. Qiao, J. Jiang, Y. Wang, Q. Miao and Z. Wang, “Barbier-Type Reaction Mediated with Tin Nano-Particles in Water,” Tetrahedron, Vol. 61, No. 9, 2005, pp. 2521-2527. doi:10.1016/j.tet.2004.12.063
[8]	M. Athar, U. C. Kothyari and R. J. Garde, “Distribution of Sediment Concentration in the Vortex Chamber Type Sediment Extractor,” International Journal of Hydraulic Research, Vol. 41, No. 4, 2003, pp. 427-438. doi:10.1080/00221680309499987
[9]	K. S. Le Corre, E. Valsami-Jones, P. Hobbs, B. Jefferson and S. A. Parsons, “Agglomeration of struvite crystals,” Water Research, Vol. 41, No. 2, 2007, pp. 419-425. doi:10.1016/j.watres.2006.10.025
[10]	Y. Zhao, Z. Zhang and H. Dang, “Preparation of Tin Nanoparticles by Solution Dispersion,” Material Science and Engineering A, Vol. 359, No. 1-2, 2003, pp. 405-407. doi:10.1016/S0921-5093(03)00395-2
[11]	A. Bhardwaj, P. Srivastava and H. K. Sehgal, “Chemically Deposited PbSe Nanoparticle Films Variation in Shape and Size,” Journal of Electrochemical Society, Vol. 154, No. 10, 2007, pp. 83-86. doi:10.1149/1.2763963
[12]	E. Pan, Y. Zhang, P. W. Chung and M. Denda, “Strain Energy on the Surface of an Anisotropic Half-Space Substrate: Effect of Quantum-Dot Shape and Depth,” CMES- Computer Modeling in Engineering & Sciences, Vol. 24, No. 2-3, 2008, pp. 157-167.
[13]	J. Duan and J. Gregory, “Coagulation by Hydrolysing Metal Salts,” Advances in Colloid Interface Science and Technology, Vol. 10, 2003, pp. 100-102.
[14]	J. Gregory, “Particles in Water: Properties and Processes,” IWA Publishing, London, 2006.