Uživatel Argotech – Semiconductor photonics to přesdílel
Precision is everything in die bonding—and it shows up in more places than you might think: 1. Picking parts as small as 150x150 μm from blue foil or gel packs 2. Securing components with solder (within 0.5 seconds of heating) or specialized epoxies 3. Selecting components based on wafer maps is second nature 4. Positioning with a deviation no greater than 1 μm These extreme levels of accuracy aren’t just nice to have; they’re essential for assembling functional mirrors, micro-lenses, and other optical components. When standard methods fall short, we adapt. Whatever your requirements, we’ll find the solution. We are your ONE-STOP SHOP for future projects. #Argotech101 #optoelectronics #microelectronics