Leistungselektronik: Turbo für die Elektrifizierung! 🚀 Webinar-Tipp ⚡ - Jetzt gratis anmelden: https://lnkd.in/gUa743in Die Referenten: 🔊 Matthias Fettke, Vice President Advanced Packaging Equipment, Pac Tech USA - Packaging Technologies, Inc. "Advanced Laser Assisted Bonding Technologies for high-power device assembly" 🔊 Piotr Swietoniowski, Service and Support Team Leader (AOI, AXI), Omron Industrial Automation Europe "X-ray inspection challanges in Power electronics assembly" 🔊 Helmut Schweigart, Leiter Reliability & Surfaces, ZESTRON Europe "Umgang mit Partikeln im Rahmen der Isolationskoordination" 🔊 Daniel Laue, Key Account Manager, Saki Europe GmbH "Spitzen Röntgentechnologie in der Leistungsindustrie" 🔊 Andreas Karch, Technical Manager (Germany, Austria, Switzerland), Technologist – Advanced Applications, Indium Corporation "SiC basierende Power-Module benötigen individuelle AVT-Materialien für die verschiedenen Interfaces" 🔊 Jens Kokott, Produktmanager AOI, GÖPEL electronic GmbH "Fehlerteufel in der Leistungselektronik – nicht mit uns!" 🔊Thorsten Vehoff, Head of Technical Solution Management, Heraeus Electronics "Module attach sintering – advantages and success factors" 🔊Axel Lindloff, Senior Process Specialist Pre-Sales, Koh Young Europe GmbH "Fehlerkriterien im Sinterpastendruck – Und wie man sie prüft" 🔊Vasilii Afanasev, sFAB Manager, FUJI EUROPE CORPORATION GmbH "THT Assembly Automation: Sein oder nicht Sein? Das ist die Frage." 🔊Rolf Demitz, VP und Leitung Customer Care Team BO, Viscom SE "Perfekte Fehlerdetektion dank rekordverdächtiger Auflösung und intelligenter Assistenz für die Fertigung von Leistungselektronik" 👉 Hier zur kostenfreien Anmeldung: https://lnkd.in/gUa743in
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Europe in the global "Semiconductor Market" - Breakdown by Segment European companies also play an essential role in providing critical subsystems, components and modules that are indispensable for fabricating new WFE as well as delivering service and support to keep it running with upgrades and replacements. Europe has a long history of vacuum and optical technological development, and strong expertise in the associated instrumentation and metrology, with honorable mentions for RF power and process monitoring. Zeiss and Edwards Vacuum are among the top three semiconductor subsystem companies in the world in terms of annual revenue, accounting for 10% and 9%, respectively. Zeiss provides optical systems typically used in photolithography, in addition to inspection and metrology equipment. It is also a captive supplier of ASML for its EUV optical system. ASML itself is part of the top 10 companies as the sole player in the EUV lithography market and a major DUV supplier. Edwards Vacuum benefits from its dominant position in the vacuum pump market, especially as the vacuum content of WFE has increased over the past three years. European chipmakers excel in specialty markets, and European WFE suppliers are poised to dominate mainstream lithography while maintaining a leading role in specialty equipment. Additionally, European subsystems and components suppliers are projected to maintain their global leadership in areas such as vacuum, optics, abatement, vacuum capacitors, and instrumentation. This underscores Europe’s strength across the semiconductor manufacturing supply chain, characterized by depth and diversity. Despite this, many of these suppliers remain underappreciated, despite their significant contributions. Great info from Yole Intelligence #interesting #technology #innovation #semiconductor #ai ZEISS Group JENOPTIK Meopta s.r.o. Edwards Vacuum Buss AG Air Liquide centrotherm clean solutions GmbH VAT GROUP Pfeiffer Vacuum Leybold INFICON Hiden Analytical Avantes Spacetek Technology AG TOFWERK
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US Tech Online -> StratEdge Showcases Reliable Ceramic Packaging
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Entdecken Sie, wie wir präzise Inspektionstechniken für höchste Qualitätsstandards einsetzen!
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