CITC - Chip Integration Technology Center

Publication alert: our program manager Integrated Photonics Packaging Sander Dorrestein wrote together with Nikolaus Flöry and Taynara Oliveira an article in PIC Magazine about Advancing the semiconductorization of photonic chip packaging. You can find the article below, the entire magazine is accessible at https://lnkd.in/g2Tssre #semiconductorization #photonicspackaging #integratedphotonics vario-optics TNO

Tomorrow, CITC's Mark Luke Farrugia, PMP will be one of the speakers at the Advanced Packaging Conference in Munich. He will give a presentation about Competitive and Sustainable Advanced Packaging (CSAP) – a new approach to FO-PLP. His presentation is part of session 5: Sustainable materials enabling performance which will be held in ICM Munich, room 14a on November 13. The session begins at 16:25 hrs, Mark Luke will talk from 16:50 hrs – 17:10 hrs. We hope to see you there! #accesstoinnovation #competitiveandsustainable #CSAP

For the second year in a row, a group of Panamanian professors visited CITC. The professors took on the role of students during a week full of practical work in the CITC labs and visits to neighboring semiconductor (packaging) companies such as NXP Semiconductors and Neways Electronics International NV. They already followed the theoretical part of the Semiconductor Packaging University Program and now got the chance to expand their practical knowledge and experience. After many hours in the lab, they received a well-deserved certificate... and a pack of stroopwafels to take back to Panama. #accesstoeducation #knowledgesharing

Thank you Holst Centre for hosting a very nice and well-organized knowledge exchange event. We were happy to present our work and challenges and see what you are working on. This will definitely enhance our collaboration even further. #innovationandcollaboration #semiconductorpackaging #knowledgeexchange

Last Friday, we had visitors all the way from Singapore. A delegation from Heraeus visited us for a live update meeting. We discussed our ongoing research to identify a lead-free die attach solution. And we could also show them our new accommodation. Thanks for visiting! #accesstoinnovation #silversintering

Many happy faces at CITC from students who graduated from this year's edition of the Semiconductor Packaging University Program. The group of students who only followed the theoretical part received their certificates on October 15 and last Friday we awarded three certificates to the students who also followed the practical part. Congratulations to all! We hope that you can use the knowledge and experience you gained through the program in your daily work. #accesstoeducation #semiconductorpackaging

After successful presentations earlier this year in Vancouver and Zagreb, our colleague Noud Schoenmakers now stood on stage in Papendal, NL. At the Engineering Mechanics Symposium, he presented his work on the pronounced mode dependency of the interface fracture toughness of pressureless sintered silver joints: identification of dissipative micro-mechanisms. #accesstoinnovation #pressurelesssilversintering #fracturemechanics

Our education consultant Joop Bruines traveled to Panama to speak at the IESTEC conference. He will be talking today about challenges in semiconductor packaging and the CITC approach to address them. Next week, several Panamanian professors will pay a return visit to CITC to learn more about the Dutch semiconductor (packaging) industry. #accesstoinnovation #accesstoeducation

We were pleased to receive visitors from Canada today. A delegation from several photonics companies visited the Noviotech Campus and stopped by at CITC. Our colleague Sander Dorrestein gave them an update on our work in photonics and explained our Integrated Photonics Technology Roadmap. And of course, the visit was concluded with a tour of our lab facilities. Special thanks to Fanny Bousquet from the Canadian embassy for organizing this visit. #accesstoinnovation #integratedphotonics 

Last Wednesday, we welcomed almost 90 people to our first CITC Innovation Day. Together with our partners Delft University of Technology and Holst Centre we updated the audience about the latest developments in chip packaging. After two keynote speeches in the morning by G.Q. (Kouchi) Zhang - 'Heterogenous system integration and packaging – the key success factor of semiconductors in EU' and Jaap Lombaers - 'Chip integration - sexy again and in need of innovation', we had 8 innovation pitches and a poster market in the afternoon. For those interested in the topics of the innovation pitches: - Edsger Smits (CITC) - 'Package development for power: towards green and efficient electronics' - Sander Dorrestein (CITC) - 'How CITC semiconductorizes integrated photonics assembly and packaging' - Gerwin Gelinck (Holst Centre/PITC) - 'Introducing Photonic Integration Technology Centre' - Henk van Zeijl (TU Delft) - 'The Fabric of Chip Integration Technology' - Francesca Chiappini (CITC) - 'Technologies for Antenna-in-Package at CITC' - Gari Arutinov (Holst Centre) - 'Laser processes for microLED integration: Die Transfer | Bumping | Repair' - Hylke B. Akkerman (Holst Centre) - '3D structural microelectronics by additive manufacturing' - Mark Luke Farrugia, PMP (CITC) - 'Competitive and Sustainable Advanced Packaging - CSAP' It was a pleasure to have you all at the Noviotech Campus and we hope to see you again in two years!