Siemens EDA (Siemens Digital Industries Software)

We're thrilled to unveil a new automated and certified workflow for TSMC's InFO packaging technology, powered by Siemens' industry-leading advanced packaging integration solutions. 🎉 This collaboration addresses the growing challenges of design complexity and time-to-market, empowering our mutual customers to achieve remarkable innovations. As AJ Incorvaia, SVP of Electronic Board Systems at Siemens, puts it, "The combination of Siemens’ industry-leading Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.” This workflow, featuring Xpedition Package Designer, HyperLynx DRC, and Calibre nmDRC, streamlines the design process for TSMC's InFO_oS and InFO_PoP technologies. It's a testament to our commitment to the TSMC Open Innovation Platform® (OIP) and our dedication to providing cutting-edge solutions for next-generation semiconductor designs. #Semiconductor #Innovation #ChipDesign

Why is silicon lifecycle management (SLM) so critical? Because it's the key to extending product lifecycles and maximizing performance! We spoke with Marc Hutner, Director of Product Management for Silicon Learning, about how Tessent is revolutionizing silicon lifecycle management (SLM). DFT is evolving beyond just test, becoming a functional subsystem, and SLM is extending product lifecycles by providing deep insights into system health. #SLM #DFT #Semiconductor #Innovation

📣 We are excited to announce an exclusive OEM agreement between Siemens and Alphawave Semi, a leader in high-speed interconnect silicon IP to help us tackle the most complex connectivity challenges at the world’s leading advanced process nodes. This partnership represents a significant milestone, delivering a comprehensive range of PHY IP, Controller IP, and Subsystem platforms optimized for advanced technology nodes to reduce interconnect bottlenecks, enable faster data transmission, increase reliability, and lower power consumption. These solutions consist of complete silicon IP building blocks that our customers can license and integrate into advanced system-on-chip (SoC) designs, including implementations leveraging 3D-IC and chiplet technologies, critical for customers in AI, autonomous vehicles, data networking, hyperscaling and storage markets. “The addition of Alphawave Semi’s silicon IP introduces industry leading technology to our customers, empowering them to achieve unprecedented advances across diverse industries in dramatically shortened timescales," said Mike Ellow, CEO, Siemens EDA. “We look forward to collaborating with Alphawave Semi to deliver state-of-the-art IP that addresses the most complex connectivity challenges, at the world’s leading advanced process nodes.” “Siemens Digital Industries Software is a key and trusted partner for AI and hyperscaler developers, and our agreement simplifies and speeds the process of developing SoCs for these, and other leading-edge technologies, to incorporate Alphawave Semi’s IP,” said Tony Pialis, president and CEO, Alphawave Semi. “Our technologies play a critical role in reducing interconnect bottlenecks and this collaboration greatly expands our customer reach, allowing more companies to deliver next-level data processing.” To see all the details about this impactful announcement, please visit the comments below.

Struggling with long IC verification cycles? An emulation-optimized pattern validation engine for gate-level runs can be a game-changer. This video explains how it can accelerate your testing and get your product to market faster. #ICVerification #Emulation #Semiconductor

We’re happy to share that Innovator3D IC, our unified cockpit for streamlining 3D IC design planning, prototyping and analysis, has been recognized with a 2025 3D InCites Technology Enablement Award! 🎉 Innovator3D IC provides a consolidated cockpit for constructing a digital twin — featuring a unified data model for design planning, prototyping and predictive analysis — of the complete semiconductor package assembly. This cockpit drives implementation, multi-physics analysis, mechanical design, test, sign-off and release to manufacturing. By providing early insights into thermal, mechanical, and electrical performance, it reduces design iterations and accelerates development. This comprehensive solution empowers engineers to create optimized, production-ready designs, transforming semiconductor design workflows. We're very proud of this recognition and invite you to check the link in the comments to learn more ⬇️

How will #AI influence the future of #semiconductor design? At the recent "Trends in Semiconductor System Design" event, Sathishkumar Balasubramanian, our Head of Product for IC Verification and AI, shared his insights on how to unlock the AI advantage. Here are the key takeaways ⤵️ 1. The semiconductor industry faces rapidly increasing design complexity coupled with a global engineering shortage 2. AI technology has emerged as a transformative solution to address these industry-wide challenges 3. Modern chip design demands production-grade AI that delivers verifiable accuracy and trustworthy results How can you keep up? With our EDA offerings that deliver production-grade AI solutions that accelerate design and verification.

Calling all Siemens EDA experts! ✨ Seize this incredible opportunity to elevate your profile and share your valuable insights by becoming a speaker at our two exciting Siemens EDA User2User Conferences, held in North America and Europe. Why speak at User2User? 💬 •Showcase your expertise: Share your technical knowledge and industry best practices with a global audience. •Expand your network: Connect with industry peers, build relationships, and foster collaborations. •Impact the industry: Help others optimize their workflows, overcome challenges, and drive innovation. •Enhance your skills: Gain valuable presentation experience and refine your communication abilities. We invite you to submit your topic on a range of subjects, including: 📃 • Functional Design & Verification • Design Solutions & Power Integrity Analysis • Hardware Assisted Verification • High Level Synthesis • Custom IC • Low Power • Digital IC • AI/ML • Functional Safety, Security, Trust & Assurance • Cloud Adoption • Test and Embedded Analytics Solutions • PCB • 3DIC/Chiplet Design Don't miss out! Submit your abstract today and become a part of these exciting conferences. The link is in the comments! User2User Europe, May 13, 2025 | Munich, Germany User2User North America, May 20, 2025 | Santa Clara, CA #Engineering #Technology #Innovation

#News – we are supporting cutting-edge research and development on AI devices! We’re excited to announce that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce Strato CS emulation and Catapult High-Level Synthesis (HLS) platforms to conduct architecture and design space exploration of AI accelerator devices. “RIKEN’s adoption of Siemens’ emulation and HLS capabilities enables the team to conduct the necessary explorations during our research into next-generation AI devices for ‘AI for Science’ and maintain our position as the creators of the world’s most powerful supercomputer,” said Dr. Kentaro Sano, team leader of the Processor Research Team at the Center for Computational Science, RIKEN. "Our goal is the establishment, management, and continuous enhancement of the computational infrastructure essential for the creation of generative AI models tailored for scientific discoveries – and Siemens’ tools play an essential role in this research.” For more insight, visit the comments section. #EDA #ICVerification #AI

Cognizant announced our collaboration to incorporate PAVE360 software to power their enhanced solution accelerator to speed up the development cycle for software defined vehicles (SDVs). The enhanced accelerator, featuring Siemens' Simcenter Prescan for sensor modeling and scenario-based testing, aims to meet rising customer demands by accelerating the SDV development cycle, and is designed to enable continuous and simulated verification and validation, streamline the development process and reduce the time required to deliver features while managing the increasing software complexity from diverse platforms and components. Visit the comments for the link to the full story ⏬ #SDV #collaboration #CES2025

Exciting insights from CES 2025! Our CEO, Siemens EDA, Mike Ellow sat down with EE Times | Electronic Engineering Times' Aalyia Shaukat to explore the future of semiconductor design and discuss the groundbreaking PAVE360 solution. The PAVE360 comprehensive digital twin approach provides mixed fidelity modelling as well as multi-physics simulation of end-systems and the capability to connect with real hardware, making "virtual to vehicle" a reality. This cloud-based SDV development environment with digital threading technology ensures continuous updates and feedback, making it a game-changer for complex system design for our customers. Thank you to everyone who visited the Siemens booth and attended the PAVE360 demonstration suite at #CES2025. The highlight of the event was the opportunity to engage directly with our customers, partners, and colleagues. Visit the comments for a link to the full article ↘️ #DigitalTwin #Semiconductor