Aimtron Group looks forward to seeing you 22 -24 October 2024 at THE ASSEMBLY SHOW 2024, Donald E. Stephens Convention Center, Rosemont. Visit us @ Booth #1311 to learn more about Aimtron’s latest Design & Manufacturing capabilities and solutions for the electronics industry! #aimtrongroup #PCBManufacturing #quality #deliver #PCBA #design #EMS #EMSSolution #EDM #EDMSolution #manufacturing #electronicsindustry #electronicsmanufacturing
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🚀 Optimizing Designs with TOLL-8: Compact, Efficient, and Powerful 🚀 In today’s competitive market, design optimization is key. At Holy Stone and Formosa Microsemi, we're excited to offer the TOLL-8 package as an advanced alternative to the D2Pak for MOSFETs. This innovation delivers significant advantages that align with evolving industry demands: 🔹 30% footprint reduction 🔹 50% height reduction 🔹 60% overall space saving 🔹 Lower inductance (from 5nH to 1nH) 🔹 Improved thermal performance (RthJc from 0.98 °C/W to 0.8 °C/W) By adopting TOLL-8, engineers can achieve more compact, efficient, and thermally robust designs, pushing boundaries in power and efficiency. 📈 Let’s drive innovation together – explore the future of discrete semiconductors with us! #HolyStone #FormosaMicrosemi #Semiconductors #Innovation #Engineering #ThermalPerformance #Efficiency #DesignOptimization
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The choice of a manufacturing partner can make or break a project in the semiconductor industry. We recognize this need and have positioned ourselves as the partner that guarantees your project's success. With a deep understanding of the industry's distinct demands, E-Fab is committed to delivering the highest quality, precision, and innovation in everything we do. Our state-of-the-art photochemical etching technology ensures reliable, consistent results for components, and we work with every client to customize parts that meet the specific needs of your applications. Adhering to industry standards and regulations is also a cornerstone of our manufacturing processes. Our quality assurance system certifies that every component meets the strictest industry criteria. Discover why E-Fab should be your go-to manufacturing partner for semiconductor components in this blog: https://buff.ly/3WRMyAW #EFab #PhotochemicalEtching #PrecisionManufacturing #SemiconductorComponents #TrustedPartner
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At micrometal GmbH Group, we specialise in photo-chemical etching (PCE) — a process that combines exceptional precision with unmatched design flexibility to transform your product’s performance. Our PCE technology allows the creation of ultra-thin, highly intricate metal parts with tolerances down to a few microns. This makes it ideal for applications where precision is paramount, such as filtration, sensors, medical devices, and electronics. Imagine a medical filter with microscale perforations, offering superior fluid control and reducing the risk of contamination. Or a high-tech sensor, where ultra-thin, perfectly etched components enhance sensitivity and reliability. Our process supports both prototyping and high-volume production, ensuring scalability without compromising quality. By eliminating mechanical stress and burrs, PCE not only delivers exceptional performance but also extends the life cycle of your components, saving time and costs in assembly and maintenance. Ready to elevate your product performance? Contact us today to explore how our tailored etching solutions can revolutionise your industry. You can see more by registering for our on-line webinar here - https://lnkd.in/ewJFFNa5 #PhotoChemicalEtching #PrecisionEngineering #MicrometalGroup #HighPerformanceComponents #InnovationInManufacturing #PrecisionMatters
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𝗧𝗿𝗲𝘀𝗸𝘆’𝘀 𝟮𝟬𝟮𝟰: 𝗔 𝗬𝗲𝗮𝗿 𝗼𝗳 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻𝘀, 𝗖𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻𝘀, 𝗮𝗻𝗱 𝗠𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲𝘀 As 2024 draws to a close, we at Tresky are proud to reflect on a year filled with remarkable achievements. From pioneering technologies to global events, here’s a recap of the highlights that defined our journey. 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀 🚀 • Large-Area Sintering One of our major breakthroughs in 2024 was enabling dispensing over areas larger than 100 mm² for large-area sintering. This advancement addresses critical challenges in power electronics, especially for e-mobility applications. Learn more about large area sintering: https://lnkd.in/e4h84hGi • Expanded Contract Manufacturing Services We strengthened our service portfolio with state-of-the-art equipment, including a vacuum soldering system and a sintering press delivering up to 15 kN of force. Learn more about your solution for prototyping and small series in semiconductor assembly: https://lnkd.in/ebdpb3wk • Laser- and photodiodes DIE bonding in optoelectronics💡 In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky GmbH, as a leading manufacturer of DIE bonding systems, offers customized solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes For more information please visit https://lnkd.in/eMBnqa8w 𝗧𝗵𝗼𝘂𝗴𝗵𝘁 𝗟𝗲𝗮𝗱𝗲𝗿𝘀𝗵𝗶𝗽 𝗮𝗻𝗱 𝗞𝗻𝗼𝘄𝗹𝗲𝗱𝗴𝗲 𝗦𝗵𝗮𝗿𝗶𝗻𝗴 📘 In 2024, we released two white papers co-authored by our CEO, Daniel Schultze, and Dr. Aaron Hutzler from Bond Pulse GmbH. This publication explored the motivations and techniques behind pressure-assisted metallic sintering and large area sintering in power electronics offering key insights for electronics professionals. Download: https://lnkd.in/d2PhPeF8 We look forward to the year 2025 together. Many thanks to all our customers, partners and the entire Tresky team! #Tresky #PowerElectronics #DIEBonding
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❓ What is the Bosch Process? (Part 1) ❓ The Bosch process alternates between depositing a protective film and etching, achieving high aspect ratio etching with excellent selectivity. This technique is ideal for MEMS and packaging applications, enabling faster and deeper etching with impressive precision. Why should you be interested? The Bosch process offers: ・High aspect ratio etching for creating intricate features. ・Superior selectivity for precise etching without damaging surrounding material. ・Versatility in applications from MEMS to TSV and optical components. Our flagship RIE-800iPB system supports both Bosch and Non-Bosch processes, delivering flexible, efficient, and high-quality etching solutions. Whether you're tackling MEMS, TSV, or complex packaging challenges, Samco Inc.'s Si-DRIE technology can meet and exceed your expectations. Curious to learn more? Read our report below to explore the capabilities of the Bosch process and how it can revolutionize your silicon etching projects. Let us know in the comments your expectations for future applications and whether you have ever used the Bosch Process before! #SiDRIE #BoschProcess #MEMS #Semiconductor #Innovation #EtchingTechnology #ThinkSamco #HighAspectRatio #PlasmaEtching #Microfabrication
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WEBINAR: Fundamentals of Display Metrology | Radiant Vision Systems https://lnkd.in/d-gedqS5 The significance of displays is evident in their ubiquity across technologies and industries and their footprint, growing to encompass entire device surfaces and fields of view. Display metrology provides an objective understanding of a display’s quality and performance through data, supplying tools for display innovation and evaluation to safeguard manufacturing investment. This webinar will provide a fundamental understanding of display metrology and an overview of measurement equipment and techniques used for display development and manufacturing inspection.
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The 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝘆 is heavily pushing for smaller, more powerful, and more energy-efficient devices. Fan-Out Panel Level Packaging (FOPLP) addresses these needs by creating lower thermal resistance, a slimmer package, and potentially lower costs. 𝗧𝗵𝗲 𝗺𝗮𝗶𝗻 𝗮𝗱𝘃𝗮𝗻𝘁𝗮𝗴𝗲𝘀 𝗮𝗿𝗲: 𝗦𝗰𝗮𝗹𝗮𝗯𝗶𝗹𝗶𝘁𝘆: Larger panels mean that more chips can be produced in a single batch, improving manufacturing scalability and efficiency. 𝗖𝗼𝘀𝘁 𝗥𝗲𝗱𝘂𝗰𝘁𝗶𝗼𝗻: The use of larger substrates and more efficient production processes can significantly reduce the per-unit cost of semiconductor packages. 𝗘𝗻𝗵𝗮𝗻𝗰𝗲𝗱 𝗣𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲: The ability to integrate more complex interconnect structures and optimize layout on a larger scale can lead to better electrical performance and reliability. 𝗗𝗲𝘀𝗶𝗴𝗻 𝗙𝗹𝗲𝘅𝗶𝗯𝗶𝗹𝗶𝘁𝘆: Larger working areas allow designers to create intricate, high-performance RDL patterns, enabling advanced semiconductor packages that meet the demanding requirements of modern electronics. With over 8,000 equipment installations worldwide, Manz is since decades a trusted partner to top manufacturers and has a proven record for FOPLP mass production lines. We’d like to bring your production to the next level. Get in touch with our expert Chris Huang or visit our website: https://lnkd.in/gf6jW7z5 #semiconductor # advancedpackaging #FOPLP #panellevelpackaging #semiconductorproduction #semiconductorindustry
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🌐 Leading the Global Market in MPCVD Machines for Diamonds and Advanced Applications 💎 At Asian Lab Grown Diamonds, we specialize in manufacturing and exporting state-of-the-art MPCVD machines to meet the evolving needs of industries worldwide. From 6kW, 10kW, and 12kW (2.45 GHz) systems to the powerful 36kW (915 MHz) machines, our technology drives breakthroughs in lab-grown diamonds, electronics, and semiconductor applications. Our machines are in high demand across Europe, America, Africa, and the Middle East, helping companies push boundaries in luxury goods and advanced industrial processes. What Sets Us Apart? Comprehensive Power Options: Machines designed to scale from specialized applications to industrial-grade production. Precision Engineering: Delivering uniform diamond growth and exceptional process control for advanced applications. Global Presence: A trusted name across continents for unparalleled performance and reliability. Join us as we shape the future of diamond technology, electronics, and semiconductors with cutting-edge MPCVD solutions. #MPCVD #GlobalTechnology #LabGrownDiamonds #AdvancedManufacturing #Semiconductors #ElectronicsInnovation #DiamondProduction #EngineeringExcellence Asianlab Grown Diamonds LLP
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Is your Surface Mount Technology (SMT) process keeping pace with the rapidly evolving demands of electronics manufacturing? Surface Mount Technology (SMT) in manufacturing faces persistent challenges—inefficiencies, lack of traceability, and rigid processes can impede production and inflate costs. Many businesses are stuck with outdated methods that limit their agility and accuracy. KASH Tech's SMT digitization transforms these processes by integrating real-time monitoring, comprehensive data analytics, and robust traceability solutions. Our approach enhances productivity by up to 40%, cuts costs by up to 30%, and offers the flexibility needed to adapt quickly to market demands. Elevate your SMT process with KASH Tech. Discover how we can streamline your operations and drive better results. Contact us today for a demo or free consultation and see how KASH Tech can revolutionize your SMT processes! https://lnkd.in/guqnC4Gw #SMT #Manufacturing #DigitalTransformation #KASHTech #Electronics #Automotive #Innovation
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Chairman & CEO at Aimtron | Visionary Entrepreneur | Strategic Leader | Passionate Philanthropist
2moInteresting event!