Apacer will unveil a wide selection of new DRAM modules at our VIP Reveals event during COMPUTEX. In fact, there are quite a few new acronyms out there – are you sure what all of them stand for? Here’s a little “cheat sheet” to help keep you up to date: MRDIMM 🔊 No, it’s not “Mister DIMM!” (Although I’ve heard some engineers do call it that.) Actually, MRDIMM stands for Multi-ranked Buffered Dual In-line Memory Module. No explanation for why the “B” in Buffered isn’t represented in the acronym. LPDDR5X CAMM2 🔊 OK, a two-parter! Well, DDR5 will be immediately recognizable to most of our followers, as it was one of the big DRAM success stories of 2023. LPDDR5X stands for “Low Power Double Data Rate 5X.” Here, the “5X” indicates the generation of LPDDR – 5X is the highest currently available. And as for CAMM2 – well, JEDEC (the group that creates these standards) has published that it stands for Compression Attached Memory Module, although that doesn’t explain what the 2 stands for, unfortunately. DDR5 CXL 🔊 DDR5 we already know, but CXL stands for Compute Express Link, which is a technology that connects CPUs directly to devices or to memory to perform high-speed, high-capacity operations. That’s all the new acronyms we think you need to know! Come check out the actual products at Apacer’s VIP Reveals event during COMPUTEX! #DRAM #DDR5 #LPDDR5CAMM2 #MRDIMM #DDR5CXL
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Here’s an episode of a technical series Nonbox produced for FormFactor.
#AdvancedPackaging is enabling complex technologies that demand advanced testing techniques. In this video, we delve into the significance of testing thousands of chiplets used in CPUs, GPUs, HBM, I/O, and interposers on a single wafer. FormFactor's CEO, Mike Slessor, explains how the company is addressing these challenges with innovative testing solutions. https://lnkd.in/gy3nk6Vi
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#AdvancedPackaging is enabling complex technologies that demand advanced testing techniques. In this video, we delve into the significance of testing thousands of chiplets used in CPUs, GPUs, HBM, I/O, and interposers on a single wafer. FormFactor's CEO, Mike Slessor, explains how the company is addressing these challenges with innovative testing solutions. https://lnkd.in/gy3nk6Vi
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In Dec 2023, #AMD showed a 4x performance advantage on the #Instinct #MI300 #APU vs. traditional discrete #GPUs. Many asked, how was this accomplished? And how can other teams achieve similar acceleration? We are pleased to announce a publication at: https://lnkd.in/gy94ea-9 appearing at #ISC 2024, "Porting HPC Applications to AMD Instinct MI300A Using Unified Memory and OpenMP" which is intended to serve as a guide to application developers on how to program, using portable directives such as OpenMP, to leverage the tight integration of CPU and GPUs on the same package in the same memory space (i.e., the APU). The paper encompasses the programming model, memory model, and performance profiling in OpenFOAM's HPC_motorbike. The 4x performance benefit came from eliminating page migrations, rapid access between the CPU or GPU cores, and increased memory bandwidth delivered to the CPUs. Be sure to stop by the technical talk by Suyash Tandon, Ph.D. at ISC on Tuesday, May 14th! More details at: https://t.co/dkNIIQm0LF Brent Gorda Daniele Piccarozzi, MBA Hisaki Ohara Nicholas Malaya
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On Dec 2023, #AMD showed a 4x performance advantage on the #Instinct #MI300 #APU vs. traditional discrete #GPUs. Many asked, how was this accomplished? And how can other teams achieve similar acceleration? I'm pleased to announce a publication at: https://lnkd.in/gy94ea-9 appearing at #ISC 2024, "Porting HPC Applications to AMD Instinct MI300A Using Unified Memory and OpenMP" which is intended to serve as a guide to application developers on how to program, using portable directives such as OpenMP, to leverage the tight integration of CPU and GPUs on the same package in the same memory space (i.e., the APU). The paper encompasses the programming model, memory model, and performance profiling in OpenFOAM's HPC_motorbike. The 4x performance benefit came from eliminating page migrations, rapid access between the CPU or GPU cores, and increased memory bandwidth delivered to the CPUs. Be sure to stop by the technical talk by Suyash Tandon, Ph.D. at ISC on Tuesday, May 14th! More details at: https://t.co/dkNIIQm0LF Many thanks to co-authors: Carlo Bertolli, Leopold Grinberg, Gheorghe-Teodor Bercea, Mark Olesen, and Simone Bnà
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Modern off-the-shelf CPUs and GPUs leverage pattern-of-life analysis techniques, such as Kernel Density Estimation (KDE), to enhance branch prediction accuracy. In branch prediction, understanding execution patterns—akin to identifying behavioral trends—helps processors anticipate which instruction path a program will take, minimizing pipeline stalls. KDE, a non-parametric method for estimating probability density functions, is used to model historical execution data and identify frequent or recurring branches, enabling processors to predict branches more accurately. www.sarahai.net
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Broadcasts, Networking, Wireless, and industrial solutions with the powerful #Agilex5 System on Module(#SoM)! The Agilex 5 SoM is optimized for power and size, ideal for intelligent applications at the edge. The SoM supports high-speed transceiver interfaces, PCIe Gen4, and DDR5 memory, and built to power edge computing. Discover more about the latest SoM from iWave: https://rb.gy/wjael7 #iWaveGlobal #AI #EmbeddedSystems #MachineLearning #FPGA
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With AGI becoming prohibitively compute-hungry with the ever increasing number of parameters, and therefore suited for GPUs, especially for the model training task, how much longer before narrow-AI becomes suitable for CPU-based inference first and then expand to training? IEEE article from June 23 spoke of this case not being entirely dead, but a year later, where are we?
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Introducing our High-Power Thermal Test Emulator (TTE) – the ultimate solution for precise thermal simulation and performance testing in rack servers. A TTE is a Thermal Test Vehicle (TTV) designed to replicate the thermal output of high-performance components like CPUs, GPUs, AI servers, and other semiconductors. It provides engineers with accurate heat simulations, allowing them to test and validate cooling solutions—including heatsinks, fans, and liquid cooling systems—before final hardware is ready. TTEs are widely used in R&D labs, server environments, and HPC systems to optimize thermal management for better performance. Learn more about our new High-Power Thermal Test Emulator by clicking the link below. #NewProduct #ThermalTest #TTE #PerformanceTesting #CoolingSolutions #ThermalManagement #KLCExperts
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#electronic #load #inductance #current #step #slewrate Quantifying The Impact Of Series Inductance On E-Load Edge Rates And Current Monitoring Accuracy At low supply voltages, used for modern CPUs and AI processors, current path series inductance can have a considerable impact on the e-load di/dt and its ability to support the projected step size. Details: https://lnkd.in/eE9sTfTJ
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