FormFactor Inc.’s Post

Here’s an episode of a technical series Nonbox produced for FormFactor.

Apacer will unveil a wide selection of new DRAM modules at our VIP Reveals event during COMPUTEX. In fact, there are quite a few new acronyms out there – are you sure what all of them stand for? Here’s a little “cheat sheet” to help keep you up to date:   MRDIMM 🔊   No, it’s not “Mister DIMM!” (Although I’ve heard some engineers do call it that.) Actually, MRDIMM stands for Multi-ranked Buffered Dual In-line Memory Module. No explanation for why the “B” in Buffered isn’t represented in the acronym.   LPDDR5X CAMM2 🔊   OK, a two-parter! Well, DDR5 will be immediately recognizable to most of our followers, as it was one of the big DRAM success stories of 2023. LPDDR5X stands for “Low Power Double Data Rate 5X.” Here, the “5X” indicates the generation of LPDDR – 5X is the highest currently available.   And as for CAMM2 – well, JEDEC (the group that creates these standards) has published that it stands for Compression Attached Memory Module, although that doesn’t explain what the 2 stands for, unfortunately.    DDR5 CXL 🔊   DDR5 we already know, but CXL stands for Compute Express Link, which is a technology that connects CPUs directly to devices or to memory to perform high-speed, high-capacity operations.   That’s all the new acronyms we think you need to know! Come check out the actual products at Apacer’s VIP Reveals event during COMPUTEX!   #DRAM #DDR5 #LPDDR5CAMM2 #MRDIMM #DDR5CXL 

With AGI becoming prohibitively compute-hungry with the ever increasing number of parameters, and therefore suited for GPUs, especially for the model training task, how much longer before narrow-AI becomes suitable for CPU-based inference first and then expand to training? IEEE article from June 23 spoke of this case not being entirely dead, but a year later, where are we?

Unleash the performance of PCIe 6.x for next-gen #AI! PCIe 6.x technology is revolutionizing how GPUs, CPUs, and AI accelerators handle demanding AI workloads in hyperscale systems. To unlock their full potential, rigorous testing is crucial for ensuring seamless plug-and-play interoperability – a must for rapid AI development. Discover how we support standards compliance and system-level interoperability of these components with our Aries Smart DSP Retimers in our #Cloud-Scale Interop Lab. Learn more about 'Why We Test'!" Watch now:

In Dec 2023, #AMD showed a 4x performance advantage on the #Instinct #MI300 #APU vs. traditional discrete #GPUs. Many asked, how was this accomplished? And how can other teams achieve similar acceleration? We are pleased to announce a publication at: https://lnkd.in/gy94ea-9 appearing at #ISC 2024, "Porting HPC Applications to AMD Instinct MI300A Using Unified Memory and OpenMP" which is intended to serve as a guide to application developers on how to program, using portable directives such as OpenMP, to leverage the tight integration of CPU and GPUs on the same package in the same memory space (i.e., the APU). The paper encompasses the programming model, memory model, and performance profiling in OpenFOAM's HPC_motorbike. The 4x performance benefit came from eliminating page migrations, rapid access between the CPU or GPU cores, and increased memory bandwidth delivered to the CPUs. Be sure to stop by the technical talk by Suyash Tandon, Ph.D. at ISC on Tuesday, May 14th! More details at: https://t.co/dkNIIQm0LF Brent Gorda Daniele Piccarozzi, MBA Hisaki Ohara Nicholas Malaya

On Dec 2023, #AMD showed a 4x performance advantage on the #Instinct #MI300 #APU vs. traditional discrete #GPUs. Many asked, how was this accomplished? And how can other teams achieve similar acceleration? I'm pleased to announce a publication at: https://lnkd.in/gy94ea-9 appearing at #ISC 2024, "Porting HPC Applications to AMD Instinct MI300A Using Unified Memory and OpenMP" which is intended to serve as a guide to application developers on how to program, using portable directives such as OpenMP, to leverage the tight integration of CPU and GPUs on the same package in the same memory space (i.e., the APU). The paper encompasses the programming model, memory model, and performance profiling in OpenFOAM's HPC_motorbike. The 4x performance benefit came from eliminating page migrations, rapid access between the CPU or GPU cores, and increased memory bandwidth delivered to the CPUs. Be sure to stop by the technical talk by Suyash Tandon, Ph.D. at ISC on Tuesday, May 14th! More details at: https://t.co/dkNIIQm0LF Many thanks to co-authors: Carlo Bertolli, Leopold Grinberg, Gheorghe-Teodor Bercea, Mark Olesen, and Simone Bnà

Intel Corporation has recently published a paper demonstrating substantial performance gains from 5th Gen Intel® Xeon® processors, including up to 2.08x improvement compared to 3rd Gen Xeon CPUs, as well as up to 1.26x gains from Intel AVX-512 technology compared to predecessor Intel AVX2 technology - using MatLogica AADC. #Intel #XeonProcessors #TechInnovation #PerformanceImprovement #TechnologyNews #DataCenterTechnology #CPUPerformance #AVX512 #IntelTechnology #TechUpdate #QuantitativeFinance #QuantModeling #autodiff https://lnkd.in/dnppncur

#DellTechnologies has worked with http://Scalers.ai and Broadcom to develop a PoC for detecting Pneumonia in X-rays. Using a single Dell #PowerEdge server with AMD CPUs, an AI model was trained and ran on the CPU alone, and pneumonia could be detected in X-rays with significant accuracy. Watch video: http://tdas.so/9EF194

Reminder -- Our QPUs are back online! 🎉🖥️ Effortlessly run your quantum programs on our powerful CPUs, GPUs, and QPUs 🔬💻 Here's the current QPU availability: ⏰ •Mon: 08:00 - 10:00 UTC •Tue: 08:00 - 10:00 UTC •Wed: 08:00 - 10:00 UTC •Thu: 13:00 - 15:00 UTC •Fri: 13:00 - 15:00 UTC For the latest schedule, bookmark https://lnkd.in/exRP4dyd Submit your tasks now and utilize our GPUs when they are online. No waiting is required! ⏳✅ #QuantumComputing #BlueQubit #Innovation #Computing

Introducing our High-Power Thermal Test Emulator (TTE) – the ultimate solution for precise thermal simulation and performance testing in rack servers. A TTE is a Thermal Test Vehicle (TTV) designed to replicate the thermal output of high-performance components like CPUs, GPUs, AI servers, and other semiconductors. It provides engineers with accurate heat simulations, allowing them to test and validate cooling solutions—including heatsinks, fans, and liquid cooling systems—before final hardware is ready. TTEs are widely used in R&D labs, server environments, and HPC systems to optimize thermal management for better performance. Learn more about our new High-Power Thermal Test Emulator by clicking the link below. #NewProduct #ThermalTest #TTE #PerformanceTesting #CoolingSolutions #ThermalManagement #KLCExperts