Dario Gil’s Post

#Chips are the backbone of almost every digital device we use, from smartphones to medical equipment — and extreme ultraviolet (EUV) lithography is the process behind producing the next generation of chips that are even more powerful and energy efficient. The application of EUV technology enables America to be at the forefront of #semiconductor R&D to advance the U.S.’s global leadership in chip production and innovation. It’s one of the reasons why IBM was proud to support the CHIPS Act in 2022, when Congress came together in a bipartisan way to make historic investments in our economy and accelerate U.S. leadership in semiconductor innovation.       As a proud New Yorker and IBMer, I’m excited to see the announcement that Natcast.org has awarded the National Semiconductor Technology Center (NSTC) EUV Center to New York State, at the Albany NanoTech Complex owned and operated by NY CREATES. Thanks to smart public policy and these investments, this technology will likely contribute to boosting global competitiveness, strengthening national security, and benefiting Americans. This center will provide NSTC members with access to the latest EUV technology, and help pioneer the next generation of semiconductor R&D.      I could not think of a better place for this center. With the NSTC EUV Center, New York State is uniquely positioned to help advance American semiconductor leadership and innovation.   https://lnkd.in/eQFPwWRy 

https://lnkd.in/eq5Pz2TE 🌞 Great news for the region, and the semiconductor industry! A validation of the success of the last decade driven by an ecosystem approach. Ready to accelerate the next decade of innovation in #EUV!

Really big news out of Albany today. Natcast.org has announced that the Albany NanoTech Complex, run by NY CREATES, will be the home to the America EUV Accelerator, the first national EUV center in the US. The goal of the facility will be to advance the state of the art in EUV lithography to help usher in the next generation of chips designs, ensuring that the US remains a leader in chip innovation and production. With the advent of AI, finding new ways to meet its energy and processing demands with new hardware is paramount. IBM has been a key partner at Albany NanoTech for years, and many of our biggest breakthroughs in semiconductors have been born out of research there, including the world's first 2nm node semiconductors. IBM Research has even already shown the first working proof of designing wafers using the next-generation High NA EUV technology, before a machine has even made it to Albany. It's a really exciting time for the future of semiconductors. Read more about what's in store here: https://lnkd.in/eegHX4uH #technology #semiconductors #ai #chips #euv

sn-news: #us #electronics #semiconductors U.S. Chip Revival Plan Chooses Sites Albany and Silicon Valley land two of three National Semiconductor Technology Center locations

Expect a Wave of Wafer-Scale Computers TSMC tech allows for one version now and a more advanced version in 2027 At TSMC’s North American Technology Symposium on Wednesday, the company detailed both its semiconductor technology and chip-packaging technology road maps. While the former is key to keeping the traditional part of Moore’s Law going, the latter could accelerate a trend toward processors made from more and more silicon, leading quickly to systems the size of a full silicon wafer. Such a system, Tesla’s next generation Dojo training tile is already in production, TSMC says. And in 2027 the foundry plans to offer technology for more complex wafer-scale systems than Tesla’s that could deliver 40 times as much computing power as today’s systems. https://lnkd.in/dJdp9_7C

Great to see this progress as we continue to push the boundaries of what's possible in semiconductors. https://lnkd.in/g7fzAEZa #albany #semi #semiconductor #NTSC #research #2nm

Glass substrates to replace 2.5D package in chips in the future The commercialization of glass substrates will threaten the dominance of advanced packaging #technology currently in use such as chip-on-wafer-on-substrate (#CoWoS) of TSMC, according a university professor. Glass substrates’ target market was clear and they will be used in #AI and #server #semiconductors in the high-end segment of the #chip market, Georgia Institute of Technology professor Yong Won Lee, whose expertise is #advancedpackaging, said during an industrial conference in #Seoul on Tuesday. CoWoS is TSMC’s 2.5D package technology where #chip dies such as #CPU, #GPU, I/O, #HBM, and others are stacked vertically on an interposer. NVIDIA’s #A100 and #H100 as well as Intel Corporation's Gaudi is made using this technology. Glass substrates are being touted as the future of package substrates that will replace the currently widely used flip-chip ball grid array (FC-BGA). Thanks again to Noh Tae Min and www.thelec.net for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eMKqNGT6 #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #chip #chips #foundry #it #cloud #datacenter #ai #ic

eeNews Europe top news in November https://lnkd.in/dkm5eUay With #Schneider ousting its CEO in a shock move, #Samsung cutting staff in its foundry business and Atos selling off its supercomputer and quantum business, eeNews Europe in November had plenty of news about restructuring. While the Chinese owner of chip designer FTDI Chip in Glasgow is having to sell its stake under the new security law, Analog Device bought the assets of Flex Logix, opening up the opportunities for adding AI to the embedded microcontrollers it acquired with Maxim Integrated.  #TSMC and #Intel are capturing the last vestiges of the US CHIPS and Science Act, with Intel seeing its support trimmed. Germany also saw cash for a semiconductor skills academy across the country, bringing in many local institutions. New chips were also popular news in November. The first 64bit microcontroller from Texas Instruments captured plenty of interest, as did Infineon Technologies’s TriCore-based Aurix TX4x and a universal #RISC-V AI processor from Ubitium in Dusseldorf and Karlsruhe that promises to run all the algorithms from CPUs, GPUs and DSPs. But the top news of the month was a billion dollars for a leading edge EUV centre in the US. While Dutch lithography technology leader ASML is part of the centre in Albany, New York, to stimulate a supply chain for EUV lithography in the US. That will be an interesting story that will run and run, starting with funding to develop new glass locally for EUV lenses.

Problem: How do you make more complex AI chips while designing energy-efficient computing? Answer: Breakthroughs in pure material science. To kickoff SEMICON West in San Francisco Applied Materials announced two materials engineering innovations -- designed to extend copper interconnect wiring to the 2nm node and beyond. As chipmakers continue to shrink features with each generation, they must also shrink the copper wires, which connect billions of transistors on a chip. Applied’s breakthroughs are overcoming challenges with next-generation wiring and allowing chipmakers to scale into the “angstrom era.” Checkout our coverage in Venture Beat. #AppliedMaterials #GreatThingsHappenHere https://lnkd.in/erWKTvUf

The future of AI is dependent on computing power, and the semiconductor industry is rising to meet the challenge. With the potential of reaching the 1T transistor mark by the end of the decade, we are witnessing a significant increase in transistor counts. Regarding GPU performance and efficiency, transistor counts are a big decider. Firms like TSMC are optimistic about the future of semiconductor integration and plan to reach the 1T transistor goal over the next decade, categorizing it as an essential step for progress. NVIDIA's recently revealed Blackwell GPU architecture features 208B transistors; the industry expects to be five times this amount over the next decade. The future of AI is looking bright with the semiconductor industry's advancements. #chips #transistors #semiconductors #semiconductorindustry #semiconductormanufacturing #innovation #technology #technologynews