Let our latest 32G UCIe IP subsystem in TSMC’s advanced 3nm process help you achieve your design success. This new IP enhances die-to-die connectivity and builds on our tradition of thorough testing and strong ecosystem partnerships. Our 32G IP offers new features while retaining the user-friendly aspects of our 16G IP, continuing to make integration seamless and efficient. Discover how our latest IP can help you reach your design targets faster. Learn more: https://ow.ly/A3LV50Urw4H
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Energy efficiency is crucial for performance and sustainability. Our 32G UCIe IP Subsystem excels in energy optimization while maintaining seamless integration and flexibility. This advancement underscores our commitment to smarter, sustainable technology for today's market. #EnergyEfficiency #Innovation #SustainableTech #IPSubsystem #CustomerFocus
Let our latest 32G UCIe IP subsystem in TSMC’s advanced 3nm process help you achieve your design success. This new IP enhances die-to-die connectivity and builds on our tradition of thorough testing and strong ecosystem partnerships. Our 32G IP offers new features while retaining the user-friendly aspects of our 16G IP, continuing to make integration seamless and efficient. Discover how our latest IP can help you reach your design targets faster. Learn more: https://lnkd.in/gdG_QtJf
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Devices that benefit most from LPDDR4X are those requiring efficient power management and high-speed data processing, such as smartphones, tablets, and other portable or embedded systems. Its low voltage operation and high data rates make it ideal for running advanced applications and handling demanding tasks.
We’ve expanded our offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4x devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package. Learn more at https://zurl.co/v2Bl.
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Once again, TechInsights is here to provide technical analysis around new technologies and devices. Take a look at our findings around the new Huawei #Pura70Ultra. #huawei #teardown #semiconductoranalysis #SMIC #HiSiliconKirin
The TechInsights team has been busy tearing down and undertaking the technical analysis to confirm the components of the Huawei Pura 70 Ultra. We can confirm, with high confidence, that the HiSilicon Kirin 9010 system-on-chip (SoC) is manufactured using SMIC’s 7nm N+2 process node. Find out more. https://bit.ly/4bcvSJF #HiSiliconKirin #Huawei #Teardown
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Announcing the latest additions to Qorvo's innovative RF and power portfolio of Wi-Fi 7 front end modules, Wi-Fi filters and gain power doubler hybrid amplifiers, which serve a wide range of DOCSIS 4.0, broadband and wireless access point applications. These high-performance solutions simplify RF and power for designers worldwide and are available at Qorvo's authorized channel partner. https://lnkd.in/dfF24KPE
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Article highlighting the introduction of the Lumissil new Automotive MCU with Integrated LIN Phy - IS32CS8976 and IS32CS8978 devices. https://lnkd.in/e9ssqrWT
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In today's embedded systems and consumer electronics landscape, high-performance, low-power, and reliable storage solutions are crucial. Today, let's dive into a premium flash memory chip produced by Winbond Electronics Corp., the W25Q128JVSIQ. This chip not only boasts impressive performance but also comes with various advanced features, making it an ideal choice for numerous applications. For more information, please click:https://lnkd.in/ggYX8E_N
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TechInsights’ team provides the first look at the HiSilicon Kirin 9020 processor powering the Huawei Mate 70 Pro+. Confirming, with high confidence, that the HiSilicon Kirin 9020 processor is manufactured using SMIC’s 7nm (7N+2) process node. Read more on the TechInsights Platform (no log-in required) https://bit.ly/49visc5 #Huawei #Mate70ProPlus #Kirin9020 #SMIC #Semiconductors #ChipAnalysis #TechInsights
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In today's rapidly evolving digital world, Field-Programmable Gate Arrays (FPGAs) have become the cornerstone of numerous electronic design fields due to their high flexibility and reconfigurability. Among them, the XCF32PFSG48C chip, from Xilinx (now part of AMD's Xilinx division), stands out with its outstanding performance and broad application compatibility. Today, let's delve into this remarkable product. For more information, please click:https://lnkd.in/g3PHgfm4
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Fresh off the introduction of the Marvell® Structera™, a new family of CXL controllers, Khurram Malik, Director, CXL Marketing, will be presenting on CXL at the FMS: Future of Memory and Storage event. Malik's topic of discussion is "CXL: Closing the Memory Gap." Find all the details in the link below. And, remember to stop by the Marvell booth #1046 for even more important updates and information. Session details: https://mrvl.co/3WxzeBk
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Selecting the right MCU for an embedded project is an important decision relying on the project's specific requirements, as the chosen MCU directly influences the functionality, efficiency, and scalability of the project. Learn how to select the right one for your embedded projects. Check out the full article in collaboration with Mouser Electronics here: https://lnkd.in/eQ26xPrF -------------------------------- How to get your company on Wevolver? Wevolver is a platform used by millions of engineers to stay up to date about the latest technologies. Learn how your company can connect with the community and reach a global audience of engineers: https://lnkd.in/gtbsMuU2
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