iNEMI’s Post

Get the presentation from iNEMI’s PCB Connector Footprint Tolerance Project webinar — This iNEMI project evaluated specification requirements for complex double-sided connector land patterns to provide information to help users understand risks and make informed decisions. I/O bandwidth increase has had a profound impact on PCB design and fabrication in the last few years and further changes are expected in the near future. Everything from material to trace geometries and interconnect technologies have had to change to meet next-generation requirements. This end-of-project webinar covered the current state of PCB fabrication capability with respect to add-in-card patterns and other patterns with similar challenges like those for straddle mount connectors, and talked about how designers can navigate the increasing requirements to produce quality products. The project team provided insights regarding future expectations from the connector industry and made recommendations for designers, PCB fabricators, connector suppliers and standards development organizations. https://lnkd.in/e2i5mshD

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