iNEMI

iNEMI / MIT Webinar on Optical Adhesives for High-Volume Sustainable Photonics Deployment — Join us Tuesday, December 10, to learn about the FUTUR-IC initiative to accelerate development and adoption of economically and environmentally sustainable optical adhesive materials. FUTUR-IC is led by the Massachusetts Institute of Technology (MIT) and funded by the National Science Foundation (NSF). In this webinar, we will discuss highlights of FUTUR-IC and its objectives. We will also review information about an iNEMI / MIT survey on optical adhesives. Get additional details. https://lnkd.in/eaUnMUdC

Get the presentation from iNEMI’s PCB Connector Footprint Tolerance Project webinar — This iNEMI project evaluated specification requirements for complex double-sided connector land patterns to provide information to help users understand risks and make informed decisions. I/O bandwidth increase has had a profound impact on PCB design and fabrication in the last few years and further changes are expected in the near future. Everything from material to trace geometries and interconnect technologies have had to change to meet next-generation requirements. This end-of-project webinar covered the current state of PCB fabrication capability with respect to add-in-card patterns and other patterns with similar challenges like those for straddle mount connectors, and talked about how designers can navigate the increasing requirements to produce quality products. The project team provided insights regarding future expectations from the connector industry and made recommendations for designers, PCB fabricators, connector suppliers and standards development organizations. https://lnkd.in/e2i5mshD

iNEMI End-of-Project Webinar: High-Density Interconnect Socket Warpage Prediction & Characterization — High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases. With large sockets, dynamic warpage prediction and control during reflow onto the PCB is a significant challenge, and simulation is critical in the product development process. An ability to speed up computation while retaining accuracy is needed to shorten socket design cycle. Phase 2 of the High-Density Interconnect Socket Warpage Prediction & Characterization project improved socket warpage simulation accuracy and assessed the impact of molding materials and design on warpage for large sockets. The team investigated a new Mori-Tanaka mechanics model as it has the ability to incorporate both the polymer matrix and the anisotropic effect of fillers. This end-of-project webinar will report the results and lessons learned from their efforts. Get additional details. https://lnkd.in/egmjfu56

iNEMI Sustainable Electronics Tech Topic Webinar: IPC’s Sustainability for Electronics Program —Electronics companies have obligations to balance environmental, social, and economic sustainability drivers, and these obligations are increasing in number and scope. Companies must fulfill sustainability reporting and disclosure requirements, meet resource efficiency targets and minimize waste, ensure value chain resiliency, and develop and support workforce talent. IPC’s Sustainability for Electronics Program provides data-driven and evidence-based solutions that support electronics manufacturers’ businesses. Join us December 4 when iNEMI hosts guest speaker Dr. Kelly Scanlon, IPC’s Lead Sustainability Strategist, who will share information about IPC’s program and the solutions they are working on for the industry.  Register for this webinar. https://lnkd.in/dDgdcePd

iNEMI / MAESTRO Presentation to San Diego Chapters of IMAPS and ACers — Urmi Ray (iNEMI) will be presenting to a joint chapter meeting of iMAPS and ACers on Friday, November 9, at San Diego State University. Urmi will summarize 5G/6G MAESTRO, a roadmap effort supported by the NIST Office of Advanced Manufacturing, to create in the U.S. a world-leading knowledge base, technical expertise and a staged approach to mmWave material selection, characterization, and test to support the development and manufacture of leading edge 5G and 6G products. This roadmap continues to serve as a foundation for many new activities being undertaken by the CHIPS and Science Act. Registration for this meeting is free. Get additional details. https://lnkd.in/gz6gU54a

iNEMI End-of-Project Webinar: Investigation of AI Enhancement to AOI for PCBAs — Join us November 12 or 13 for highlights of iNEMI’s evaluation and validation of AI-enhanced AOI systems. The integration of artificial intelligence (AI) has emerged as a promising solution to enhance the capabilities of automated optical inspection (AOI) systems. It can help address the challenges of high false call rates and defect escapes, especially in more complex electronic designs. Initial project work by iNEMI evaluated and recommended AI technologies for AOI, established common performance metrics, and prepared test vehicles. In the second phase of the project, which is the focus of this webinar, the project team conducted rigorous experimentation using the metrics and test vehicles established in Phase 1. This webinar will report results and lessons learned from this effort and will also discuss challenges and future work in adopting AI into AOI. https://lnkd.in/eRCSvHq5

iNEMI Packaging Tech Topic Webinar: Navigating Advanced IC Substrate Technology and Market Trends — Join us November 6 when we welcome guest speaker M. Bilal Hachemi, Ph.D., Technology and Market Analyst for the Yole Group. In this webinar Dr. Hachemi will explore the latest trends and roadmaps in advanced IC substrates, focusing on the roles of organic and glass core technologies in enhancing package-level integration for AI and HPC applications. He will talk about the industry's progress in adopting glass substrates and trends in areas such as interconnect scaling, thermal management, and substrate reliability. He will also map new investments and capacity expansions around the globe. Register for this webinar. https://lnkd.in/eUF3AWvJ

Mark Schaffer, INEMI Project Manager and Sustainable Electronics Lead, was one of three presenters at the third technical experts meeting of the IPEF Critical Minerals Dialogue on Recycling and Recovery in September. In this virtual meeting, Mark shared information about iNEMI’s efforts in sustainability and circularity. The Indo-Pacific Economic Framework for Prosperity (IPEF) is a partnership among 14 countries committed to fuel inclusive, sustainable growth to create a stronger, fairer, more resilient economy for families, workers, and businesses in the United States and in the Indo-Pacific region. Read more. https://lnkd.in/eFnsnRgC

iNEMI PCB Connector Footprint Tolerance End-of-Project Webinar — Join us Monday, October 28, for information about this project’s investigation of industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. The ongoing reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. This iNEMI project aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. The team identified potential risks and surveyed the PCB industry to assess supplier capabilities for appropriate quality mitigation. This end-of-project webinar will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control. Get additional details. https://lnkd.in/eHYXdhKx   

Paul Wang (MiTAC Computing Technology) will present “iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 Years Beyond” at the SMTA International conference. His presentation is part of Session MFX2: Large Panel Assembly (Tuesday, October 22 / 10:30 a.m. - 12:00 p.m.) If you plan to be at SMTA International this year, be sure to check out this presentation, along with several others by iNEMI project teams. Hope to see you there! https://lnkd.in/eVTREidy