iNEMI’s Post

iNEMI End-of-Project Webinar: High-Density Interconnect Socket Warpage Prediction & Characterization — High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases. With large sockets, dynamic warpage prediction and control during reflow onto the PCB is a significant challenge, and simulation is critical in the product development process. An ability to speed up computation while retaining accuracy is needed to shorten socket design cycle. Phase 2 of the High-Density Interconnect Socket Warpage Prediction & Characterization project improved socket warpage simulation accuracy and assessed the impact of molding materials and design on warpage for large sockets. The team investigated a new Mori-Tanaka mechanics model as it has the ability to incorporate both the polymer matrix and the anisotropic effect of fillers. This end-of-project webinar will report the results and lessons learned from their efforts. Get additional details. https://lnkd.in/egmjfu56

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