Murata’s Post

𝐄𝐕𝐆®𝟓𝟎𝟏 𝐖𝐚𝐟𝐞𝐫 𝐁𝐨𝐧𝐝𝐢𝐧𝐠 𝐒𝐲𝐬𝐭𝐞𝐦: 𝐕𝐞𝐫𝐬𝐚𝐭𝐢𝐥𝐞, 𝐂𝐨𝐦𝐩𝐚𝐜𝐭, 𝐚𝐧𝐝 𝐒𝐜𝐚𝐥𝐚𝐛𝐥𝐞 The EVG501 is a highly flexible wafer bonding system and supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes. This versatility is ideal for universities, R&D facilities, or low-volume production. The design of the bond chambers is similar to the EVG high-volume-manufacturing tools, such as the EVG GEMINI, and the bonding recipes are easily transferable, allowing for easy scale up of production volumes. Main Features: Unique pressure and temperature uniformity, Compatible with EVG mechanical and optical aligners, Flexible design and configurations for research …. Learn more: https://lnkd.in/gYC-tS-5  #EVG501 #WaferBonding #BondingSolutions #Semiconducto r #Permanentbonding  #AnodicBondingTech #CompactBondingSystem #FlexibleRDSolutions #PilotProductionReady

https://lnkd.in/dAzuR52T #Setfos_Simulator Considering a device structure consisting of multi-stacked layers with different refractive indices, we proposed a composite electrode to diminish total internal reflection, thereby improving the out-coupling efficiency of organic light-emitting diodes (OLEDs). The selected transparent conducting oxide materials for the composite electrode were composed of the same main material, gallium-doped zinc oxide (GZO), to avoid lattice mismatch and reduce interfacial strain. Herein, silicon-doped GZO (SGZO) with a relatively low refractive index was used in combination with molybdenum-doped GZO (MGZO) with a high work function to form a multifunctional transparent composite electrode. High transmittance of 94.5% and adequate sheet resistance of 52.3 Ohm/sq were realized through the design of SGZO/MGZO films on a glass substrate. The tested blue phosphorescent OLEDs with SGZO/MGZO composite anode outperformed devices with other selected single-layer electrodes, achieving a high peak efficiency of 29.0% (57.6 cd/A and 47.6 lm/W). These results demonstrate clear advantages of using this composite-electrode concept for realizing high efficiency OLEDs or other flexible optoelectronics.

ITW EAE Camalot will be holding a free webinar on High Speed Jetting for Underfill Applications April 25 (9:00 am EST & 2:00 pm EST)   Webinar Description - Electronics manufacturers face challenges in underfilling flip-package assemblies, requiring highly flexible dispensing technology for zero-defect underfilling, highlighting the importance of expertise in this field. Flip packages and flip chips, like BGAs, are increasingly used in high-reliability applications, requiring assembly to consider thermal expansion mismatch between silicon die and PCB substrate. This webinar will discuss pitfalls to avoid when implementing underfill and provide an overview of Camalot's underfill dispensing solutions. To register click on one of the available times below:   9:00am EST - https://lnkd.in/ehHp7VvV 2:00pm EST - https://lnkd.in/eniz2WHf

Discover the sizes of the new CM Chokes with Nanocrystalline Core⚡ Toroidal inductors with nanocrystalline cores offer superior performance thanks to: ✅ Improved EMI attenuation; ✅ Greater loss reduction; ✅ Enhanced thermal stability. The costs of this category of cores have decreased over time, making them a more viable option where a single ferrite choke is insufficient to meet EMI limits imposed by regulations.🚀 Perfect for applications in tight spaces, they ensure efficiency even at high currents and frequencies. Let's discuss how these chokes can optimize your next project!🤝 #PowerElectronics #CommonMode #Chokes #Nanocrystalline #Industrial #PCB #PCBDesign #PCBAssembly #MagneticComponents #CustomComponents #Converter #PowerConversion

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The Characteristics and Advantages of Murata Electronics Crystal Units. Murata Electronics remains as the leading vertically integrated of Crystal and Ceramic Resonator Units. Murata's crystal units use a groundbreaking and unique packaging technology that is unparalleled in existing products, providing superior quality, production scale, and cost performance. Murata's crystal units use a package structure which differs from typical crystal units. While regular crystal units use a ceramic substrate with a cavity structure, Murata's crystal units use a structure which combines a metal cap with a planar ceramic substrate, which has a ceramic resonator with a proven track record extending back many years. Using the highly versatile planar ceramic substrate and metal cap allows us to reduce the material costs compared with conventional crystal units, achieve stable supply, and increase production. Recht Associates can bring to you the advantages of this technology, how its used and the robust steady manufacturing that Murata Electronics provides. Contact Recht Associates today for your connection to direct Murata Electronics engineering. #rechtassociates #murata https://lnkd.in/gEZEansP

#Molybdenum narrow #strips# Size: Thickness 0.03~0.08mm × width（2.0~6.0）×L Standard:Q/XY 1204 Application: Widely used in electronics, lighting, vacuum coating, medical equipment, semiconductors, glass fiber and other industries, as well as heating elements and heat insulation screens for electric vacuum furnaces. Buy now,pls contact me at linda.fan@lykkwm.com.cn The method for preparing molybdenum narrow strips for electric light sources provided by the present invention comprises a production process of cold-rolling molybdenum wire into molybdenum narrow strips, wherein the parameters are controlled as follows: a. Pretreatment of molybdenum wire: recrystallization annealing is performed during rolling; b. Warm rolling: the billet opening temperature is between 950°C and 1000°C; c. Cold rolling: the cold processing rate of the molybdenum narrow strip is divided into: the total processing rate of finished product cold rolling and the total processing rate of intermediate cold rolling, and the total processing rate of intermediate cold rolling is controlled at 60%; d. Stress relief annealing: the annealing temperature of the molybdenum narrow strip is between 850°C and 1100°C; e. Inspection: inspection by electric light source material detection equipment.

Do PCB-mounted modules like ESP-12 undergo special treatment to withstand double reflow process?#ic package evolution #altium #pcb Etching Trapezoid #pcb belgium #lithium phosphate vs lithium ion

Large Highly Accelerated Stress Test System (Large #HAST ) The large HAST model EHS-432M is designed for consistent, repeatable results and the best choice for the evaluation demand from growing market of 300mm Wafer Fabs. Key Features: - Large Capacity (130L and 180L): Ideal for mass processing of 300mm #wafers - #Unsaturated or #saturated humidity control - Multi-mode 'M' system controls humidity (via wet bulb/dry bulb), even during heat-up and cool-down - Fully conforms to industry standards such as #EIA / #JEDEC test method A110 & 102, #AEC -Q100 in addition to international standards – #IEC 60068-2-66 - Specimen power terminals, allow power-up of specimens - Modern design that’s easier to use HAST product family👉 https://lnkd.in/gWgu-ps4 #ESPEC #quality #reliability #testing #engineering #JEDEC #IEC #semiconductor #PowerSemiconductor #electronics #HAST #300mmWaferFabs

#Molybdenum narrow #strips# Size: Thickness 0.03~0.08mm × width（2.0~6.0）×L Standard:Q/XY 1204 Application: Widely used in electronics, lighting, vacuum coating, medical equipment, semiconductors, glass fiber and other industries, as well as heating elements and heat insulation screens for electric vacuum furnaces. Buy now,pls contact me at linda.fan@lykkwm.com.cn The method for preparing molybdenum narrow strips for electric light sources provided by the present invention comprises a production process of cold-rolling molybdenum wire into molybdenum narrow strips, wherein the parameters are controlled as follows: a. Pretreatment of molybdenum wire: recrystallization annealing is performed during rolling; b. Warm rolling: the billet opening temperature is between 950°C and 1000°C; c. Cold rolling: the cold processing rate of the molybdenum narrow strip is divided into: the total processing rate of finished product cold rolling and the total processing rate of intermediate cold rolling, and the total processing rate of intermediate cold rolling is controlled at 60%; d. Stress relief annealing: the annealing temperature of the molybdenum narrow strip is between 850°C and 1100°C; e. Inspection: inspection by electric light source material detection equipment.