Shannon Wireless’ Post

Can copper pillars be bonded without a solder cap? Can an All-copper interconnect be realized for 3D integration? Our team in Silicon Austria Labs (SAL), in collaboration with Materials Center Leoben Forschung GmbH, has explored the potential of copper nanoparticle sintering for Cu pillar bonding and 3D integration. Discover the advantages and limitations of pressure-less Cu sintering, pressure-assisted sintering, and transient liquid phase sintering (TLPS) in our latest publication in the Journal of IEEE Transactions on Components Packaging and Manufacturing. Brunner Roland Julien Magnien Augusto Rodrigues EPS - IEEE Electronics Packaging Society Silicon Austria Labs (SAL) Materials Center Leoben Forschung GmbH https://lnkd.in/dMqXGwcH

It is our latest article for point defect and carrier lifetime distributions in SiC PiN diodes. This information will be helpful to design SiC devices without bipolar degradation. H and He ion implantation is our original technique to suppress bipolar degradation and the carrier lifetime measurement technique in devices is also an original technique in my lab. I am happy to share our observation and analysis as this letter! https://lnkd.in/gKi58wGF

Knowles Self-Bias Networks Integrate Source Decoupling and User Selectable Bias Resistance up to 40 GHz. Knowles’ Dielectric Laboratories (DLI) brand takes advantage of high permittivity ceramics and combines them with thin film resistors to provide Self Bias Networks that integrate source decoupling and user-selectable bias resistance. This is especially useful for self-biased MIC GaAs FET amplifiers. Their Bias Filter Networks are designed to filter RF signals from bias and control lines from 10 MHz to 40 GHz. The RF Blocking Networks also known as E-Field Choke™. https://lnkd.in/dQxYJVVW

This paper developed a new kind of lightweight broadband multilayer #honeycomb (#HC)-#microwave #absorbing #structure (#MAS), by coating aramid HC with Fe/SiC polymeric paint optimized using effective medium approximations. An environment-friendly, cost-effective, and easily accessible procedure is embraced for the preparation of microwave absorbing paint and diverse coatings at #X-#band. The multi-objective #Jaya's #algorithm is envisioned for the optimum design of multilayered and hybrid HC-MASs. A multi-objective fitness function is integrated into the optimization algorithm to resolve the issue of the thickness-#bandwidth (#BW) tradeoff. ---- Ravi Yadav, Ravi Panwar More details can be found at this link: https://lnkd.in/e56u-3XU

👏Welcome to read 📚The Feature Paper "Strain-Induced Frequency Splitting in PT Symmetric Coupled Silicon Resonators" 🧑🔬 Lifeng Wang, et al. 👉Available at: https://lnkd.in/g-iXDfVZ #Micromachines #coupled_resonators #silicon_resonators

💡Article spotlight: A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs In this paper, the authors present a very broadband substrate-to-substrate interconnect based on co-planar waveguide (CPW) that has very low insertion loss (0.3dB) and small mismatch (<20 dB) over a frequency range of 1 to 130 GHz. The interconnect uses a flip-and-place design to join two separated MMIC chips with matching CPW lines. The bridging foil circuitry replaces and performs much better than traditional ribbon bonds, especially above 50 GHz. It is also flexible and can be used to join chips that differ in height above a common substrate. This paper is part of our July 2024 issue. 📎 Read the full article here: https://lnkd.in/g7Mpv5um  🌐 Topics covered in this article: Assembly, bond-wire, flip-chip, interconnect, liquid crystal polymer (LCP), measurement and test, monolithic microwave integrated circuit (MMIC), packaging, permittivity, signal transition, surface roughness, system-in-package, transition characterization 📝 Authors: Tim Pfahler, Andre Scheder, Anna Bridier, Mathias Nagel, Martin Vossiek

Check out our latest publication in the #IEEEJournalofMicrowaves enabling ultra-broadband mmW-interconnect technology for future mmW test and measurement setups 🚀

Our paper titled ‘Hybrid Cost-Effective Decapsulation of Chips for Successful Laser Fault Injection’ prepared with Alp Arslan Bayrakçi has been indexed in IEEE Xplore. In this paper, we propose a cost-effective hybrid method for decapsulation of chips, which is one of the necessary steps for a successful laser fault injection attack. If you would like to see the details, you can browse the article here: https://lnkd.in/dEsR3Z_P

👏Welcome to read 📚The Feature Paper "Strain-Induced Frequency Splitting in PT Symmetric Coupled Silicon Resonators" 🧑🔬 Lifeng Wang, et al. 👉Available at: https://lnkd.in/g-iXDfVZ #Micromachines #coupled_silicon_resonators

⌛️After 2 years under review, finally our manuscript appeared in ‘Nature Electronics’ 🥇First author, Dr Kongyang Li, showed extraordinary resilience, focus and patience to complete this task ✏️Led by Prof Zheng Liu, Nanyang Technological University 👍Thanks for involving me in this fine work ➡️ultrathin and uniform native oxide of gallium (Ga2O3) that naturally forms on the surface of liquid metals ➡️Placed on the surface of molybdenum disulfide (MoS2) by squeeze-printing and surface-tension-driven methods. ➡️This Ga2O3 layer possesses a high dielectric constant of around 30 and equivalent oxide thickness of 0.4 nm. ➡️Ga2O3 gate dielectrics exhibit a subthreshold swing down to 60 mV dec−1, an on/off ratio of 10^8. https://lnkd.in/g9hHzHj5