IEEE Journal of Microwaves’ Post

💡Article spotlight: A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs In this paper, the authors present a very broadband substrate-to-substrate interconnect based on co-planar waveguide (CPW) that has very low insertion loss (0.3dB) and small mismatch (<20 dB) over a frequency range of 1 to 130 GHz. The interconnect uses a flip-and-place design to join two separated MMIC chips with matching CPW lines. The bridging foil circuitry replaces and performs much better than traditional ribbon bonds, especially above 50 GHz. It is also flexible and can be used to join chips that differ in height above a common substrate. This paper is part of our July 2024 issue. 📎 Read the full article here: https://lnkd.in/g7Mpv5um  🌐 Topics covered in this article: Assembly, bond-wire, flip-chip, interconnect, liquid crystal polymer (LCP), measurement and test, monolithic microwave integrated circuit (MMIC), packaging, permittivity, signal transition, surface roughness, system-in-package, transition characterization 📝 Authors: Tim Pfahler, Andre Scheder, Anna Bridier, Mathias Nagel, Martin Vossiek

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Tim Pfahler

Head of Operations @fiveD | Realistic Radar Simulation - Pioneering the Next Generation of Radar

4mo

Thanks for posting #IEEEJournalofMicrowaves 🚀 Attached is the manufactured mmW-assembly shown:

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Jan Schür

LHFT - Shaping the future with RF technology

4mo

Thumbs up. Great engineering and scientific achievement!

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