vario-optics’ Post

Proud to be part of this publication and collaborative work! A big thanks to Sander Dorrestein from CITC and Nikolaus Flöry from Vario-Optics, and many other contributors, who made this possible. Check out the article to learn more about the advancements in the photonic chip packaging. https://lnkd.in/eDA5Ry7j #PhotonicsPackaging #Semiconductorization #IntegratedPhotonics

Visitors to PIC International may have received their copy last week, but here it is for the rest of the world: CITC's Integrated Photonics Technology Roadmap. In this roadmap, Sander Dorrestein, our Integrated Photonics Packaging program manager, explains his vision on the 'semiconductorization' of the photonics industry. Check out this document to find out where our developments in semiconductors meet the challenges in integrated photonics. #integratedphotonics #accesstoinnovation

Momentum Optics is pioneering a groundbreaking method to produce freeform optics using a laser-based, non-contact technique that drastically reduces production time and cost. This innovative process allows manufacturers to create optics in previously impossible shapes, unlocking new possibilities for industries like quantum computing, medical technology, and defense. Thanks to $1.675 million in funding from the #DBX Award, administered by U.S. Partnership for Assured Electronics (USPAE), Momentum Optics is moving closer to scaling its operations. This award has provided the momentum they needed to build a factory-ready system, paving the way for future growth and helping to drive optical innovation forward at an unprecedented pace. https://bit.ly/3AXVZr7

📱 An increasing number of material classes and complex geometries are found in integrated structures for semiconductor devices, elevating the importance of considering thermomechanical integrity to ensure optimal performance, reliability, and yield. 💻 In our recent webinar, Dr. Kris Vanstreels, researcher at imec, discusses several nanoindentation based approaches that can be used to study the thermomechanical integrity of thin films and nano-interconnects for semiconductor applications. Watch: https://lnkd.in/gHZCDVKY ⬇️ In the clip below, Dr. Vanstreels explains and demonstrates the use of nanoDMA to rapidly determine delamination area. More on nanoDMA III: https://lnkd.in/gjUr-QcW #semiconductor #materialscience #semiconductors

I'm giving an SSCS webinar on how to simulate silicon photonics systems in SystemVerilog. Register here: https://lnkd.in/giySj3Hh #SiliconPhotonics #SystemVerilog #XMODEL

Considering the high process costs up to the final packaging of the silicon photonics chip, faulty chips should be detected early: That’s why wafer testing in the concept phase of the chip layout and device testing in operation mode are so important, especially when it comes to scale-up. To test the functionality and quality of photonic elements, signal-carrying optical fibers must be precisely aligned with nanometer accuracy. And knowing that edge emitters, for example, require horizontal alignment of the test fiber, while grating couplers require vertical alignment at the wafer level, it’s clear that alignment systems must not only be highly accurate but also highly flexible to accommodate different chip designs. Use our knowledge hub to find out how to fully automate photonics wafer probing for cost-effective silicon photonics production with high-speed alignment 👉 https://lnkd.in/eQ6tE7Zb #photonics #opticalfiber #alignment #physikInstrumente #PI

if you are dealing with a semiconductor which is being dominated by defects/disorder, typically is the case of organic semiconductor then you will like to read this interesting article which suggests many experimental findings based on transient microscopy can give wrong estimate of crucial transport parameters! Congratulations to Gangadhar S B. and Rishabh Saxena in Prof Anna Koehler & Prof Heinz Bassler group at Bayretuth University for putting this insightful work together.

New article alert: Check out our recent article on the Impact of Photoluminescence Imaging Methodology on Transport Parameters in Semiconductors. #OLED #PLImaging #Optoelectronics

Funded Project: UV-Multi Since January of this year Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik and EPIGAP OSA Photonics GmbH are project partner in the project UV-Multi. The project is funded by the Berlin program for fostering research, innovation, and technology – Pro FIT and is co-funded by the European Fund for regional development. Yesterday we had our first regular project meeting to discuss first results and next to dos. Everything seems to be on track and the first milestones will be reached later this year. Aim of the project is the development of epitaxy and #chip #technology for the production of durable far uvc #LEDs and the development of a multi wavelength uv LED module. These novel modules will emitt radiation of 227 nm, 285 nm, and 390 nm for applications in gas #sensors for the detection of nitrogen monoxide, sulfur dioxide, and nitrogen dioxide. #epigaposa

Programmable photonics can be a game-changer for the adoption of photonic chips into new applications, opening up the technology to a much wider community of innovaters. In the latest issue of Optics & Photonics News, we give an overview of this emerging technology, its current technical state, and where the field is going.