Analysis uHDI PCB, Preferred HOREXS

With the rapid development of modern electronic products, the technology of printed circuit boards (PCBs) has been evolving to meet the increasingly complex design and performance requirements. Ultra-high density interconnect (uHDI) PCB technology has become the key to driving the development of a new generation of electronic products due to its excellent performance and miniaturization capabilities. uHDI PCB is not only an upgraded version of HDI PCB, but also an important step towards miniaturization and high performance.

In this article, we will explore the advantages, application scenarios, manufacturing processes, and future development trends of uHDI PCB technology. At the same time, we will also combine HOREXS, a company with more than 15 years of experience in semiconductor packaging substrate manufacturing, to understand its contributions and future plans in the field of uHDI PCB.

Overview of uHDI PCB Technology

1. Definition and Characteristics of uHDI PCB

uHDI PCB is the abbreviation of ultra-high density interconnect printed circuit board. Compared with traditional HDI PCB, uHDI PCB is characterized by its higher wiring density and smaller feature size. By adopting technologies such as micro-holes and fine lines, uHDI PCB can achieve more electronic component connections in a limited space, thereby supporting more complex and more functionally integrated circuit designs.

The main features of uHDI PCB include:

Smaller line width/line spacing: The line width and line spacing of uHDI PCB are usually below 20 microns, which can achieve more wiring in a limited space.

Micro blind/buried vias: Through laser drilling technology, uHDI PCB can achieve micro blind and buried vias with a hole diameter of less than 50 microns, further improving the interconnection density of the circuit.

Multi-layer stacking structure: uHDI PCB usually adopts a multi-layer structure to support complex three-dimensional circuit design.

2. Main application areas of uHDI PCB

Due to its miniaturization and high performance, uHDI PCB is widely used in the following major fields:

Smartphones and tablets: Modern smartphones and tablets have increasing requirements for miniaturization and multi-functional integration, and uHDI PCB is one of the key technologies to achieve these requirements.

Wearable devices: The small size and high-density interconnection characteristics of uHDI PCB make it an ideal choice for wearable devices such as smart watches and health monitoring devices.

High-performance computing: In fields such as servers and data centers that require high computing power, the high wiring density and multi-layer structure of uHDI PCB can support more complex circuit designs.

Advanced automotive electronics: With the development of automotive intelligence, uHDI PCB plays an important role in autonomous driving systems and advanced driver assistance systems (ADAS).

uHDI PCB manufacturing process

1. Micro-line manufacturing process

One of the key processes of uHDI PCB is the micro-line manufacturing process. The manufacture of micro-lines requires precise etching and deposition technology to ensure that the line width and line spacing reach the required accuracy. Commonly used micro-line manufacturing methods include traditional photolithography etching and the more advanced mSAP (Modified Semi-Additive Process) process.

mSAP process is one of the most advanced micro-line manufacturing technologies currently available. The process forms micro-lines by depositing a copper layer on a substrate and patterning it, followed by chemical copper plating. This process not only enables precise manufacturing of ultra-fine wires, but also has high production efficiency and low manufacturing costs.

As a company with more than 15 years of experience in manufacturing semiconductor package substrates, HOREXS has accumulated rich experience in micro-line manufacturing processes. The company has adopted the mSAP process and successfully achieved mass production of package substrates such as FCBGA, FCCSP, and SiP, laying a solid foundation for the manufacture of uHDI PCBs.

2. Micro blind/buried via process

Micro blind and buried vias are key technologies for achieving high-density interconnection in uHDI PCBs. Unlike traditional mechanical drilling, uHDI PCBs usually use laser drilling technology to achieve smaller apertures and higher precision.

In the production process of blind and buried vias, laser drilling can ensure that the aperture is less than 50 microns, thereby achieving more electrical connections in a limited PCB space. At the same time, the filling and copper plating process of micro blind/buried vias is also crucial to ensure the stability of electrical performance.

HOREXS has strong technical capabilities in blind and buried via processes. With advanced laser drilling equipment and an experienced engineering team, HOREXS has successfully achieved the requirements for high-density interconnection in uHDI PCBs, and ensured product traceability through MES and ERP systems to meet the high standards of global customers.

3. Stacking manufacturing process

Multilayer stacking is an important way for uHDI PCBs to achieve high integration. By stacking multiple circuit layers together, uHDI PCBs can support more complex circuit designs and meet miniaturization requirements.

In the stacking manufacturing process, interlayer alignment accuracy and interlayer interconnection reliability are two key factors. To this end, uHDI PCBs usually use advanced lamination technology and precision alignment systems to ensure precise alignment and reliable connection of each layer of circuits.

HOREXS has a leading advantage in stacking manufacturing processes. The company uses Tenting and RCC processes, which can effectively control the interlayer alignment accuracy and ensure the reliability of each PCB through a strict quality management system. In addition, HOREXS also plans to start construction of the second phase of the factory in 2025, introduce more advanced mSAP technology, further improve production capacity, and add 20,000 square meters of production capacity per month.

Future development trend of uHDI PCB

1. Smaller line width and higher number of layers

As electronic products continue to develop towards miniaturization and high performance, the future trend of uHDI PCB will be to achieve smaller line width and higher number of layers. This means that in the future, uHDI PCB will require more advanced manufacturing processes, such as more sophisticated lithography and etching technology, and higher stacking capabilities.

HOREXS has already made arrangements in this regard, and through continuous technology research and development and process optimization, it is committed to achieving smaller line width and more stacking to meet the growing needs of customers.

2. Highly integrated packaging solutions

With the development of semiconductor technology, the integration of packaging and PCB will be further improved. uHDI PCB will not only be a carrier for circuit connection, but will also be more involved in the entire packaging system, becoming an important part of SiP (system-level packaging) and other advanced packaging forms.

HOREXS has extensive experience in the field of advanced packaging and is able to provide a variety of packaging substrate solutions including SiP, MEMS, CMOS, DDR, LPDDR, etc. Through cooperation with global OSATs, HOREXS combines uHDI PCB with advanced packaging technology to provide customers with highly integrated packaging solutions.

3. Environmental protection and sustainable development

In the future, environmental protection and sustainable development will become an important trend in the development of uHDI PCB. With the increasing global requirements for environmental protection, the manufacturing process of uHDI PCB will pay more attention to green production and efficient use of resources.

As a green production plant, HOREXS always integrates environmental protection concepts into every aspect of production. The company actively promotes the sustainable development of the PCB industry by optimizing production processes, reducing energy consumption and waste emissions.

Conclusion

As a key driving force for the miniaturization and high performance of modern electronic products, uHDI PCB technology has a very broad future development prospect. By continuously optimizing the manufacturing process and improving wiring density and integration, uHDI PCB will play an increasingly important role in smart phones, wearable devices, high-performance computing and automotive electronics.

As a company with more than 15 years of experience in semiconductor packaging substrate manufacturing, HOREXS is actively promoting the development of uHDI PCB technology with its technical advantages in fine lines, blind/buried vias and stacking manufacturing. With the construction of the second phase of the factory and the further increase in production capacity, HOREXS will occupy a more important position in the global uHDI PCB market and provide customers with more advanced and sustainable PCB solutions.