uHDI PCB technology

HDI is the abbreviation of High Density Interconnect. Surprisingly, there is no precise definition for this type of PCB. In fact, this type of product requires a combination of multiple technologies that form a unique structure. The general difference is that HDI structures have a higher density of interconnect characteristics than traditional PCBs.

. Common features and elements of HDI · Prioritize space

· Many different HDI via types · Wide range of applications and industries

. Advantages: Flexibility and density, corresponding to signal integrity and reliability

1. Common features and elements of HDI

Common elements of HDI include: a combination of via types such as buried vias, blind vias and through vias; fine routing and spacing; shorter interconnect traces; densely spaced passive devices (even buried passive devices or passive substrates), and coreless structures (a very new concept); multi-level structures (not a single thickness).

2. Prioritize space

When designing HDI, considering space does not only mean inserting as many components as possible within the space that the PCB can accommodate. Determining the size of the space between specific components and optimizing the additional space is a technology that minimizes thermal stress and EMI. Via diameter, pad diameter, and trace width should all be considered at the beginning of the design. Not prioritizing space may result in the need to completely redesign the HDI.

3. Multiple different HDI via types

We mistakenly believe that the definition of HDI is micro-via blind vias. While these tiny vias (<150 microns) have always existed in HDI designs, they are just one of the processes that can be used in HDI designs. In practice, HDI designs have many possible via structures, such as through-holes, buried vias, blind vias, and micro-vias, as well as stacked vias and multi-level vias.

4. Wide range of application areas and industries

HDI technology is often used in critical system industries such as aerospace, medical devices, automotive or military, or in high-performance fields such as the Internet of Things (IoT). But the application areas and uses of HDI are not limited to these industries, and can also be used in many standard products such as digital cameras, mobile phones, laptops, network communications or touch screen devices.

5. Advantages: flexibility and density, corresponding signal integrity and reliability

The flexibility of HDI composition allows for unique approaches to meet requirements. For example, a "layered" structure where different functions may be located in various parts of the PCB, and the technology of each part may be very different. The reduction in overall size is also a clear advantage of HDI, enabling more ergonomic and creative designs. HDI technology provides enhanced signal integrity and high reliability.

In Asia, HOREXS is a company that has been specializing in the manufacture of semiconductor packaging substrates for more than 15 years. It has the production of uHDI PCBs in terms of manufacturing capabilities and manufacturing environment, and is currently in mass production. If you are interested in learning more about this company from Asia, you can contact AKEN.

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