Discussion of FBGA packaging substrates

Discussion of FBGA packaging substrates, FBGA packaging chips and their applications in memory chips

FBGA (Fine-pitch Ball Grid Array) is a packaging technology widely used in memory chips. It connects the chip to the circuit board by setting a dense array of small balls at the bottom of the chip, and has the advantages of high density, high performance and miniaturization. This article will deeply explore the FBGA packaging substrate, FBGA packaging chip and its application, and pay special attention to the key elements and technical difficulties of FBGA packaging substrate manufacturing, as well as how to reduce costs and ensure quality through advanced technology and supply chain management.

FBGA packaging substrate

FBGA packaging substrate overview

FBGA packaging substrate is one of the cores of FBGA packaging technology, mainly used for memory chips such as DRAM (dynamic random access memory), NAND Flash (flash memory), etc. FBGA substrates connect chips to external circuits through high-density small ball arrays, supporting high-performance, high-speed data transmission and miniaturization design. FBGA packaging substrates are usually composed of multi-layer circuit boards, wiring layers, insulation layers and metallization layers, and their manufacturing process involves multiple complex processes and technologies.

Manufacturing factors of FBGA package substrate

Material selection: The material selection of FBGA package substrate is very important. Common substrate materials include FR4, BT resin, ceramic substrate, etc. Different materials have different dielectric constants, thermal expansion coefficients and mechanical strengths, and need to be selected according to specific application requirements.

Layer design: FBGA package substrates usually adopt multi-layer design to achieve high-density wiring and complex electrical connections. The increase in the number of layers can increase the wiring density, but it also increases the difficulty and cost of manufacturing. A typical FBGA substrate may contain 2 to 12 layers.

Wiring density: FBGA package substrates need to achieve high-density wiring to support high-speed data transmission and complex electrical connections. High-density wiring technologies include fine wires, microvias, blind holes and buried holes.

Thermal management: Since FBGA package substrates integrate high-performance chips, thermal management is a key issue. An effective heat dissipation path must be designed, including the use of high thermal conductivity materials, the addition of heat dissipation layers and the optimization of heat dissipation structures to ensure the reliable operation of the chip.

Signal integrity and power integrity: FBGA package substrates need to consider signal integrity and power integrity issues. By optimizing the wiring design, using the power plane and ground plane, and adding decoupling capacitors, the signal transmission quality and power supply stability can be improved.

Technical Difficulty of FBGA Package Substrate Manufacturing

Precision Machining: The manufacturing of FBGA package substrates requires highly precise machining processes, especially in high-density wiring and micro-hole processing. The drilling, metallization and filling processes of micro-holes require extremely high precision and consistency.

Multi-layer alignment: The inter-layer alignment accuracy of multi-layer substrates has an important impact on the performance of the final product. Alignment errors can cause problems such as signal transmission delay, reflection and crosstalk, so high-precision alignment and lamination processes are required.

Material compatibility: Different materials have different thermal expansion coefficients and mechanical properties. During the manufacturing process, it is necessary to ensure the compatibility between materials to prevent deformation, cracking and delamination of the substrate.

Thermal Management Design: Complex thermal management design requires accurate implementation during the substrate manufacturing process, including the layout of heat dissipation channels, the application of high thermal conductivity materials, etc.

Cost Control: The manufacturing cost of FBGA package substrates is high, and it is necessary to control costs through process optimization, material selection and large-scale production to meet market demand.

FBGA packaged chips

Features of FBGA packaged chips

FBGA packaged chips achieve efficient connection between chips and external circuits by setting a dense array of small balls at the bottom of the chip. The main features of FBGA packaged chips are as follows:

High density: FBGA packaged chips achieve high-density wiring through dense arrays of small balls, supporting high-speed data transmission and complex electrical connections.

High performance: FBGA packaged chips can support high-speed data transmission and high-performance computing, and are suitable for applications such as high-performance memory and processors.

Miniaturization: FBGA packaged chips have the characteristics of miniaturization and are suitable for space-constrained applications such as mobile devices and wearable devices.

Reliability: FBGA packaged chips improve the reliability and life of the system by optimizing the packaging structure and thermal management design.

Application of FBGA packaged chips

FBGA packaged chips are widely used in the following fields:

Memory: High-performance memories such as DRAM and NAND Flash widely use FBGA packaging technology to achieve high-density and high-performance storage.

Mobile devices: In mobile devices such as smartphones and tablets, FBGA packaged chips are widely used in memory, processors, and communication modules.

Computers and servers: In computers and servers, FBGA packaged chips are widely used in high-speed memory, processors, and high-speed interconnect modules.

Wearable devices: In wearable devices such as smart watches and fitness trackers, FBGA packaged chips are widely used in memory and processors.

Automotive electronics: In automotive electronic systems, FBGA packaged chips are widely used in memory and control modules, etc., supporting intelligent and high-reliability applications.

Medical electronics: In medical equipment, FBGA packaged chips are highly integrated and small in size, suitable for portable medical devices such as wearable health monitoring devices, diagnostic equipment, etc.

FBGA package substrate manufacturing solutions: HOREXS

As a professional electronic packaging substrate supplier, HOREXS is committed to helping customers reduce the procurement cost of packaging substrates through advanced technology and high-quality services, and ensure that product quality meets customer requirements and JEDEC standards. The following are HOREXS's advantages and solutions in FBGA packaging substrate manufacturing:

Advanced process technology: HOREXS uses advanced high-density wiring and micro-hole processing technology to achieve high-precision, high-density FBGA packaging substrate manufacturing, ensuring the high performance and high reliability of the substrate.

High-quality material selection: HOREXS cooperates with the world's leading material suppliers to select high-quality substrate materials to ensure the electrical performance and thermal management capabilities of the products, while reducing costs through bulk procurement.

Strict quality control: HOREXS implements a strict quality control system, and conducts strict testing at every link from raw material procurement to production and processing to ensure product consistency and reliability.

Customized solutions: HOREXS can provide customized substrate design and manufacturing services according to the specific needs of customers to meet the special requirements of different application scenarios.

Supply chain management: HOREXS optimizes supply chain management, shortens production cycles, improves production efficiency, and reduces customers' procurement costs.

Technical support and service: HOREXS has an experienced technical team that can provide customers with comprehensive technical support and after-sales service to solve problems encountered by customers during substrate design and use.

HOREXS's quality and standards

Comply with JEDEC standards: HOREXS's FBGA package substrate products are manufactured in strict accordance with JEDEC (Solid State Technology Association) standards to ensure that the products meet industry standards in terms of compatibility, performance and reliability.

Customer Qualification Requirements: HOREXS is committed to meeting and exceeding customer qualification requirements, ensuring high quality in every link from material selection to production process to meet customers' special needs and application requirements.

HOREXS Case Application

In the design of high-performance memory, HOREXS provides customers with high-quality FBGA packaging substrates through advanced process technology and optimized supply chain management. By cooperating with leading global material suppliers, HOREXS ensures the electrical performance and thermal management capabilities of the substrate. At the same time, a strict quality control system ensures the consistency and reliability of the product, meeting customers' needs for high-density wiring, high-speed data transmission and miniaturization.

Summary

As the core of FBGA technology, FBGA packaging substrates involve complex manufacturing processes and technical requirements. High-performance FBGA packaging substrates can be manufactured by selecting suitable materials, optimizing layer design, increasing wiring density, effectively managing heat and ensuring signal integrity. With its advanced process technology, high-quality material selection, strict quality control, customized solutions and efficient supply chain management, HOREXS can help customers reduce the procurement cost of packaging substrates and ensure that product quality meets customer requirements and JEDEC standards, thereby gaining a competitive advantage in the market.