HOREXS capability of PCB substrate

HOREXS, One of the global IC package substrate manufacturers, A famous Chinese ic substrate manufacturer.

Support all kind of the microelectronics,uHDI pcb,wire bonding PCB, PCB substrate, Semiconductor package substrate OEM manufacture.

Process:

1- mSAP 2-8 layers

2- Substrative (Tenting) 2-8 layers

3- RCC (More than 10 layers with blind/bury via)

HOREXS IC Substrate products ( Including buildup):

1- CSP package substrate;

2- Memory (BGA) substrate; (MicroSD/USB/UDP/eMMC/eMCP/uMCP/FCBOC/DDR/SD)

3- SiP package substrate; (mmwave/RF/Others module package substrate)

4- FCBGA package substrate;

5- FCCSP package substrate;

6- Sensors substrate; (MEMS/CMOS)

7- Fingerprint electronics substrate; (Camera, Microelectronics pcb)

8- Others microelectronics (uHDI PCB) & Wire bonding (BGA) substrate;

9- 3 layer coreless substrate;

HOREXS Advantages(Offer value for all customers):

1- Cost reduction;

2- Capacity supporting;

HOREXS new plant roadmap:

1-Buildup: ABF/XBF

2-L/S: 15/15um and below

3-Glass substrate

Suitable for advanced package substrate such as AI/CPU/GPU/Chiplets/5G 6G mmwave etc.Contacts AKEN for details or cooperation directly http://www.horexspcb.comakenzhang@horexspcb.com

Explore HOREXS ICsubstrate production plant

👉 Fully smart manufacture

👉 MES system control

👉 Open ERP port for clients

👉 Fully automatic production

👉 High traceability on each process

👉 Core,Coreless, Buildup, Embedded

substrate🤩 RCC production capability

🔊 More than 10 layers (with blind/bury via)

🔊 Plug hole: Cu/Resin

🔊 0.1-1.22mm finished thickness

🔊 Alignment accuracy: 0.025mm

🔊 Line/Space 20/20um

🔊 Support FR4/BT core material

🥇 Dry film is HOREXS special patent🤩 mSAP

production capability

🔺 2-6 layers (blind/bury via)

🔺 Line/Space 20/20um

🔺 0.09-0.4mm finished thickness

🔺 Support MGC, Hitachi, Doosan, SYtech, AMC, Panisonic BT material

🔺 Coreless/Embedded available

🔺Alignment accuracy: 0.025mm🤩 Substrative(Tenting)

production capability

☑ 2-8 layers (blind/bury via)

☑ Line/Space 25/25um

☑ 0.1-0.4mm mainly finished thickness

☑ Alignment accuracy: 0.025mm

☑ Support MGC, Hitachi, Doosan, SYtech, AMC,Panisonic BT material

💪 Advantages with us

➡ Reliability guarantee (Material,Process,Control measure)

➡ Cost reduction

➡ Huge capacity support

➡ Quick response in service such as EQ etc.

➡ Teams from ASE which was more than 30 years experienceWelcome explore the cooperation with AKEN, to build a way to enhance your conpetition in the market.