Join HOREXS in Munich electronics fair
AKEN Cheung
Director . PCB substrate manufacturer. Advantages: Cost reduction with high reliability. |FCBGA| FCCSP|Coreless|CSP| SiP|Module|FBGA memory| DDR3|DDR4|DDR5|mmWave|Embedded|PCB substrate|uHDI | glass substrate| mSAP
Welcome to join us and discuss the future product of semiconductor!
Booth : C6/220-9
Contacts: AKEN
Email: akenzhang@horexspcb.com
HOREXS is a famous Chinese IC substrate manufacturer who professionally has produced 2-6L substrates (buildup types) over 15 years.
• Advanced packaging Substrate Manufacturer ( Wire bonding/
Sip/ FCCSP/FCBGA/ Memory/ Module/etc )
• Since its establishment in 2009, HOREXS already focus on semiconductor packaging substrate manufacturing.
• R&D members have experienced over 30 years in this market
Stable and high reliability product of HOREXS:
Memory substrate including coreless: eMMC/UFS/eMCP/uMCP/MicroSD/USB/UDP/FBGA/DDR4/DDR3/DDR5/DRAM etc.
FCCSP Package substrate;
CSP package substrate;
SiP(System in package) substrate;
Optical electronics(Phontonics) PCB;
uHDI PCB;
RF/Module substrate;
MEMS/CMOS substrate;
FCBGA package substrate;
On development Glass substrate with kep partner now.