Key production process control for high-rise boards（multilayer PCB）

This paper analyzes the main manufacturing difficulties of high-level circuit boards, such as interlayer alignment, inner layer production, press-making, and drilling. In view of the main production difficulties, the production control points of key processes such as interlayer alignment control, laminated laminated structure design, inner layer circuit process, pressing process and drilling process are introduced for reference and reference.

High-level circuit boards are generally defined as high-layer boards with 10 to 20 layers or more. They are more difficult to process than traditional multilayer boards, and have high quality and reliability requirements. They are mainly used in communication equipment, high-end servers, medical electronics, Aviation, industrial control, military and other fields. In recent years, the demand for high-end board market in the fields of application communication, base station, aviation, military and so on is still strong, and with the rapid development of China's telecom equipment market, the high-end board market prospects are promising.

At present, PCB manufacturers that can mass produce high-level circuit boards in China mainly come from foreign-funded enterprises or a few domestic-funded enterprises. The production of high-level circuit boards requires not only high technology and equipment investment, but also the accumulation of experience of technicians and production personnel. At the same time, the process of importing high-level board customers is strict and cumbersome. Therefore, high-level circuit boards enter the enterprise with high threshold and realize industrialization. The production cycle is longer. The average number of layers of PCB has become an important technical indicator to measure the technical level and product structure of PCB companies. This paper briefly describes the main processing difficulties encountered in the production of high-level circuit boards, and introduces the control points of the key production processes of high-level circuit boards for reference and reference.

First, the main production difficulties

Compared with the characteristics of conventional circuit boards, high-level circuit boards have thicker plates, more layers, denser lines and vias, larger cell sizes, thinner dielectric layers, etc., inner space, interlayer alignment, Impedance control and reliability requirements are more stringent.

1.1 Difficulties in alignment between layers

Due to the high number of high-layer slabs, the customer design end is more and more strict on the alignment of the PCB layers. Generally, the inter-layer alignment tolerance is controlled by ±75μm. Considering the high-level board unit size design, the graphic transfer workshop environment temperature and humidity, As well as the misalignment and interlayer positioning methods caused by the inconsistency of different core layers, the interlayer alignment control of the high-rise boards is more difficult.

1.2 Difficulties in the production of inner layers

The high-rise board adopts special materials such as high TG, high speed, high frequency, thick copper and thin dielectric layer, which puts high requirements on the inner layer circuit production and graphic size control, such as the integrity of impedance signal transmission, which increases the difficulty of inner layer circuit fabrication. The line width is small, the open circuit is increased, the short is increased, the pass rate is low; the signal line of the fine line is more, the probability of the AOI leak detection is increased; the thickness of the inner core plate is thin, and the fold is easy to cause poor exposure, etching It is easy to roll when passing the machine; most of the high-rise boards are system boards, the unit size is large, and the cost of scrapping the finished product is relatively high.

1.3 Pressing and manufacturing difficulties

A plurality of inner core sheets and prepregs are superimposed, and defects such as sliding sheets, delamination, resin voids, and bubble residues are easily generated during press production. When designing the laminated structure, it is necessary to fully consider the heat resistance, withstand voltage, the amount of glue and the thickness of the material, and set a reasonable high-level plate pressing program. The number of layers is large, the amount of expansion and contraction control and the compensation of the size factor cannot be consistent; the interlayer insulation layer is thin, which easily leads to the failure of the interlayer reliability test. Figure 1 is a defect diagram of the blasting delamination after the thermal stress test.

1.4 Difficulties in drilling

The use of high TG, high speed, high frequency, thick copper special plates increases the difficulty of drilling roughness, drilling burrs and drilling. The number of layers is large, the total copper thickness and plate thickness are accumulated, the drill is easy to break the knife; the dense BGA is more, the CAF failure problem caused by the narrow hole wall spacing; the plate thickness is easy to cause the oblique drilling problem.

Second, the key production process control

2.1 Material selection

With the development of high-performance and multi-functional electronic components, and high-frequency, high-speed development of signal transmission, electronic circuit materials are required to have low dielectric constant and dielectric loss, low CTE, and low water absorption. Rate and better high performance CCL material to meet the processing and reliability requirements of high panel. The main characteristics of these four inner substrates are shown in Table 1. For high-rise thick copper circuit boards, high-resin prepreg is used. The inter-layer prepreg has enough glue to fill the inner layer. The insulating medium is too thick and the finished plate is too thick. On the contrary, the insulating medium is thin, which is easy to cause. Quality problems such as media stratification and high voltage test failure are extremely important for the selection of dielectric materials.

2.2 Press-fit laminated structure design

The main factors considered in the design of the laminated structure are the heat resistance, withstand voltage, the amount of glue and the thickness of the dielectric layer. The following main principles should be followed.

(1) Prepreg and core board manufacturers must be consistent. In order to ensure PCB reliability, all layers of prepreg avoid the use of a single 1080 or 106 prepreg (except for special requirements). When the customer does not have the thickness requirement, the thickness of each layer must be ≥0.09mm according to IPC-A-600G.

(2) When customers require high TG sheets, the core and prepregs must be made of the corresponding high TG material.

(3) For the inner substrate of 3OZ or above, use a high resin content prepreg, such as 1080R/C65%, 1080HR/C 68%, 106R/C 73%, 106HR/C76%; but try to avoid all the use of 106 high-elastic prepreg The structure is designed to prevent multiple sheets of prepreg 106 from being superposed. Because the glass fiber yarn is too thin, the glass fiber yarn collapses in the large substrate area, which affects dimensional stability and delamination.

(4) If there is no special requirement from the customer, the thickness tolerance of the interlayer dielectric layer is generally controlled by +/-10%. For the impedance board, the dielectric thickness tolerance is controlled according to the IPC-4101 C/M tolerance, if the impedance influence factor and the substrate thickness For related, sheet tolerances must also be in accordance with IPC-4101 Class C/M tolerances.

2.3 Inter-layer alignment control

The accuracy of the inner core plate size compensation and the production size control require the data and historical data experience collected in the production in a certain period of time to accurately compensate the pattern size of each layer of the high-rise board to ensure the expansion and contraction of each layer of the core board. consistency. Choose high-precision, high-reliability pre-bonding interlayer positioning methods, such as four-slot positioning (Pin LAM), hot melt and rivet combination. Setting the appropriate press-fit process and daily maintenance of the press is the key to ensuring the quality of the press, controlling the flow of glue and cooling, and reducing the problem of interlayer misalignment. Inter-layer alignment control needs to take into account factors such as inner layer compensation value, press-fit positioning mode, press-fit process parameters, material properties and other factors.

2.4 Inner layer circuit process

Since the resolution capability of the conventional exposure machine is about 50 μm, for the production of high-rise boards, a laser direct imaging machine (LDI) can be introduced to improve the graphics analysis capability, and the resolution capability is about 20 μm. The conventional exposure machine has a registration accuracy of ±25 μm and an interlayer alignment accuracy of more than 50 μm. Adopting high-precision alignment exposure machine, the graphic alignment accuracy can be improved to about 15μm, and the interlayer alignment precision can be controlled within 30μm, which reduces the alignment deviation of the conventional equipment and improves the interlayer alignment accuracy of the high-level board.

In order to improve the circuit etching capability, it is necessary to give appropriate compensation to the width of the circuit and the pad (or solder ring) in engineering design, and to make more detailed design of the compensation amount of special graphics such as return lines and independent lines. consider. Confirm the inner line width, line spacing, isolation ring size, independent line, hole to line distance design compensation is reasonable, otherwise change the engineering design. There are impedance and inductive design requirements. Pay attention to the independent line and impedance line design compensation. If the parameters are well controlled during etching, the first piece can be mass-produced after confirmation. In order to reduce the etching side etching, it is necessary to control the composition of each group of the etching liquid in an optimum range. Conventional etching line equipment has insufficient etching ability, and can be technically modified or introduced into high-precision etching line equipment to improve etching uniformity, reduce etching burrs, and etchlessness.

2.5 Pressing process

At present, the interlayer positioning methods before pressing include: four-slot positioning (Pin LAM), hot-melt, rivet, hot-melt and rivet combination, and different product structures adopt different positioning methods. For the high-rise board, the four-slot positioning method (Pin LAM) is used, or the fusion + riveting method is used, and the OPE punching machine punches out the positioning hole, and the punching precision is controlled at ±25 μm. When fusing, the first board must be X-ray inspection layer, and the layer is qualified to make batches. In batch production, it is necessary to check whether each board is melted into the unit to prevent subsequent delamination, and the press-fit equipment adopts high-performance matching. The press meets the interlayer alignment accuracy and reliability of the high-rise board.

According to the high-rise laminate structure and materials used, study the appropriate pressing procedure, set the optimal heating rate and curve, and appropriately reduce the heating rate of the pressed sheet and prolong the high temperature in the conventional multilayer circuit board pressing procedure. The curing time allows the resin to flow and solidify sufficiently, while avoiding problems such as slippage and interlayer misalignment during the pressing process. Plates with different TG values cannot be the same as grate plates; plates with common parameters cannot be mixed with plates with special parameters; ensure the reasonableness of the expansion and contraction coefficient, the performance of different plates and prepregs is different, and the corresponding plates are required. The prepreg parameters are pressed and the special materials that have never been used need to verify the process parameters.

2.6 drilling process

Due to the superposition of the layers, the plate and the copper layer are extremely thick, and the bit is seriously worn, and the drill is easily broken, and the number of holes, the falling speed and the rotation speed are appropriately lowered. Accurately measure the expansion and contraction of the plate to provide accurate coefficients; the number of layers is ≥14 layers, the hole diameter is ≤0.2mm or the hole-to-line distance is ≤0.175mm, and the drilling machine with hole position accuracy is ≤0.025mm; the diameter is φ4.0mm or more. Step drilling, thickness to diameter ratio of 12:1 using step-by-step drilling, positive and negative drilling method production; control drilling blunt and hole thick, high-rise board as far as possible with a new drill or grinding 1 drill hole, hole control within 25um. In order to improve the drilling burr problem of high-rise thick copper plates, the high-density pad is used in batch verification, the number of stacked plates is one piece, and the bit grinding time is controlled within 3 times, which can effectively improve the drilling burr, as shown in Figure 2 and Figure 3. Show.

For high-rise boards for high-frequency, high-speed, and massive data transmission, back-drilling technology is an effective way to improve signal integrity. The back drill mainly controls the length of the residual stub, the consistency of the holes in the two holes, and the copper wire in the hole. Not all drilling machine equipment has a back-drilling function, a technical upgrade of the drilling machine equipment (with back-drilling function), or the purchase of a drilling machine with a back-drilling function. The back-drilling technology from industry-related literature and mature mass production applications mainly includes: traditional deep-drilling method, back-drilling of signal feedback layer, and back-drilling calculation according to plate thickness ratio, which will not be repeated here.

Third, reliability testing

The high-rise boards are generally system boards, which are thicker, heavier, and larger in size than conventional multi-layer boards. The corresponding heat capacity is also large. When welding, more heat is required, and the high-temperature time of welding is long. It takes 50 seconds to 90 seconds at 217 ° C (the melting point of tin-silver-copper solder), while the cooling rate of the high-rise board is relatively slow, so the time of over-reflow soldering test is extended, combined with IPC-6012C, IPC-TM-650 standard and industry requirements. Main reliability test for high-rise boards