MacDermid Alpha Electronics Solutions

Introducing a better way to stay connected with our new Life Pages! Our solutions can be found at every level of electronics manufacturing, from wafer fabrication to final device assembly and complemented by smart surface films and in-mold electronics solutions. That’s why we've created a seamless experience to showcase our latest technology advancements and industry trends. Stay up-to-date on news and connect with our experts in your preferred segment of electronics manufacturing: Circuitry Solutions: https://lnkd.in/eC6-gYwa Semiconductor Assembly: https://lnkd.in/e6VwA2Na Wafer Level Packaging: https://lnkd.in/e-FbbcWP Circuit Board Assembly: https://lnkd.in/eskBryX7 Film & Smart Surfaces: https://lnkd.in/eB5tk-qS Explore our Life Pages and discover how our comprehensive solutions are revolutionizing the #electronics manufacturing industry! #PCB #Circuitry #PCBassembly #WaferLevelPackaging #Semiconductor #Assembly #CircuitBoardAssembly #SmartSurfaces #InMoldElectronics #ElectronicsManufacturing

🦃Wishing you all a Happy Thanksgiving from all of us at MacDermid Alpha Electronics Solutions! #thankful

There’s just one week to go before Michael Previti’s exclusive webinar: Getting Better with Getters hosted by GlobalSpec. Learn how #Getters are crucial in hermetic packages because they help maintain the integrity of the enclosed environment by absorbing harmful gases and moisture that can be released over time. These contaminants, such as hydrogen, moisture, and other gases, can degrade the functionality and reliability of sensitive microelectronic components. Without getters, hermetic packages could suffer from internal contamination, leading to device malfunctions or reduced operational life, especially in harsh environments. Don’t miss out on this opportunity. Join us on Tuesday December 3rd, 2024 at 9 AM EDT. Register now: https://lnkd.in/eWfbHkF5

Join us at the HKPCA Show Technical Conference, for two presentations from our technical experts exploring the latest solutions to enhance performance and reliability in flexible circuits and high-density applications. Ryan Tam, Technical Business Development Director, will discuss how our latest final finish innovation, Affinity™ Flex, provides stress relief and enhanced reliability for ENIG/ENEPIG fabrication of flexible circuits. Title: A New Flex Electroless Nickel Chemistry for ENIG and ENEPIG Applications Date: Wednesday, Dec 4 Time: 13:30-14:00 In our second presentation, Albert Tseng – Product Manager – Metallization will explore how combining direct metallization and viafill copper processes can improve the overall performance of high-density boards, addressing challenges associated with increased miniaturization in electronic devices. Title: Interaction and Optimization of Direct Metallization and Copper Plating Steps Date: Thursday, Dec 5 Time: 15:30-16:00 Don’t miss these opportunities to learn how to meet reliability and performance goals, addressing today’s industry challenges including increased design complexity and miniaturization. Visit our booth 8G50 to connect with our experts. For more information on our range of specialty chemistries and materials showcased at the event please visit: https://lnkd.in/efVGdjXH #hkpca #printedcircuitboard #directmetallization #finalfinishes #electronicsmanufacturing

Join us at the HKPCA show in Shenzhen, China, at booth number 8G50 from December 04-06. Discover how our full portfolio of integrated solutions, from advanced primary metallization to final finishes, enables the most complex PCB and IC substrates designs.   Connect with our experts to learn how our technologies meet the reliability and performance requirements needed to address today’s industry challenges including increased design complexity and miniaturization.   Featured technologies at the booth include:   Advanced Direct Metallization Technology – Achieve increased reliability and functionality in complex designs.   Systek™ IC Substrate Solutions - Designed for the most technically challenging high-density applications.   Affinity™ ENIG/ENEPIG – Final finishes that deliver high reliability, corrosion elimination and significant cost of ownership improvements.   For more information on the event please visit: https://lnkd.in/eUmKC4mn #hkpca #printedcircuitboard #directmetallization #icsubstrates #electronicsmanufacturing

Reducing Weight – Increasing Power SiC MOSFETs are revolutionizing power levels with up to 10% better efficiency, smaller die sizes, and eliminating the need for freewheeling diodes (FWDs) used in silicon-based systems to block sudden voltage spikes when switching the power devices. Ideal for high-performance applications like automotive inverters, SiC enables higher power, faster operation, and better temperature resilience. However, to fully harness its potential, reliable materials and interconnects are essential. Learn how we are leading the way in SiC solutions for the #automotive industry in this article by our Global Director of Power Electronics and New Business Development, Gustavo Greca: https://lnkd.in/esyG9f3y

Thank you to everyone who visited our booth at the Automotive Interiors Expo Europe! Our experts had the opportunity to connect with so many other industry leaders, design teams, and innovators who are shaping the future of automotive interiors. We were thrilled to showcase our cutting-edge solutions for automotive smart surfaces, including our XtraForm™ Materials and XMAPP™ Technology. The response to our latest innovation, XtraForm™ 3D Matt, was particularly exciting – a game-changing material that combines a premium feel with a visually stunning matte appearance, perfect for creating modern, luxury automotive interiors. Special thanks to those who attended Peter Warwick’s presentation on "The End of 'Piano Black'? Matt Finish Smart Surfaces." It was a privilege to share insights into the latest trends in automotive materials and technologies, and we look forward to continuing the conversation as we push the boundaries of design and functionality in the automotive industry. If you missed the show, the presentation, or want to learn more about how we can support you, reach out and connect with our experts here: https://lnkd.in/eKt2wAtY

Two weeks to go until Michael Previti’s exclusive webinar: Getting Better with Getters hosted by GlobalSpec. Excitement is building for Mike’s webinar as he will unveil key insights on how MacDermid Alpha’s #Getters are superior. Key Highlights: Customizability and Versatility: Advanced getters come in various forms, sizes, and material compositions to suit different application requirements. This flexibility allows for tailored solutions that can be optimized for specific environmental conditions or device structures. Proven Reliability and Longevity: Leading getters have a proven track record in harsh or demanding environments, backed by extensive testing and certifications. This reliability helps to ensure they will perform effectively over the entire lifecycle of the product, making them a sound long-term investment. Don’t miss out on this opportunity. Join us on Tuesday December 3rd, 2024 at 9 AM EDT. Register now! https://lnkd.in/eWfbHkF5

High-performance materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) are revolutionizing the future of electric vehicles. With improved power conversion efficiency, faster charging, and better motor control, automakers are taking EV manufacturing to the next level. Read more about the game-changing impact of SiC & GaN in our latest article ‘Future Trends of Power Electronics in the EV Market’ authored by Gustavo Greca, Global Director of Power Electronics and New Business Development. Link to Article: https://lnkd.in/eMfKHsRP #EV #ElectricVehicles #Semiconductors #Innovation #GreenTech #Sustainability #FutureOfDriving #SiliconCarbide #GalliumNitride 

Check out Carmichael Gugliotti’s feature, "The Cost-Benefit Analysis of Direct Metallization", in the Destination Metallization issue of I-Connect007’s October edition of their #PCB007 magazine. Direct Metallization (DM) is an innovative technology transforming the way holes are made conductive prior to electroplating during PCB fabrication. DM is a reliable and sustainable alternative to electroless copper plating, eliminating formaldehyde, EDTA, and other hazardous chemicals while significantly reducing water and energy consumption.  In the feature, Carmichael discusses our latest graphite-based #DirectMetallization technology that enables further #sustainability benefits and operational savings over electroless copper, as well as significant #reliability benefits for mSAP and high-end manufacturing. Click the link and head to page 10 to read more: https://lnkd.in/eghUwCU5 For more information on our Direct Metallization technologies visit our website: https://lnkd.in/eE7WakaD #iconnect007 #connectinglayers