Terecircuits Corporation

🚀 Thank you to all who attended our Semiconductors & AI Innovation Forum! On October 28 in the vibrant heart of San Francisco, a high-energy event united 24 groundbreaking startups from around the world with over 120 industry leaders and investors, all ready to redefine the future of #semiconductors and #AI. Thanks to everyone who attended and helped make this event unforgettable (we apologize that we couldn't accommodate 500+ of you who requested attendance). 💙 and a huge shoutout to our sponsors, Arm, and FOXCONN HON HAI TECHNOLOGY, Foley & Lardner LLP and CBRE for your awesome support! 👏 We also announced the finalists for the Extreme Tech Challenge Semiconductors & AI Innovation Startup Cup. 🎉 Congratulations to our Top 8 Finalists who now advance to pitch at #CES 2025 on January 7 in Eureka Park at Venetian Expo: Ambient Scientific, Applied Brain Research, ATLANT 3D , Jmem Tek, Literal Labs, Phanofi, Terecircuits Corporation, UncovAI 🎉 🎥 👉 Watch the video recording of all the discussions at the forum https://lnkd.in/ejNmT_f2 ✅ Remarks by Young Sohn (Walden Catalyst Ventures, Extreme Tech Challenge, Arm, Cadence Design Systems), Bill Tai (Extreme Tech Challenge ACTAI Global), Will Abbey (Arm) ✅ Fireside Chat with Young Sohn on Balancing Sustainability with the Energy Needs for AI, interviewed by David (Dede) Goldschmidt (Samsung Catalyst Fund) ✅ Panel 1: AI Chips and Infrastructure [hosted by Jonathan Charles (Samsung Catalyst Fund) with Fabrizio Del Maffeo (Axelera AI), Davor Capalija (Tenstorrent), Santosh Raghavan (Groq)] ✅ Panel 2: Interconnect and Packaging Technologies for Sustainable AI [hosted by Francis Ho (Walden Catalyst Ventures) with Alan Liu (Quintessent Inc.) and Syrus Ziai (Eliyan Corporation) ✅ Semi and AI Startup Cup - Finalists announcement See you at CES in January!

⚡Breaking boundaries in power semiconductor technology! We're thrilled to announce that we have achieved a major milestone in manufacturing the world's thinnest silicon power wafer, with a thickness of just 20μm! This innovation is a game-changer for energy efficiency, power density, and reliability in power conversion solutions. By reducing wafer thickness, we can cut substrate resistance in half, enabling power loss reductions of over 15%! 🍀 But what does this mean for you? It means more efficient power conversion solutions for AI data centers, consumer, motor control, and computing applications. With this breakthrough, we're further establishing Infineon as the industry's innovation leader, by mastering all three important semiconductor materials: Si, SiC, and GaN. 👉 Want to learn more? Join us at electronica 2024 from November 12-15 in Munich, where we'll be showcasing this groundbreaking technology. For more: https://scom.ly/6lBDVwE #PowerSemiconductor #SiliconWafer #Silicon #Micrometers #TechnologyLeader #WePowerAI

EETimes coverage of our recent "best startup" award at the 2024 74th annual IEEE Electronic Components and Technology Conference (ECTC) in Denver. Thanks, Martijn Pierik for sharing your observations from the event. It is indeed a great time to be involved in semiconductor advanced packaging! https://lnkd.in/gD6pShYG

It was an honor for Terecircuits Corporation to receive the Best Startup award at the 74th IEEE Electronic Components and Technology Conference (ECTC), May 30, 2024! We are especially proud of this recognition since IEEE ECTC is widely regarded as the premier international event bringing together the best in semiconductor packaging, components, and microelectronic systems science. Thanks to the IEEE Electronics Packaging Society, ECTC organizers, and the great panel of judges for recognizing our innovations in materials for semiconductor advanced packaging, and a shout-out to my fellow nominees Hyperlume Inc. and Thintronics® – we were in great company!

1st startup competition at IEEE ECTC drew a crowd! I was delighted to serve on the jury panel for the 1st-ever startup competition at IEEE ECTC. The competition was the brainchild of Rozalia Beica, chief commercial officer at LQDX, who said she was inspired by startup competitions she experienced at Fudan's MBA school during her IE Business School executive training! Rozalia Beica co-chaired with Farhang Yazdani, and Jeff Perkins moderated the jury panel. Wayne Rickard, CEO of Terecircuits Corporation won the competition. What's amazing was that over 650 people attended the competition, bright in the morning at 8 am! Chairs of the IEEE ECTC conference were so pleasantly surprised and inspired that talks about expanding the startup competition next year have already started. I am sure what Rozalia Beica started as a passion will become a platform for startups in the semiconductor packaging space, and we will see more startups at future ECTC conferences! For more of our view on ECTC, follow CM Venture Capital #semiconductor #ECTC #advancedpackaging #startup

[📑Full Slides📊] Did you want to learn about LIFT (Laser Induced Forward Transfer) for precision placement of MicroLEDs, and in particular about what the associated material-related challenges and solutions? In this presentation from Wayne Rickard of Terecircuits Corporation you can learn the following You can find the full slides here 👉 https://lnkd.in/ehP-vAFC *The embedded slides below are only partial To learn more about microLED, join the MicroLED Conference and Exhibition on 25 & 26 Sept 2024 in Eindhoven, Netherlands. Explore the program here 👉https://lnkd.in/dKvwis9F ✅MicroLED manufacturing process flow ✅Die cost per TV as a function of year and die size ✅Key challenges ✅Projection of penetration of different mass transfer technologies in the MicroLED market ✅Laser-Induced Forward Transfer for MicroLEDs ✅Overcoming heat, residue and placement accuracy issues ✅Conventional LIFT vs Mask Imaging ✅Addressing adjacency effects ✅Patterning and key properties of Terefilm (reactivity, transparency, etc) ✅Compatibility with laser transfer machines ✅Cost of ownership calculation ✅Roadmap You can find the full slides here 👉 https://lnkd.in/ehP-vAFC #MicroLED #MiniLED #MicroLEDConnect #Laser #LIFT #Transfer Join us in Eindhoven on 25 & 26 Sept at MicroLED Connect to connect with all the key players from around the world 👉 https://lnkd.in/dKvwis9F TechBlick Ron Mertens MicroLED-Info Dr Khasha Ghaffarzadeh

Attending the 2024 Electronic Components and Technology Conference (ECTC) next week in Denver? I'm excited to be presenting Terecircuits at the first-ever Start-up Competition at ECTC! Join me on Thursday May 30 from 8-9:15am in the Aurora A conference room for the Plenary Session: "The Future of Semiconductor Industry. Emerging Start-ups and Material Innovations in Advanced Packaging," with presentations reviewed by a panel of judges from the industry and investment community. Looking forward to seeing you at #ECTC2024 !

Next week I'll be in Washington D.C. for the first HighTech Venture Days in the US! Excited to be presenting Terecircuits on May 7-8. In the area or planning to attend? Let's meet. #HTVDUS #HTVD #startups

🚀 From 4,500 applications, Terecircuits has made it to the finals of the Hello Tomorrow Global Challenge! We are one of 7 finalists in the ‘Industry & Machines’ track, and the only US based company selected in this category! Come see our pitch by CEO Wayne Rickard at the Hello Tomorrow Global Summit on March 21st, along with 3,000 disruptive startups, investors, corporations and more. 🤝 And congratulations to our co-finalists: - DEScycle (UK) - FabNS (Brazil) - InSpek (France) - Photosynthetic (Netherlands) - Sensemore.io (Türkiye) - XtaLight (Singapore) #HelloTomorrow #microLED #semiconductor #chemistry #GlobalChallengeFinalist