Manufacturers Alliance’s Post

🚀 Big news for Arizona! 🌵 The state is now home to a flagship CHIPS research and development facility, boosting innovation in semiconductor packaging. Learn more about how Arizona is leading the way in advanced manufacturing. 🌟 🔗https://lnkd.in/g6BZhmHF #CHIPS #Innovation #Arizona #StemEd #SciTechInstitute

✨ Exciting news for Europe’s semiconductor ecosystem: Finland’s Chipmetrics is setting up shop in Dresden’s “Silicon Saxony” to launch series production of their 3D test chips. As coordinator Thomas Werner says, “If you’re in the industry, Dresden is where you need to be.” With major fabs, cutting-edge suppliers, and top research centers nearby, Dresden is the ideal environment to advance next-gen 3D semiconductor technologies. Read the full article from the link in the first comment (German) 👇

SIA commends the National Semiconductor Technology Center (NSTC) for today’s announced CHIPS for America research and development (R&D) facility. The cutting-edge new facility will focus on #semiconductor prototyping and advanced packaging R&D and will be located in Arizona, benefitting from the state’s already-strong semiconductor fabrication and advanced packaging ecosystem.    We look forward to continuing to work with leaders in Washington to ensure the CHIPS and Science Act’s R&D initiatives and manufacturing incentives remain on track to deliver big benefits for America’s economic strength, national security, and global competitiveness.   Read our full statement here: https://lnkd.in/ertwbRra

The CHIPS Act is propelling innovation within the U.S. semiconductor market. Recently, a new CHIPS for America research and development (R&D) facility has been unveiled in Arizona. This facility will focus on semiconductor prototyping and advanced packaging, further boosting technological advancements in the industry. Exciting times lie ahead for the semiconductor sector in the United States. #CHIPSAct #semiconductorjobs #mastechdigital #mastechengineering

Good summary of Morris Chang's journey.

🌟 Metrology: The Backbone of Semiconductor Innovation! 🌟 As semiconductor technology advances, metrology becomes more crucial than ever. The new CHIPS Metrology Community, part of the CHIPS for America initiative, is set to revolutionize chip manufacturing by addressing the most pressing challenges in measurement accuracy and precision. 🔬 What makes this initiative stand out? It's the focus on collaborative innovation. For the first time, key players across industry, academia, and government are coming together to develop shared standards that can accelerate breakthroughs in metrology. 🚀 Metrology is not just about detecting defects; it's about preventing them and ensuring the quality and reliability of increasingly complex chips. Exciting times lie ahead for the future of semiconductor technology! 💻✨ #Semiconductors #CHIPSAct #Metrology #TechInnovation #FutureTech #Collaboration 🔗 Learn more

Interesting opportunities on the state of semicon fabs in US

Micron wins ~$6.1B CHIPS Act grant to build three new fabs The U.S. Department of Commerce has reached a preliminary agreement with Micron (NASDAQ:MU) to provide up to ~$6.14B in direct funding under the CHIPS and Science Act. This grant will support the construction of two fabs in Clay, New York, and one fab in Boise, Idaho, unleashing approximately $50B in private investment by 2030 as the first step towards Micron’s investment of up to $125B across both states over the next two decades to build a leading-edge memory manufacturing ecosystem. In Clay, New York, the funding will support the construction of the first two fabs of a planned four fab “megafab” focused on leading-edge (dynamic random access memory) chip production. Each fab will feature 600,000 sq. ft. of cleanrooms, totaling 2.4m sq. ft. of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the U.S. The funding will also support the development of a high-volume manufacturing (HVM) fab in Boise, Idaho. This facility, co-located with the company’s existing, leading-edge R&D site, will also feature approximately 600,000 sq. ft. of cleanroom space focused on the production of leading-edge DRAM chips. Micron’s (MU) planned chip-making facilities are expected to create approximately 75,000 domestic jobs over the next 20-plus years. President Joe Biden will travel to Syracuse, New York today to announce that the grant. Today’s announcement marks the seventh preliminary award under the $53B CHIPS and Science Act, which is meant to boost chip production in the U.S.

Breaking news: Arizona State University and Deca Technologies have been chosen to lead the $100 million SHIELD USA project, an initiative to strengthen U.S. semiconductor packaging capabilities. SHIELD USA will drive innovation in the domestic microchip packaging ecosystem, expand capacity for domestic advanced packaging, and help regain U.S. leadership in microelectronics while strengthening national security. It’s the first of several R & D programs to be launched by the CHIPS Act’s National Advanced Packaging Manufacturing Program, and it will be a critical part of the broader $11 billion CHIPS research and development program administered by the U.S. Department of Commerce.  Follow along as ASU helps drive the future of microelectronics innovation. https://ow.ly/bY7050UbR1B

SK Hynix To Build $3.87 Billion Memory Packaging Fab In the US For HBM4 and Beyond: Longtime Slashdot reader DrunkenTerror shares a report from AnandTech: SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory maker and the U.S., as this is the first advanced memory packaging facility in the country and the company's first significant manufacturing operation in America. The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. Also, SK hynix agreed to work on R&D projects with Purdue University. The facility will handle assembly of HBM known good stacked dies (KGSDs), which consist of multiple memory devices stacked on a base die. Furthermore, it will be used to develop next-generations of HBM and will therefore house a packaging R&D line. However, the plant will not make DRAM dies themselves, and will likely source them from SK hynix's fabs in South Korea. The plant will require SK hynix to invest $3.87 billion, which will make it one of the most advanced semiconductor packaging facilities in the world. Meanwhile, SK hynix held the investment agreement ceremony with representatives from Indiana State, Purdue University, and the U.S. government, which indicates parties financially involved in the project, but this week's event did not disclose whether SK hynix will receive any money from the U.S. government under the CHIPS Act or other funding initiatives. Read more of this story at Slashdot.