Regine Beckmann’s Post

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Providing solutions for thermal wafer probing, warped wafers and wafer debonding

After a very interesting first day at #EuroPAT 2024 including a factory visit of #Swissbit we have the chance today to listen to very interesting presentations and discussions on #AdvancedPackaging activities in Europe

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Our colleagues Regine Beckmann and Imre Kosa are currently in #Berlin, attending SEMI Europe and #ESiPAT's EuroPAT Workshop, focusing on the latest developments in packaging, assembly and test manufacturing in Europe. Tomorrow, you can meet them both at #ESTC in Booth #12 to learn about our #AdvancedPackaging and Advanced Backend solutions, and how you can test your wafer/panels on our equipment in our newly opened #competence center, ERS Barbing. 💡 Learn more about ERS Barbing here: https://lnkd.in/dn8SRAsQ

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