Robert Quinn’s Post

The third-generation semiconductor industry is seeing significant advancements, particularly in 6-inch production lines utilizing silicon carbide (SiC) and gallium oxide (Ga2O3). On September 21, NEXIC successfully completed its first wafer batch in a new SiC fab in Jiangsu, China, with a total investment of RMB 2 billion. This fab is expected to produce 1 million wafers annually, targeting sectors like electric vehicles, 5G, and rail transit. Additionally, NEXIC is building a power module R&D base in Wuxi, with production expected by 2025. In India, RIR Power Electronics completed a SiC semiconductor plant in Odisha with a total investment of INR 5.1 billion. This factory aims to be fully operational by 2025, adding to India's growing SiC manufacturing presence. Meanwhile, China’s first 6-inch gallium oxide wafer line broke ground in Hangzhou, marking a milestone for Ga2O3 material production. These developments reflect the global momentum in next-gen semiconductor manufacturing. Thanks again to TrendForce Corporation cor for the full article with more background and insights click the source link in the comments below 💡 🙏👇 FRIENDS: Join me at the International Semiconductor Executive Summits US Power event on September 25th and 26th in Raleigh, North Carolina. A exclusive group of industry leaders will gather to explore new solutions and partnerships. With up to 150 attendees, the event features engaging speakers, a cocktail party, and a gala dinner. Contact Robert Quinn for more information. #Semiconductors #SiC #Ga2O3 #TechNews #Manufacturing #ElectricVehicles #CONNECT #COLLABORATE #COMMUNITY

🌟Industry News: STMicroelectronics' Global Strategic Expansion 🌍 STMicroelectronics just announced to invest €5 billion, with €2 billion supported by the Italian government, to build a state-of-the-art 200mm SiC chip manufacturing plant in Catania, Italy. Meanwhile, in Chongqing China, STMicroelectronics and Sanan Optoelectronics's €3 billion joint venture for 200mm silicon carbide device manufacturing is progressing rapidly, with a completion target of 2027. Last month, Sanan Optoelectronics topped out a €900 million SiC substrate plant in the area to fulfill the JV’s needs, aiming for production by August. Once operational, the JV factory will produce 520,000 automotive-grade SiC MOSFET power chips annually, supporting the EV industry. STMicroelectronics is strategically expanding its global footprint to strengthen its position in the SiC market, aiming to meet the rising demand in the automotive and industrial sectors. By leveraging regional strengths, the company is poised to enhance its innovation and manufacturing capabilities, driving forward the global semiconductor industry. Discover more via the link in the comments. 🔗 #Semiconductors #TechInnovation #STMicroelectronics #SiCChips #ElectricVehicles

Number of the Day 👍 3️⃣ 0️⃣ 0️⃣ With an absolute industry game changer, Infineon Technologies has become the first company worldwide to successfully increase the production size of gallium nitride (GaN) wafers from 200mm to 300mm in an existing and scalable high-volume manufacturing environment. We can now produce 2.3 times more chips per wafer, allowing for even more efficient production and a stronger presence in the growing GaN market. Looking forward to the electronicaFair in November 2024, when we will present the first wafers to the public. Want to learn more? Check out this interesting article from Reuters https://lnkd.in/d8EQHnhd

🗞 Electronic News! 🗞 Onsemi, a leading semiconductor company, is making significant strides in the silicon carbide market. The company is set to qualify 200mm silicon carbide wafers later this year, with production expected to begin in 2025. This move comes as onsemi reported revenue of $1.735 billion, slightly down from the previous quarters but in line with expectations. According to Hassane El-Khoury, president and CEO of onsemi, the company remains on track with its plans for silicon carbide expansion. El-Khoury stated, We are still on track to qualify 8-inch wafers this year, which will lead to revenue generation starting next year. We are also strengthening our silicon carbide position in the automotive sector, with partnerships in Europe, North America, and China. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

SIC Power Devices Market Share from 2023. In 2023, the SiC (silicon carbide) power devices industry experienced strong growth, mainly driven by battery electric vehicles (BEVs). The top five suppliers dominated the market, holding 91.9% of the total revenue. STMicroelectronics led with a 32.6% market share, and onsemi moved up to second place. Looking ahead to 2024, TrendForce forecasts a significant increase in demand from AI servers and other sectors. However, the slowdown in BEV sales and weakening industrial demand are expected to decelerate the industry's revenue growth. Key developments among leading companies include: STMicroelectronics: Building a SiC factory in Italy and a joint venture factory in China to achieve vertical integration by 2026. onsemi: Rapid growth due to its automotive EliteSiC series, with plans to transition to 8-inch wafer production by 2025. Infineon : Facing challenges with industrial market customers but strong automotive business growth, promoting a diversified supplier system for SiC materials. Wolfspeed: Despite operational missteps, it remains the largest supplier of automotive-grade SiC materials, with new production capacity expected from its JP plant. ROHM: Acquired a new plant in Japan, aiming to start 8-inch SiC substrate production, enhancing partnerships with automotive firms. TrendForce highlights that the SiC industry is in a phase of rapid growth and competition, with economies of scale becoming crucial. More than 10 companies are investing in 8-inch SiC wafer plants, intensifying market competition. #interesting #technology #semiconductor #power #innovation ROHM Semiconductor Americas Infineon Technologies Sanan Semiconductor Great chart from TrendForce!

Episil Technologies Inc. is collaborating with Vanguard International Semiconductor Corp. to expand production of 8-inch silicon carbide wafers, targeting global customers like Renesas Electronics Corp and Denso Corp. The agreement includes Vanguard acquiring a 13% stake in Episil for NT$2.48 billion. While 6-inch wafers dominate the silicon carbide market, 8-inch wafers are projected to gain significance in the next couple of years. This decision aligns with industry trends, as major chipmakers are also investing in 8-inch production. Episil's chairman expressed optimism about long-term demand despite current oversupply, as applications for silicon carbide are extending beyond electric vehicles to various sectors. The company has faced capacity challenges, resulting in a 20.23% revenue decline in the first half of the year compared to the previous year, alongside a loss of NT$212.28 million. The factory utilization rate is expected to remain below 50%, impacting gross margins, which dropped to 0.15%. However, improvement is anticipated in the fourth quarter due to stabilizing prices and rising demand. #Semiconductors #Taiwan https://lnkd.in/gsdnUcZX

Infineon Technologies AG has achieved a significant technological breakthrough by developing the world’s first 300 mm power #galliumnitride (GaN) wafer technology. As the first company to master this innovation in a scalable high-volume #manufacturing environment, Infineon is set to drive the rapidly expanding GaN #market. This new technology, which allows 2.3 times as many chips to be produced per #wafer as compared to 200 mm wafers, promises substantial efficiency gains and lower costs in GaN-based power semiconductors. In an interview with Power Electronics News, Thomas Neyer, Senior Vice President #GaN Business Line at Infineon Technologies, discussed the challenges and benefits of scaling GaN to 300 mm wafers. He highlighted the significant material quality challenges, the innovative solutions developed by Infineon, and the substantial performance and efficiency improvements expected from this transition. Article: https://lnkd.in/gUt_3M_H #powerelectronics

Hemlock Semiconductor, a Michigan-based materials manufacturer, will receive up to $325 million in federal funding under the 2022 CHIPS and Science Act to build a new facility focused on producing hyper-pure semiconductor-grade polysilicon. This investment marks Michigan’s first major allocation from the CHIPS Act and is expected to create 1,000 construction jobs and nearly 180 manufacturing roles. The company is the only U.S. manufacturer of hyper-pure polysilicon, critical for advanced semiconductors. U.S. Commerce Secretary Gina Raimondo emphasized that the U.S. is on track to triple domestic chip production, with all five global leading-edge chip manufacturers expanding in the country. Construction is set to begin in 2025, with production expected by 2028. Hemlock Semiconductor continues to play a key role in supporting both the semiconductor and solar industries with this significant expansion. Thanks again to Detroit Free Press for the full article with more background and insights click the source link in the comments below 💡 🙏👇 #CHIPSAct #SemiconductorIndustry #Polysilicon #ManufacturingInnovation #USManufacturing #MichiganTech

#AutomotiveInnovation: Worksport's GaN Semiconductor Leap! Worksport Ltd. has announced the integration of Gallium Nitride (GaN) semiconductors into its product line-up. This move not only catapults Worksport to the vanguard of automotive innovation but also signals a transformative shift in the industry's technological landscape. The GaN Advantage: 🔋 GaN's superior performance and efficiency eclipse traditional silicon-based solutions, offering faster switching speeds, lower power losses, and higher temperature endurance. 🔋 The transition to GaN semiconductors heralds a new era of power converters with greater power density, promising smaller, lighter, and more energy-efficient automotive components. Strategic Implications: ♻️ Worksport's leap into GaN technology positions it as a pioneer in the automotive sector, setting a precedent for others to follow. ♻️ Enhanced efficiency and thermal management from GaN integration are set to redefine vehicle power systems, driving the industry towards more sustainable and reliable energy consumption. Investment Insights: 💡 Worksport's foray into GaN semiconductors presents a compelling investment narrative within the automotive and clean energy sectors. 💡 The convergence of semiconductor technology and automotive innovation opens up a realm of investment opportunities in companies at the forefront of this transition. 💡 The focus on sustainability and efficiency aligns with market trends, offering a long-term value proposition for investors seeking sustainable returns. Worksport's adoption of GaN is more than just a technological upgrade—it's a commitment to pushing the boundaries of what's possible in automotive power electronics. As we witness this paradigm shift, savvy investors and industry leaders should take note of the burgeoning potential in GaN technology. Stay ahead of the curve with Market Unwinded - Your compass in the ever-evolving market landscape. Read More: https://lnkd.in/g6R8GVXc #Worksport #GaNsemiconductors #AutomotivePowerElectronics #InvestmentTrends #CleanEnergySolutions #MarketUnwinded #SustainableInnovation #AutomotiveIndustry

Major companies worldwide are investing in new 8-inch silicon carbide (SiC) production lines, with a total of 14 planned factories, according to market research firm TrendForce. Companies such as STMicroelectronics, onsemi, Infineon Technologies, Wolfspeed, ROHM Co., Ltd., Bosch, Fuji Electric Co., Ltd., Mitsubishi Electric, Vanguard International Semiconductor Company (VIS), and Hangzhou Silan Microelectronics Co., Ltd. have announced plans for these facilities. Key developments include STMicroelectronics' new plant in Catania, Italy, set to start production in 2026, and its third facility in Chongqing, China, expected to begin in late 2025. Onsemi will transition its expanded plant in South Korea to 8-inch production by 2025, while Infineon has launched the first phase of its Kulim, Malaysia plant, aiming for significant output by 2025. Wolfspeed operates the world's first 8-inch SiC plant in Mohawk Valley, New York, opened in 2022, and plans to build another facility in Saarland, Germany. ROHM's new plant in Japan is transitioning from 6-inch to 8-inch production by 2025, and BOSCH has commenced 8-inch production at its German site. Mitsubishi Electric plans to complete its plant in Japan by November 2025, while Fuji Electric is investing in SiC production capacity expected to start in 2027. China's United Nova Technology (UNT) has launched its first 8-inch SiC MOSFET production line, aiming for mass production by 2025. Silan Microelectronics has initiated China's first 8-inch SiC chip manufacturing project, with the first phase expected to produce chips by late 2025. Additionally, the FT1 Corp joint venture in Thailand is set to build the country’s first SiC factory, expected to begin production in early 2027. Currently, only Wolfspeed's Mohawk Valley plant can provide 8-inch SiC wafers, while other manufacturers are projected to start supplying them gradually from 2025. #WBG #semiconductor #fab #powerelectronics #SiC #wafers #technology #research #construction