Explore The Final Full Program: Conference Talks, Exhibition Floorplan, Masterclasses and Tours
The Future of Electronics RESHAPED conference and exhibition | Berlin | 23-24 October 2024
This is THE most important event of the year, focusing on additive, printed, sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics.
The event features
✅ 70+ speakers
✅ 80+ exhibitors showcasing all the key innovations (all spots sold out)
✅ 12 expert- and industry-led masterclasses
✅ 4 guided tours
✅ Networking with 600+ global participants
✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and masterclasses.
Explore The Agenda
See the most up-to-date conference agenda here.
23 October | Conference Day 1 Track 1
TechBlick | Welcome & Introduction
Forvia | Strategy for interiors using printing electronics
European Space Agency | Unlocking the Future of Space Electronics with Advanced Manufacturing
NextFlex | Innovations and ecosystem for hybrid flexible electronics: A US perspective*
Yole Group | Advanced Packaging at a Glance: Market Trends, Technology, and Challenges
Networking Break
FLEXOO | Mass customization & mass production of Smart Sensors
Beckermus Technologies Challenges of interconnections between chips and flex substrates
Avery Dennison Smartrac c | Green Printing in the Digital Landscape - from fab to mass production
SPGPrints | The 3 C’s of de-risking industrialized Printed Electronics production
db-matik AG | From Printtronic to Assembly on Flex
Lunch & Exhibition Break
Motherson Innovations | From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces
Würth Elektronik Group | State of the art of the industrial stretchable PCB and its potential for future development
Metafas BV | Printing Electronics: Technical and Business Transition from the manufacturing of Membrane Switches to Printed Electronics, including smart textiles and smart plastics
Kimoto Europe | Adhesive carrier and protection films for advanced manufacturing
Exhibition & Refreshment Break
Marquardt Group | Printed electronics: why is it difficult to leave the ‘trough of disillusionment’?
Semikron Danfoss | Classifying Additive Electronic Manufacturing Technology: From 2D to 3D and From Simple to Complex System
Track 2
BSC Computer + Momentive | Sustainable Motion based on Silicone
X-trodes | Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation
Creative Materials, Inc. | Advances in Materials for Additively Manufactured Electronics Skin Patches
TECNALIA Research & Innovation | Composites functionalization via printing: adding even more value to fibre-reinforced plastics
Printed Electronics Limited | Multi-layer Printed Electronics Manufacturing Across the Resolution Spectrum: From 1µm to Beyond 1m*
Lunch & Exhibition Break
Decathlon | How Plastronic LDS process can reduce CO² emissions for Electronics devices
Horizon Microtechnologies chnologies | Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications
LPKF Laser & Electronics SE s | Semi Additive Glass-Based Advanced packaging for HPC and Chiplet Application*
Exxelia Micropen pen | Functionalization of Medical Devices Using Additive Dispense Technology
Track 3
FUJI CORPORATION ion | New era of additive manufactured electronics with the integration of SMT process and machine.
Elephantech Inc. | Printed Electronics as sustainable solutions
Nano OPS, INC. | Fully Additive Manufacturing of Electronics at the Nano and Microscale for Making Active Components and Integrated Circuits
Notion Systems | Advancing Additive Processes into Electronics Mass Production - Breaking Boundaries One at a Time
Henkel + Teca-Print | Advancing Pad Printable Solutions with Henkel Materials
Lunch & Exhibition Break
Holst Centre + imec | True competitiveness of printed electronics: is it really more sustainable than PCBs?
Pragmatic Semiconductor | Bringing flexible intelligence to Medicine 3.0
Essemtec | Enhancing circular economy by facilitating the repair of electronic components
Jiva Materials Ltd | Fully recyclable PCB substrate
24 October | Conference Day 2 Track 1
Binghamton University | Fabrication of Multi-Sensor Vital Sign Patches for Ambulatory Care*
University of Texas at El Paso | Additive Manufacturing of Elastomer, Ceramic and Metal Multi-functional Structures*
Ceradrop | Digital Printed Electronics solutions : enabling industrialisation
Voltera | Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors & more
Exhibition & Refreshment Break
Texavie | Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels
Danish Technological Institute | DTI Printed Electronics: On body eTextile sensors for physiological and neurological monitoring
Datwyler | Smart Elastomer based Sensors and Actuators
Nanoleq | Unique Sticky Dry Electrode for Innovative Textile Integration (reusable, washable, stretchable)
PROFACTOR | Concept for direct integration of electronic circuits and sensors on textiles using inkjet printing.
Lunch & Exhibition Break
Light Tree Ventures Group | Large-area wearable LED light therapy*
TU Eindhoven | The road ahead for integrated photonics
Sungkyunkwan University | Sustainable Roll-to-Roll Printing Foundry for Realizing 4 Things: Internet of Things (IoT), Display of Things (DoT), Vision of Things (VoT), and Care of Things (CoT)
Exhibition & Refreshment Break
Fuelium | Fit-To-Purpose batteries for responsible portable electronics.
Papierfabrik Louisenthal GmbH | Large-scale fabrication of low-haze transparent metal mesh foils
AdapTronics | Thin-layer electro-adhesive gripper technology with printed flexible electronics
Alpha Micron | Guest-host liquid crystal system for AR/VR/XR applications
Track 2
Technische Hochschule Ingolstadt | Particle Free Copper Inks
Tesa | Display mounting tapes – next generation of debonding on demand Air Force Research Laboratory | Liquid Metal Inks for Printed Stretchable Electronics Ames Goldsmith | Advances in metallic particle development and manufacturing: impact on paste and final application
Exhibition & Refreshment Break
Coatema | Tech Pillars of the green hydrogen economy – how to scale the production methods for PEM Fuel cells from lab2fab.
Panacol | Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications
Fraunhofer ISE | Thinner than a human hair - fine line metallization for next-generation silicon solar cells
ISC Konstanz | Copper ink and electrically conductive adhesives for future PV production
FOM Technologies | The role of slot-die coating in the future of photovoltaics.
Lunch & Exhibition Break
Hasselt University | ACT-3D_Assembly and Connection Technology for 3D plastic carriers
Hahn-Schickard Institute | Hybrid 3D printing of conductive bulk metal and dielectric polymer for sustainable and smart 3D electronics
Karlsruhe Institute of Technology | The Aerosol-on-Demand (AoD) jet-printing principle: a novel concept for 3D-printed electronics
Track 3
PolyPhotonix | Saving Sight with Light: Treatment for Diabetic Eye Disease
Global Access Diagnostics (GADx) | Advancing Innovative Diagnostics for Global Health
Meta | Noninvasive Biopotential Sensors for Future Wearable Electronics
Nagase ChemteX | Conductive Inks for Wearable/ Stretchable Electronics
Exhibition & Refreshment Break
Hamamatsu Photonics | Thermal Laser Processes in Printed Electronics
PERC | Additive Manufacturing for Advanced Microwave and RF Applications
Sun Chemical | Biosensor Materials Requirements – Challenges and Opportunities
Airbus | 3D printed and hybrid electronics durability under aeronautic conditions
Neotech AMT | 3D Printed Electronics – Towards Sustainable Mechatronic Systems
Lunch & Exhibition
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Masterclasses and Tours
Explore our masterclass and tour program here.
Masterclasses | Track 1
Masterclasses | Track 2
Masterclasses | Track 3
Tours to: Quantica, Fraunhofer IAP, Fraunhofer IZM, Inuru
Exhibition Explore the exhibition floor here
Gold Exhibitors
CCI Eurolam - B04
Celanese Micromax - B04
Nagase ChemteX America - B05
Notion Systems GmbH - A05
Voltera - C01
Silver Exhibitors
AKONEER - C04
Ames Goldsmith - A04
COATEMA - B01
CondAlign - B10
Creative Materials Inc - R01
Danish Technologic - G04
db-matik AG - A06
Eastman Kodak - D06
Fuji Corporation - U03
Hamamatsu - G03
Henkel - D02
Heraeus Electronics - A01
Holst Centre - B02
Hummink - D01
ImageXpert - G10
INO, d.o.o., Žiri - D11
Intellivation LLC - S02
Kimoto - A07
Linxens - B07
Metafas - C08
Nano OPS - T01
Neotech AMT - C07
Panacol-Elosol - C03
PEL - T03
Panasonic - U06
Pragmatic - G01
Quantica GmbH - D14
SPGPrints - G05
Sun Chemical - A09
SunRay Scientific - G02
SUSS MicroTec - F05
tesa - U04
TracXon - F06
VTT - C02 XTPL - B03
Standard Exhibitors
3E Smart Solutions - U01 ACI Materials - B11 Agfa - D04
Arkema - E01
ATLANT 3D - F07
Born GmbH - F08
BotFactory - S01
CEA - E09
MGI Ceradrop - E10
Chimet S.p.A - A10
Conductive Technologies - D08
Coveme Spa - A08
DELO Industrial Adhesives - U02
DoMicro BV - C10
ELANTAS - B08
Exxelia - U05
Fraunhofer IAP - A03
Fraunhofer IFAM - C09
Fraunhofer IZM - G08
FUJIFILM Dimatix - C05
JOANNEUM RESEARCH - B09
MAASS - E05
Metalor - D10
NRCC - G09
GmbH - A02
Normandy Coating - E04
nsm Norbert Schläfli - D07
Nuovo Film - F03
Policrom Screens - T02
PrintUp Institute - F02
Protavic International - E03
PVF Mesh & Screen Tech - G06
RISE - G11
RK Siebdrucktechnik - F04
SERISTAMPA - D09
SpeedPox - G07
Teca-Print - D03
VFP Ink Tech - E02
We look forward to welcoming you at our event!