Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip
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Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip
Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing
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It used to be that the #automotive electronics were not based on the most advanced node technology. But with the advent of the Software Defined Vehicle, those days are gone. In our latest guest blog post, Prasad Dhond of Amkor Technology, Inc. discusses the changing times, and how advanced nodes are now making their way into automotive compute processors, and what that means for advanced packaging technologies. https://lnkd.in/gZ4jPYZR
Driving Into the Future: The Next Phase in Automotive Compute Package Adoption - 3D InCites
3dincites.com
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Intel×Kudan https://lnkd.in/g9UVzyYX #Intel #Kudan #AMR Accelerating AMR Time to Market with Kudan and Intel Intel and Kudan's complete end-to-end solution enables you to quickly and easily develop, build, and deploy spatially aware autonomous mobile robots (AMRs). Building Robust, Reliable AMRs for Harsh Environments Kudan and Intel are helping today's leading OEMs and developers overcome the cost and complexity barriers they face in deploying accurate, spatially aware, production-ready AMRs. Kudan's commercially-ready SLAM software (KdVisual) leverages key Intel® technologies to make AMR faster and more cost-effective while reducing CPU utilization and power consumption. Intel® Core™ processors deliver exceptional SLAM performance with improved speed, accuracy, and reliability, while Intel® Edge Insights for AMR (EI for AMR) accelerates development applications for robotic mapping and navigation. Solve your most pressing adoption problems and deploy AMRs that are spatially aware and ready to operate with the help of Kudan and Intel.
Intel and Kudan: Accelerate AMR Time to Market
intel.com
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The market analyst predicts that RISC-V will enjoy the strongest growth in the automotive sector, although the industrial space will remain the largest application for the technology. Additionally, the rise of AI will be instrumental in the continued rise of RISC-V. RISC-V is license-free, allowing anyone to develop hardware using the architecture and even to customize the instruction set according to the needs of the design. This will provide a key advantage of processor architecture provider ARM Holdings plc. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory
Edge AI Boosts RISC-V's Market Share to 25%
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Metadata is a basic enabler. Without metadata, NO data can be found/retrieved, even by the most advanced technologies, like AI, quantum computers, etc. https://lnkd.in/g-aJFnXR Do you or any contacts of yours need our expertise/IP, a copyrighted multilingual metadata, that can do what high technology, like AI, high-end chips, supercomputers, etc., can't do NOW? Thanks. Due to its origin of weapon, AI has risks itself. European Parliament's AI Act has identified a practical list of high-risk AI applications, and EDUCATION is on the list. This Act has been approved by European Council 🇪🇺. 關於 AI 人工智能的一些事實 (Chinese version): https://lnkd.in/eeVbdcza Some fact findings about AI (English version): https://lnkd.in/gwcPNUPP
Check out the announcements shared by our CEO Jensen Huang—featuring new semiconductors, software and systems to power data centers, factories, consumer devices, robots and more. #COMPUTEX2024 #acceleratedcomputing
‘Accelerate Everything,’ NVIDIA CEO Says Ahead of COMPUTEX
blogs.nvidia.com
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Millimeter-wave testing demands new approaches, balancing precision with cost-efficiency remains challenging. Semiconductor Engineering #MillimeterWaveTech #TestingInnovation #CostEffectiveTesting #PrecisionMatters #TechChallenges #AdvancedTesting #lemonflipsolutions
Signals In The Noise: Tackling High-Frequency IC Test
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STMicroelectronics has introduced an exciting #ecosystem called ST #BrightSense that enhances #camera performance globally. Let’s dive into the details: #mobilerobots #sensors #ProductsNews #electronicsnews #technologynews
STMicroelectronics unveils ST BrightSense for enhanced camera performance globally
timestech.in
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Interesting conversation led by Semiconductor Engineering's Ann Mutschler on the transformation of the automotive ecosystem toward software-defined vehicles. What is needed now is a holistic in-vehicle networking evolution capable of meeting the rising bandwidth demands of SDVs and other automotive innovations. In our view, that next evolution is a centralized architecture with a network that can support access to all of a vehicle’s data. Learn more from Ann and her expert panel: https://lnkd.in/gVMf6iaa And learn more about Ethernovia's view on meeting these exponentiating bandwidth demands: https://lnkd.in/dVY6DuA6 #ElectricVehicles #Networks #Architecture #ADAS #Autonomousdriving #SDV
Software-Defined Vehicle Momentum Grows
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💡 A great quality analysis from Semiconductor Engineering exploring testing and validation challenges associated to ongoing advancements in high- frequency semiconductor devices. Among other experts, EnSilica's SVP of Engineering Alan Wong shares his views on this important topic. 💡 https://lnkd.in/etCeCrqF #ASIC #CustomASIC #ASICdesign
Signals In The Noise: Tackling High-Frequency IC Test
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