Amkor Technology Portugal S.A’s Post

Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip

It used to be that the #automotive electronics were not based on the most advanced node technology. But with the advent of the Software Defined Vehicle, those days are gone. In our latest guest blog post, Prasad Dhond of Amkor Technology, Inc. discusses the changing times, and how advanced nodes are now making their way into automotive compute processors, and what that means for advanced packaging technologies. https://lnkd.in/gZ4jPYZR

Intel×Kudan https://lnkd.in/g9UVzyYX #Intel　#Kudan #AMR Accelerating AMR Time to Market with Kudan and Intel Intel and Kudan's complete end-to-end solution enables you to quickly and easily develop, build, and deploy spatially aware autonomous mobile robots (AMRs). Building Robust, Reliable AMRs for Harsh Environments Kudan and Intel are helping today's leading OEMs and developers overcome the cost and complexity barriers they face in deploying accurate, spatially aware, production-ready AMRs. Kudan's commercially-ready SLAM software (KdVisual) leverages key Intel® technologies to make AMR faster and more cost-effective while reducing CPU utilization and power consumption. Intel® Core™ processors deliver exceptional SLAM performance with improved speed, accuracy, and reliability, while Intel® Edge Insights for AMR (EI for AMR) accelerates development applications for robotic mapping and navigation. Solve your most pressing adoption problems and deploy AMRs that are spatially aware and ready to operate with the help of Kudan and Intel.

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Millimeter-wave testing demands new approaches, balancing precision with cost-efficiency remains challenging. Semiconductor Engineering #MillimeterWaveTech #TestingInnovation #CostEffectiveTesting #PrecisionMatters #TechChallenges #AdvancedTesting #lemonflipsolutions

💡 A great quality analysis from Semiconductor Engineering exploring testing and validation challenges associated to ongoing advancements in high- frequency semiconductor devices. Among other experts, EnSilica's SVP of Engineering Alan Wong shares his views on this important topic. 💡 https://lnkd.in/etCeCrqF #ASIC #CustomASIC #ASICdesign

#Automotive #Semiconductor March Madness 2024 The growing number of #chips in #vehicles puts a spotlight on data transport architectures 💡 As the US is amid “Basketball March Madness” – hard to ignore when you live in #SiliconValley – it also felt like the month of “Automotive Madness.” We saw numerous announcements and events across the design chain, from semiconductor #IP to #software and IP providers to automotive OEMs. And in all of them, data-transport architectures, and with that networks-on-chips (NoCs), are critical. A big thank you again to Frank Schirrmeister for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eC8QjpFm #semiconductorindustry #semiconductors #technology #tech #it #chip #automotiveindustry #ic #icdesign #foundry #automotivetechnology #it

Hey LinkedIn Authored and Compiled a project Cooling Automobiles with Airjet Impingement: An Intel oneAPI and OpenVINO Approach in Intel DevMesh Do check out and let me know for necessary incorporations Intel Corporation

🎉🎉 NVIDIA cuOpt is now generally available 🎉🎉 Just announced at #GTC24 - NVIDIA cuOpt owns 23 world records for route optimization and is now generally available. Check out these blogs and videos highlighting how cuOpt is reinventing logistics management and operations research. - Watch this YouTube Short to quickly grasp the idea of what cuOpt is and what it can do: https://lnkd.in/dQQd2pYS - Read our latest blog to learn how cuOpt is helping Kawasaki Heavy Industries improve railway safety (in partnership with #Slalom) and SyncTwin in optimizing routes in manufacturing.: https://lnkd.in/dNti4TPU - Learn about the detailed case study about Kawasaki Heavy Industries: https://lnkd.in/dQWnuZNY #RouteOptimization #NVIDIAcuOpt

According to TSMC, the approach for Tesla’s new product differs from the wafer-scale systems provided to Cerebras. Essentially, the Dojo training modules (a 5×5 grid of pretested processors) are placed on a single carrier wafer, with all empty spaces filled in. Subsequently, TSMC’s integrated fan-out (InFO) technology is utilized to apply a layer of high-density interconnects. This process significantly enhances the inter-chip data bandwidth, enabling them to function like a single large chip. #electromobility #evs #mobilitysolutions #semiconductor #chips #futureisnow