Interesting conversation led by Semiconductor Engineering's Ann Mutschler on the transformation of the automotive ecosystem toward software-defined vehicles. What is needed now is a holistic in-vehicle networking evolution capable of meeting the rising bandwidth demands of SDVs and other automotive innovations. In our view, that next evolution is a centralized architecture with a network that can support access to all of a vehicle’s data. Learn more from Ann and her expert panel: https://lnkd.in/gVMf6iaa And learn more about Ethernovia's view on meeting these exponentiating bandwidth demands: https://lnkd.in/dVY6DuA6 #ElectricVehicles #Networks #Architecture #ADAS #Autonomousdriving #SDV
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Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip
Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing
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Cybertruck's Etherloop: A big step to Software Define Vehicle with Ethernet backbone #Tesla, #Cybertruck With information sharing from Tesla, it seems that Tesla already make a big step to SDV with Ethernet backbone (source https://lnkd.in/g-XVQ5QS). We don't know detail about functions decomposition but it is clearly that most of function in vehicle already based on ethernet backbone. Additionally, Left/Right/Rear controller connect to most of peripheral play the role of zoner controller in automotive architecture trend. With these information, seem that Tesla already reach the level of latest architecture for central computing.
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Semiconductor Engineering organized a round table discussion involving a group of semiconductor engineers and their peers to explore the effects of shifts in the automotive ecosystem and the ongoing transition toward software-defined vehicles. I invite you to follow this discussion in a two part series where our very own Stefano (Steve) Spadoni was able to participate and discussed the future of vehicles. Part 1: https://lnkd.in/ei7k8r3R Part 2: https://lnkd.in/eSWGXVxR #automotive #digitalization #decarbonization #powerdistribution
Moving Software-Defined Vehicles Forward
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Robert Bielby’s new blog post for The_TechArena dives into a hot topic in automotive innovation: the rise of chiplets and the impact of UCIe standards. As we push towards Level 3 ADAS, the need for sophisticated SoCs is clear—chiplets are becoming our go-to solution for handling diverse and demanding workloads with unmatched efficiency. Bielby expores how UCIe 1.1 isn't just a tech upgrade—it's shaping the future of automotive electronics with features that enhance safety and performance, paving the way for advanced AI and high-efficiency computing. I’m eagerly anticipating UCIe 2.0 and its upcoming features. Let’s keep pushing the envelope and stay ahead in this transformative space! https://hubs.ly/Q02KH9Rb0 #AutomotiveTech #Chiplets #UCIe #ADAS #FutureOfDriving
Automotive Meets Chiplets: Robert Bielby’s Perspective on the Impact of Level 3 ADAS on Emerging Semiconductor Tech — TechArena
thetecharena.net
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Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip
Powering The Automotive Revolution: Advanced Packaging For Next-Generation Vehicle Computing
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I'm excited to share that #Karma Automotive is integrating Intel Automotive solutions in their next generation vehicle platforms. This isn't just about electric; it's about intelligent. We're talking centralized compute, AI-powered energy management, and a truly software-defined architecture. This partnership is about more than just building exceptional cars; it's about setting a new standard for the entire industry. Karma's vision, combined with Intel's technology, will redefine what's possible for future vehicles Congratulations to the entire Karma team on this groundbreaking move! The future of automotive is here, and it's software-defined. The full news is available here: https://lnkd.in/g-QQPMat #intelautomotive #KarmaAutomotive #automotiveindustry #automotivetechnology #automotivetech #SoftwareDefinedVehicle #SDV #OEM
Karma Automotive Goes All-In with Intel for a Software-Defined Future
intel.com
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The market analyst predicts that RISC-V will enjoy the strongest growth in the automotive sector, although the industrial space will remain the largest application for the technology. Additionally, the rise of AI will be instrumental in the continued rise of RISC-V. RISC-V is license-free, allowing anyone to develop hardware using the architecture and even to customize the instruction set according to the needs of the design. This will provide a key advantage of processor architecture provider ARM Holdings plc. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory
Edge AI Boosts RISC-V's Market Share to 25%
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Semiconductor Engineering I was recently part of a fascinating roundtable with @Semiconductor Engineering, which discussed the future of vehicles—Software-Defined Vehicles (SDVs). We dug into the nitty-gritty of building these software powerhouses, from ensuring top-notch safety and security to finding the best platform for development. If you're in the automotive space and curious about where things are headed, I encourage you to check out this 2-part conversation. Part 1 – https://lnkd.in/g5bfQSjQ Part 2 – https://lnkd.in/gZYxscnK #SDV #FutureofMobility #AutomotiveTech P.S. Any other gearheads out there obsessed with the future of cars? Let's chat in the comments!
Moving Software-Defined Vehicles Forward
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It used to be that the #automotive electronics were not based on the most advanced node technology. But with the advent of the Software Defined Vehicle, those days are gone. In our latest guest blog post, Prasad Dhond of Amkor Technology, Inc. discusses the changing times, and how advanced nodes are now making their way into automotive compute processors, and what that means for advanced packaging technologies. https://lnkd.in/gZ4jPYZR
Driving Into the Future: The Next Phase in Automotive Compute Package Adoption - 3D InCites
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