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Robert Bielby’s new blog post for The_TechArena dives into a hot topic in automotive innovation: the rise of chiplets and the impact of UCIe standards. As we push towards Level 3 ADAS, the need for sophisticated SoCs is clear—chiplets are becoming our go-to solution for handling diverse and demanding workloads with unmatched efficiency. Bielby expores how UCIe 1.1 isn't just a tech upgrade—it's shaping the future of automotive electronics with features that enhance safety and performance, paving the way for advanced AI and high-efficiency computing. I’m eagerly anticipating UCIe 2.0 and its upcoming features. Let’s keep pushing the envelope and stay ahead in this transformative space! https://hubs.ly/Q02KH9Rb0 #AutomotiveTech #Chiplets #UCIe #ADAS #FutureOfDriving

Prasad Dhond, VP of Wirebond BGA Products at Amkor Technology, Inc., recently shared insights into the evolving #automotiveindustry in the #blog post titled "Powering The Automotive Revolution: #AdvancedPackaging For Next-Generation Vehicle Computing." As #vehicles transition to centralized computing architectures, Dhond highlighted the advantages of splitting System-on-Chips (SoCs) into #chiplets, positioning it as a logical solution to address size and cost challenges. This strategic approach leverages advanced packaging techniques, enabling #automakers to deliver powerful and efficient #computing solutions for next-generation vehicles. To explore Dhond's insights further, you can read the full blog post here: https://lnkd.in/gGgX6KJt #semiconductorindustry #automotivetechnology #automotiveelectronics #semiconductor #chiplet #HBM #SoC #automotivemanufacturing #semiconductormanufacturing #microchip

Renesas Electronics, a leading semiconductor company, recently introduced a groundbreaking AI accelerator designed for real-time processing of lightweight algorithms in robots. The company showcased this cutting-edge technology at the prestigious International Solid-State Circuits Conference held in San Francisco. The AI accelerator developed by Renesas is specifically tailored to meet the demands of modern robots. It combines conventional processing capabilities for planning and control with AI processing power of approximately 100Top/s peak for vision-based environmental recognition. Remarkably, the accelerator achieves this high performance while maintaining low power dissipation, eliminating the need for additional cooling mechanisms such as a fan. The power consumption of the 14nm integrated circuit stands at around 5W. #electricalengineering #electronics #embedded #embeddedsystems #electrical Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Neusoft and ThunderSoft have partnered with Intel to utilize a compute platform for intelligent cockpit designs with AI customization that can scale across generations of vehicles. This collaboration aims to develop new solutions based on Intel's AI-enhanced software-defined vehicle system-on-chip to power the intelligent cockpit of next-generation vehicles for automakers. Neusoft is leveraging the first-generation software-defined vehicle SoC family for its Intelligent Cockpit Domain Controller. This controller supports multiple screen sizes, multimodal interaction, 3D user interfaces, augmented reality navigation, and driver and occupant monitoring. It also enables offline deployment of large models within the vehicle to meet the increased demand for privacy and low-latency user experience. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Interesting conversation led by Semiconductor Engineering's Ann Mutschler on the transformation of the automotive ecosystem toward software-defined vehicles. What is needed now is a holistic in-vehicle networking evolution capable of meeting the rising bandwidth demands of SDVs and other automotive innovations. In our view, that next evolution is a centralized architecture with a network that can support access to all of a vehicle’s data. Learn more from Ann and her expert panel: https://lnkd.in/gVMf6iaa And learn more about Ethernovia's view on meeting these exponentiating bandwidth demands: https://lnkd.in/dVY6DuA6 #ElectricVehicles #Networks #Architecture #ADAS #Autonomousdriving #SDV

Some serious AI is starting to come to fleet management. Intel's new tech is set to make a big impact on the industry, especially with its ability to support high-fidelity experiences and integrate smoothly. For those in the industry, this means new ways to boost operational efficiency, enhance safety, and even personalize vehicles in ways we hadn’t thought possible. As AI continues to shape the automotive world, the A760A is definitely a development worth keeping an eye on. #FleetManagement #AutomotiveInnovation #AIinVehicles

Continental Pioneers #AutomotiveInnovation with Cross-Domain High-Performance Computer Continental has unveiled a groundbreaking cross-domain High-Performance Computer (#HPC) that marks a significant leap in automotive technology. This innovative solution integrates cockpit and additional vehicle functions, including driving safety, automated parking, and holistic motion control in a real-life vehicle application. This advancement underscores Continental’s commitment to the evolution of software-defined vehicles (#SDVs). The introduction of this HPC is a testament to the capabilities of Continental's cloud-based platform, the @Continental Automotive Edge Framework (#CAEdge). CAEdge connects vehicles to the cloud, providing a virtual workbench for the seamless development, supply, and maintenance of software-intensive system functions. This platform is a cornerstone of the SDV ecosystem, enabling streamlined processes from road to cloud. Powered by the Snapdragon Ride Flex System-on-Chip (SoC) with the pre-integrated Snapdragon Ride Vision perception stack from Qualcomm Technologies, Inc., the HPC sets new standards in automotive innovation. This integration enhances the car’s performance by supporting multi-modal critical workloads on a single chip, optimizing cost, power, and performance. Gilles MABIRE, CTO at Continental Automotive, emphasized the importance of this innovation, stating, "With the SDV technology car, we demonstrate our ecosystem from road to cloud, and from virtual to real. We are proud to move beyond concepts and showcase the convergence of automotive domains in a tangible software-defined vehicle." The SDV technology car features a comprehensive array of functions, including automated parking with holistic motion control, ultrasonic sensors, an integrated brake system, and surround-view cameras, all managed by the cross-domain HPC. Jean-Francois Tarabbia, Head of Business Area Architecture and Networking at Continental, highlighted the significance of this step, noting, "This is crucial to show that combining several control units in one HPC is feasible and can deliver the cost benefits we aim to achieve." Enrico Salvatori, SVP and President of Qualcomm Europe/MEA, expressed excitement about the collaboration, stating, "Seeing the Flex SoC realized in Continental’s HPC and new SDV technology car is very exciting. The Flex SoC offers a more integrated and adaptable approach to vehicle architecture development." Continental’s CAEdge platform, a cloud-based environment for efficient software development, connects vehicles to the cloud and provides a virtual workbench for testing and debugging software-intensive systems. This innovative approach accelerates development timelines and sets a new standard for SDV applications. #Automotive #Innovation #SoftwareDefinedVehicles #SDV #CAEdge #HighPerformanceComputing #Qualcomm #Snapdragon #Continental

Interesting to see how Renesas Electronics family of microprocessors will bode in the ever evolving #robotics industry. Renesas is already successful in the automotive industry and industrial automation and now with the introduction of its new family of MPUs is targeting high performance robotics applications. "The RZ/V2H enables both vision AI and real-time control capabilities and the device comes with a new generation of proprietary AI accelerator, the DRP (Dynamically Reconfigurable Processor)-AI3, delivering 10 TOPS/W power efficiency, which represents a 10-fold improvement over previous models." https://lnkd.in/dJX_rZwi

Silicon photonics is the future of high-speed data communication, LIDAR for autonomous driving, advanced optical sensors in consumer electronics and life science, and high-performance computing. The Silicon Photonics market is set to grow in size from around $480m as measured in 2019 to around $3.9B by 2025 according to the global analyst firm Yole 1. MRSI Systems is supporting manufacturing customers to capitalize on this new technology by providing a range of platforms for automating the process of designing and fabricating silicon photonics components. Learn more: https://lnkd.in/ewN4akeV

🚗💡 Accelerating ADAS Adoption - https://hubs.li/Q02Vjk1Q0 In this recent blog, Arm's director for automotive go-to-market (EMEA) showcases how LeddarTech- Automotive Software: Low-Level Sensor Fusion & Perception is optimizing ADAS perception and fusion algorithms with Arm's cutting-edge technology. LeddarTech is seeing significant performance gains using the Cortex-A720AE CPU and SVE2 features, pushing the boundaries of automotive safety and efficiency. Stay tuned for more updates, including our work on enabling a cloud version (AWS G5g and SOAFEE-EWAOL), ISP training, and image preprocessing optimization. Join LeddarTech at the Automotive Computing Conference in Munich (November 18-19, 2024), where Arm and LeddarTech will jointly demonstrate LeddarVision on SOAFEE! 📖 Read the blog: https://hubs.li/Q02Vjk1Q0 #LeddarTech #ADAS #SensorFusion #AI #AutomotiveTechnology #Arm #AutonomousDriving #CloudComputing #Innovation