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News about semiconductors is everywhere right now. What are the trends driving the industry? Is the fab story really as rosy as it seems? What is the promise of 3D-IC? In this candid Q&A with ELE Times, Madhavi Rao talks about these trending topics and more. https://ow.ly/awUc50RazfL #Cadence #ChipDesign #Innovation #ELETimes #Semiconductor

Multi-tech #semiconductor pilot line launched in #France 🇫🇷 "The #EU #ChipsAct Initiative has brought forth another  #semiconductor pilot line. Yesterday, CEA-Leti announced the launch of the Fames Pilot Line, an 830-million-euro initiative to explore 10nm and 7nm FD-SOI along with four other sets of technologies. The pilot line will be accessible to all #universities, #research and #technology organizations, #SMEs and industrial companies from the EU and “like-minded” countries. In FD-SOI, #FETs are manufactured on top of a buried oxide layer, resulting in better electrostatic characteristics and reduced leakage currents compared to bulk #CMOS. This makes FD-SOI an interesting alternative for low-power, #RF and millimeter-wave applications, among others. Both Globalfoundries, which runs a fab in Dresden, and STMicroelectronics are major FD-SOI players and have teamed up to keep scaling the technology. The Fames Pilot Line will also focus on several types of embedded non-volatile memories (#OxRAM, #FeRAM, #MRAM and #FeFETs), RF components (switches, filters and capacitors), two 3D integration options (heterogeneous and sequential) and small inductors to develop DC-DC converters for power management integrated circuits (#PMICs). According to the press release, the five new technologies will create market opportunities for low-power microcontrollers (#MCUs), multi-processor units (#MPUs), cutting-edge #AI and #machinelearning devices, smart data-fusion processors, RF devices, chips for 5G/6G, chips for #automotive markets, #smartsensors and imagers, trusted chips and new space components. Fames is coordinated by CEA-Leti, but #research institutes all over #Europe are involved as well. The project is funded in equal parts by participating member states and the #EU’s Chips Joint Undertaking." Thank you Bits&Chips for the article.🙏 🔴https://lnkd.in/d_RrEuxU

The EU dream to build advanced chips has shattered, and rightfully so : https://lnkd.in/eBgVE7wG Interest group European Semiconductor Industry Association (ESIA) suggests that Europe should not compete to make advanced chips on its own continent. Instead, the group, whose members include NXP Semiconductors, Nexperia, GlobalFoundries, and Intel Corporation, wants to emphasize semiconductors on legacy, familiar processes. This is perhaps the curtain call for an European Union pipe dream. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

MULTI-TECH SEMICONDUCTOR PILOT LINE LAUNCHED IN FRANCE Exciting developments in the semiconductor world! The EU Chips Act Initiative has launched another pilot line, with CEA-Leti unveiling the Fames Pilot Line. This 830-million-euro project will focus on 10nm and 7nm FD-SOI and four other key technologies. Accessible to universities, SMEs, and industrial players across the EU and "like-minded" countries, this initiative is set to drive innovation in the sector. FD-SOI offers improved electrostatic characteristics and reduced leakage currents, making it ideal for low-power and RF applications. Major players like GlobalFoundries and STMicroelectronics are advancing this technology. The Fames Pilot Line will also explore embedded non-volatile memories, RF components, 3D integration options, and small inductors for PMICs. These technologies promise market opportunities in AI, 5G/6G, automotive, and more. Coordinated by CEA-Leti, this project is a collaborative effort funded by EU member states and the Chips Joint Undertaking. Thanks again to BITS&CHIPS for the full article with more background and insights click the source link in the comments below 💡 🙏👇 Visit International Semiconductor Executive Summits #Semiconductors #Innovation #TechNews #EUTech #FD-SOI #AI #5G

New Episode of Technology and Electronics News - Electronica 2024 kicks off in Munich from November 12th–15th, gathering 3,000+ exhibitors and spotlighting breakthroughs in AI, decarbonization-driven semiconductors, and next-gen Gallium Nitride and Silicon Carbide technology. - TSMC’s Major Move: Compliance with U.S. restrictions halts AI chip production for Chinese clients, raising stakes in global semiconductor politics. - TSMC’s U.S. Expansion: A $65 billion investment in Arizona keeps momentum strong, despite political shifts. - Semiconductor Market Growth: Q3 2024 sales soar 23.2% year-over-year, with growth regional dynamics and challenges revealed. - Power Electronics Shake-Up: The market faces overcapacity and global tensions, but innovations and diversification beyond EVs lead the way. - ChipsJU: PIXEurope sets its sights on a world-leading photonic integrated circuits ecosystem. - Infineon’s AURIX™ TC4Dx Microcontroller launches, aiming to redefine software-defined vehicles with powerful six-core tech. - US CHIPS Act Funding Race: High-stakes maneuvers continue as companies secure government backing amid a changing political landscape. - And a fun tech twist: Imagine if Nvidia’s Jensen Huang had become TSMC CEO! A ‘no’ can sometimes shape history in amazing ways. Don't miss this episode of Technology and Electronics News. Packed with stories that matter most to the industry, from breakthrough innovations to the latest market shifts. Tune in now! #TechnologyNews #ElectronicsIndustry #Electronica2024 #TSMC #Semiconductor #Infineon #Innovation #PIXEurope #Podcast #Videocast #Sintecs #AI #PowerElectronics #CHIPSAct #TENews

News about semiconductors is everywhere right now. What are the trends driving the industry? Is the fab story really as rosy as it seems? What is the promise of 3D-IC? In this candid Q&A with ELE Times, Madhavi Rao talks about these trending topics and more. https://ow.ly/7WV850RlA0m #Cadence #ChipDesign #Innovation #ELETimes #Semiconductor

The big news from #Infineon Technologies this month was the announcement of its #300-mm gallium nitride (#GaN) #wafer technology using existing #silicon #manufacturing production lines. In a roundtable briefing this week at Infineon’s headquarters at Campeon, Germany (near Munich), the company told a group of trade media that this was a “game changing” achievement and that customers were already “pulling on us to learn more” in terms of its impact for AI applications. In the briefing, CEO Jochen Hanebeck and division president for power and sensor systems Adam White re-enforced the messages at launch (see “Infineon Advances GaN Technology with 300 mm Wafer Production”), referring it back to the broader decarbonization and digitalization themes that drive the company’s strategy. While the day at Infineon explored many other aspects of powering AI, both in data centers and automotive battery management systems, as well as the important topic of cybersecurity in AI, we can’t close this story without the excitement that White exudes when talking about the breakthrough of 300-mm GaN wafers. After his presentation to the trade media, he said he was jetting straight to Silicon Valley, where customers are “already pulling on us to understand what this can do in terms of impact for AI.” He emphasized that fully scaled 300-mm GaN production would contribute to GaN cost parity with silicon at RDS(on) level and that this would yield 2.3× as many chips per wafer compared with 200 mm. When asked about capacity, White said this will scale as a function of demand. He said the company expects samples toward the end of 2024 and commercial production probably in 2026. #IndustrialElectronics #SemiconductorElectronic #QualityAssurance #ElectronicComponentsDistributor #ElectronicsProducts #ObsoletePartsProcurement #icindustry #semiconductordevelopment #supplying #Capacitors #ICs #EmbeddedProcessors #Divider #Multiplier #WidebandSynthesizer #OutputRegulator #Microcontroller #CommunicationICs #Isolators #DisplayController #EectronicComponentsProcurement #BuyElectronicParts #ic #chip #semiconductor #supplying #distributor #electroniccomponentsdistributor #spot #ti #micron #tdk #nxp #xilink #intel #ADI #Alterla #military #auotmotive #ems #oem #odm #medical #communication #icchip #chips #electronics #components #purchasing #holt #vicor #altera #xilink #adi #ti

United Microelectronics Corporation (UMC) Q3 2024 Earnings: Steady Growth in Advanced Nodes and Specialty Processes Key Highlights: #Revenue rose 6.5% QoQ, driven by demand for 22/28nm technology and power management ICs. #Wafer Shipments: Increased 7.8% QoQ, lifting capacity utilization to 71%. - Networking/Communication: Revenue share climbed to 42%, with 28/22nm processes contributing 35% to revenue. - Outlook: Stable ASPs, industry recovery expected in 2025, led by #AI, 5G #EV demand. Swipe through for more on UMC’s performance and strategic initiatives. #UMC #earnings #semiconductors #research #insights #trends #technology

US GOV'T AWARDS $300M IN CHIPS ACT FUNDING TO THREE SEMICONDUCTOR R&D FACILITIES The US Department of Commerce and Natcast have awarded $300 million for three R&D facilities under the CHIPS and Science Act. These include an NSTC prototyping and advanced packaging facility, an administrative and design facility, and an Extreme Ultraviolet (EUV) center. The administrative facility will support advanced semiconductor research, aiming to be operational in 2025, while the EUV center is set for 2026, and the advanced packaging facility for 2028. This investment will address major challenges in microelectronics, spur innovation, and bolster the semiconductor workforce. Secretary Gina Raimondo emphasized the importance of these initiatives in reclaiming America’s semiconductor leadership. Thanks again to DatacenterDynamics for the full article with more background and insights click the source link in the comments below 💡 🙏👇 Visit International Semiconductor Executive Summits #Semiconductors #CHIPSAct #Innovation #R&D #TechNews

🎯 We did it again! Just recently we announced the world’s first 300mm #GaN power wafer.   Today the future of power semiconductor technology just got a whole lot thinner! Infineon Technologies is introducing the world's thinnest silicon power wafer, a game-changer in energy efficiency and performance!   Measuring only 20-micrometers in thickness this groundbreaking achievement marks a significant milestone in our mission to deliver outstanding customer value. By reducing wafer thickness, we've cut substrate resistance in half, enabling power loss reductions of over 15%!   But that's not all! This ultra-thin wafer technology is already qualified and released to customers, paving the way for various applications, including our Powering AI roadmap.   "With this technological masterpiece, we are solidifying our position as the industry's innovation leader by mastering all three relevant semiconductor materials: Si, SiC, and GaN," said our CEO.   Learn more at Electronica 2024, Nov 12-15 in Munich! https://scom.ly/V6z0LR0   #FollowInfineon #Silicon #Micrometers #TechnologyLeader #WePowerAI