ERS electronic GmbH’s Post

Fan-Out Panel-Level Packaging (#FOPLP) is gaining traction for its ability to deliver higher integration densities and cost savings. However, manufacturing challenges such as large panel handling, warpage, and yield issues have historically hindered its adoption. ERS electronic GmbH’s expertise in FOPLP manufacturing tools is helping address these challenges, offering solutions to improve large panel handling, reduce #warpage, and enhance overall process efficiency.

March Webinar #1 of 2: Electronics bonding is prevalent in more than smart watches and laptops. Electronics are incorporated into almost everything these days (appliances, offroad vehicles, smart home devices, signs/digital signage, gas pumps, vending machines/kiosks, anything IoT, power tools, boating/fishing electronics, lab equipment, anything HMI, medical devices, hospital equipment, farming equipment, and so much more). Whether your design and manufacturing teams span the US, North America, or the globe, if you’re interested in impact & water resistance, curved surfaces, heat resistance, clarity, adhesion to plastics and other challenging substrates, or miniaturization, we have you covered. Register below! Stick to Fit : Selecting the right bonding solution for your electronics design. Register for our next webinar with DigiKey! #3Mer #electronicsbonding #callyourfavorite3Mer

The advanced packaging industry is projected to reach $58.32 billion in 2029 from an estimated $42.13 billion in 2024. Between 2024 and 2029, the global advanced packaging market is expected to grow at a compound annual growth rate (CAGR) of 6.72%. The demand for advanced packaging is experiencing rapid growth due to the increasing requirement for electronic products across various industries to possess enhanced functionality and superior performance. This includes a variety of innovative packaging options created to meet the changing demands of end users and semiconductor makers. Click https://lnkd.in/ePf6nJJT to delve deeper into the advanced packaging industry. #AdvancedPackaging #PackagingTechnology #SemiconductorMarket #3DPackaging #HeterogeneousIntegration #InterconnectSolutions #FanOutWaferLevelPackaging #ThroughSiliconVias #TechInnovation #ElectronicsIndustry Intel Corporation Samsung Electronics TSMC GlobalFoundries Advanced Engineering & Elektronikmässan MitsubishiElectric Казахстан IBM Microntech Engineers Pvt. Ltd.

🚀 **Interview with ICT Senior Engineer Andy on Future Trends in the SMT Industry** I recently had the pleasure of interviewing Andy, a Senior Engineer at ICT, about his insights on the future trends in the Surface Mount Technology (SMT) industry. Andy highlighted several key areas to watch: 🔹 Automation & AI: Increased automation and the integration of artificial intelligence are expected to revolutionize production efficiency and accuracy. 🔹 Miniaturization: As devices become smaller, the demand for more compact and intricate SMT solutions will continue to grow. 🔹 Sustainability: Eco-friendly practices and materials are becoming crucial, with a strong push towards reducing waste and energy consumption. 🔹 Advanced Materials: The development and utilization of new materials that enhance performance and reliability. 🔹 5G & IoT: The expansion of 5G networks and IoT devices will drive innovation in SMT processes to meet higher performance requirements. Andy’s insights underscore the dynamic evolution of the SMT industry and the exciting opportunities that lie ahead. 🌟 #SMT #Technology #Innovation #FutureTrends #ICT #EngineeringExcellence

"Delve into the world of #embeddedsystems and #microelectronics, where tiny yet #powerful innovations are reshaping the future of technology and driving unprecedented advancements in the #electronicsindustry." Read this full article By Dr. Abhilasha Gaur Chief Executive Officer Electronics Sector Skills Council Of India (ESSCI). #electronicsnews #technologynews

Buckle up, tech enthusiasts! We’re about to dive into the #electrifying world of #embedded frontier technology in electronics – a realm where innovation meets #opportunity, and where the tiniest chips spark the grandest revolutions. Read this full article by: Dr. Abhilasha Gaur, Chief Executive Officer, Electronics Sector Skills Council Of India (ESSCI). #powerelectronics #powermanagement #powersemiconductor

Miniaturization has been an ongoing process for millennia—reducing size and weight without sacrificing functionality. This process continues today with modern electronic devices, from bulky tubes and transformers to solid-state circuitry and switching power supplies. Learn more about the #miniaturization trend with featured products and content from Molex.

STMicroelectronics has introduced a groundbreaking two-in-one #memorysolution with Page EEPROM, designed to #enhance smart edge applications. This #innovative #memorytechnology boosts #efficiency and performance, paving the way for advanced #IoTdevices and smarter #edgecomputing solutions in various industries. #electronicsnews #technologynews

Traditional semiconductors take many months, if not longer, to go from final design stage – known as tape-out – to delivery. In contrast FlexICs can be delivered in as little as up to four weeks. This has a tremendous positive impact on the speed of innovation; rather than adhering to ‘right-first-time’ workflows, designers can take advantage of rapid cycle times to amend and refine designs on the fly, iterating to achieve optimal performance.   Discover how Pragmatic's flexible integrated circuits (FlexICs) will make the Internet of Everything a reality, hearing from our SVP Manufacturing & Operations Shane Geary.   Read it here: https://lnkd.in/enTUZpat   #pragmatic #semiconductor #flexics #manufacturing #foundry

STMicroelectronics Maintains Top Spot with 32.6% Market, onsemi Rises to Second Place in 2023 Revenue Ranking for #SiC Power Devices, Says TrendForce Corporation 💡 TrendForce 集邦科技 reports that the SiC power devices industry maintained strong growth in 2023, driven by the application of #BEVs. The top five suppliers accounted for approximately 91.9% of total revenue; ST lead the pack with a 32.6% market share while onsemi rose from fourth place in 2022 to second place. TrendForce’s analysis indicates that demand from #AI #servers and other fields will significantly increase in 2024. However, the noticeable slowdown in the sales growth of BEVs and weakening #industrial demand are affecting the SiC #supplychain. It is expected that the annual growth rate of industry revenue for SiC power devices will significantly decelerate in 2024 compared to previous years. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ePiyY-nw #semiconductorindustry #semiconductors #semiconductor #technology #semiconductormanufacturing #innovation #automotiveindustry #chip #chips #geopolitics #batterytechnology #battery #electricvehicles #evs